JP6601512B2 - ヒートシンク付きパワーモジュール用基板及びパワーモジュール - Google Patents

ヒートシンク付きパワーモジュール用基板及びパワーモジュール Download PDF

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Publication number
JP6601512B2
JP6601512B2 JP2018009313A JP2018009313A JP6601512B2 JP 6601512 B2 JP6601512 B2 JP 6601512B2 JP 2018009313 A JP2018009313 A JP 2018009313A JP 2018009313 A JP2018009313 A JP 2018009313A JP 6601512 B2 JP6601512 B2 JP 6601512B2
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Prior art keywords
heat sink
layer
power module
heat
radiation side
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JP2018009313A
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English (en)
Japanese (ja)
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JP2019129208A (ja
JP2019129208A5 (2
Inventor
智哉 大開
宗太郎 大井
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority to JP2018009313A priority Critical patent/JP6601512B2/ja
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to KR1020207020962A priority patent/KR102387210B1/ko
Priority to US16/963,667 priority patent/US11355415B2/en
Priority to PCT/JP2019/002076 priority patent/WO2019146640A1/ja
Priority to EP19743122.4A priority patent/EP3745453B1/en
Priority to CN201980007458.0A priority patent/CN111602238B/zh
Priority to TW108102677A priority patent/TWI758579B/zh
Publication of JP2019129208A publication Critical patent/JP2019129208A/ja
Publication of JP2019129208A5 publication Critical patent/JP2019129208A5/ja
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Publication of JP6601512B2 publication Critical patent/JP6601512B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/121—Metallic interlayers based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/16—Silicon interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
JP2018009313A 2018-01-24 2018-01-24 ヒートシンク付きパワーモジュール用基板及びパワーモジュール Active JP6601512B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2018009313A JP6601512B2 (ja) 2018-01-24 2018-01-24 ヒートシンク付きパワーモジュール用基板及びパワーモジュール
US16/963,667 US11355415B2 (en) 2018-01-24 2019-01-23 Heat sink-attached power module substrate board and power module
PCT/JP2019/002076 WO2019146640A1 (ja) 2018-01-24 2019-01-23 ヒートシンク付きパワーモジュール用基板及びパワーモジュール
EP19743122.4A EP3745453B1 (en) 2018-01-24 2019-01-23 Substrate for power module with heat sink, and power module
KR1020207020962A KR102387210B1 (ko) 2018-01-24 2019-01-23 히트 싱크 부착 파워 모듈용 기판 및 파워 모듈
CN201980007458.0A CN111602238B (zh) 2018-01-24 2019-01-23 带散热片的功率模块用基板及功率模块
TW108102677A TWI758579B (zh) 2018-01-24 2019-01-24 附散熱座功率模組用基板及功率模組

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018009313A JP6601512B2 (ja) 2018-01-24 2018-01-24 ヒートシンク付きパワーモジュール用基板及びパワーモジュール

Publications (3)

Publication Number Publication Date
JP2019129208A JP2019129208A (ja) 2019-08-01
JP2019129208A5 JP2019129208A5 (2) 2019-09-12
JP6601512B2 true JP6601512B2 (ja) 2019-11-06

Family

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JP2018009313A Active JP6601512B2 (ja) 2018-01-24 2018-01-24 ヒートシンク付きパワーモジュール用基板及びパワーモジュール

Country Status (7)

Country Link
US (1) US11355415B2 (2)
EP (1) EP3745453B1 (2)
JP (1) JP6601512B2 (2)
KR (1) KR102387210B1 (2)
CN (1) CN111602238B (2)
TW (1) TWI758579B (2)
WO (1) WO2019146640A1 (2)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021061341A (ja) * 2019-10-08 2021-04-15 昭和電工株式会社 半導体冷却装置
JP7487533B2 (ja) 2020-04-02 2024-05-21 富士電機株式会社 半導体モジュールおよび車両
JPWO2023032462A1 (2) * 2021-09-02 2023-03-09
DE102021212232A1 (de) * 2021-10-29 2023-05-04 Zf Friedrichshafen Ag Leistungsmodul und verfahren zum montieren eines leistungsmoduls
DE102022207525A1 (de) 2022-07-22 2024-01-25 Vitesco Technologies Germany Gmbh Leistungsmodul und Verfahren zur Herstellung desselben, Stromrichter mit einem Leistungsmodul
TWI811136B (zh) * 2022-10-17 2023-08-01 創世電股份有限公司 半導體功率元件
TWI836729B (zh) * 2022-11-16 2024-03-21 財團法人工業技術研究院 陶瓷電路板結構及功率模組
WO2025027845A1 (ja) * 2023-08-03 2025-02-06 三菱電機株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078086A (ja) 2001-09-04 2003-03-14 Kubota Corp 半導体素子モジュール基板の積層構造
JP5403129B2 (ja) 2012-03-30 2014-01-29 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、及びパワーモジュール用基板の製造方法
CN105189109B (zh) * 2013-03-14 2017-04-05 三菱综合材料株式会社 接合体、功率模块用基板及自带散热器的功率模块用基板
JP6621076B2 (ja) * 2013-03-29 2019-12-18 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板及びパワーモジュール
KR102232098B1 (ko) * 2013-10-10 2021-03-24 미쓰비시 마테리알 가부시키가이샤 히트 싱크가 부착된 파워 모듈용 기판 및 그 제조 방법
JP6384112B2 (ja) 2014-04-25 2018-09-05 三菱マテリアル株式会社 パワーモジュール用基板及びヒートシンク付パワーモジュール用基板
CN106165090B (zh) 2014-04-25 2020-07-03 三菱综合材料株式会社 功率模块用基板单元及功率模块
CN106463477B (zh) * 2014-07-04 2019-03-12 三菱综合材料株式会社 功率模块用基板单元及功率模块
US9837363B2 (en) * 2014-07-04 2017-12-05 Mitsubishi Materials Corporation Power-module substrate unit and power module
JP6435711B2 (ja) * 2014-08-21 2018-12-12 三菱マテリアル株式会社 放熱板付パワーモジュール用基板及びパワーモジュール
JP6435945B2 (ja) * 2015-03-23 2018-12-12 三菱マテリアル株式会社 ヒートシンク付きパワーモジュール用基板
JP6638284B2 (ja) * 2015-09-28 2020-01-29 三菱マテリアル株式会社 放熱板付パワーモジュール用基板及びパワーモジュール
JP6137267B2 (ja) 2015-10-08 2017-05-31 三菱マテリアル株式会社 ヒートシンク付きパワーモジュール用基板及びパワーモジュール
JP6647164B2 (ja) 2016-07-12 2020-02-14 鹿島建設株式会社 地盤改良工法及び地盤改良用プレキャスト地盤の製造方法

Also Published As

Publication number Publication date
KR102387210B1 (ko) 2022-04-14
CN111602238B (zh) 2023-11-10
CN111602238A (zh) 2020-08-28
TWI758579B (zh) 2022-03-21
JP2019129208A (ja) 2019-08-01
TW201933560A (zh) 2019-08-16
US11355415B2 (en) 2022-06-07
EP3745453A1 (en) 2020-12-02
US20210074607A1 (en) 2021-03-11
EP3745453B1 (en) 2022-09-21
WO2019146640A1 (ja) 2019-08-01
KR20200112845A (ko) 2020-10-05
EP3745453A4 (en) 2021-10-27

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