JP6673352B2 - 金属ナノ微粒子製造用組成物 - Google Patents

金属ナノ微粒子製造用組成物 Download PDF

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Publication number
JP6673352B2
JP6673352B2 JP2017525210A JP2017525210A JP6673352B2 JP 6673352 B2 JP6673352 B2 JP 6673352B2 JP 2017525210 A JP2017525210 A JP 2017525210A JP 2017525210 A JP2017525210 A JP 2017525210A JP 6673352 B2 JP6673352 B2 JP 6673352B2
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Japan
Prior art keywords
acid
metal nanoparticles
metal
hydroxy
composition
Prior art date
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JP2017525210A
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English (en)
Japanese (ja)
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JPWO2016204105A1 (ja
Inventor
謙輔 川村
謙輔 川村
崇充 森
崇充 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Soda Co Ltd
Original Assignee
Osaka Soda Co Ltd
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Publication date
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Publication of JPWO2016204105A1 publication Critical patent/JPWO2016204105A1/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
JP2017525210A 2015-06-15 2016-06-13 金属ナノ微粒子製造用組成物 Active JP6673352B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015120304 2015-06-15
JP2015120304 2015-06-15
PCT/JP2016/067485 WO2016204105A1 (fr) 2015-06-15 2016-06-13 Composition pour la fabrication de nanoparticules métalliques

Publications (2)

Publication Number Publication Date
JPWO2016204105A1 JPWO2016204105A1 (ja) 2018-03-29
JP6673352B2 true JP6673352B2 (ja) 2020-03-25

Family

ID=57545305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017525210A Active JP6673352B2 (ja) 2015-06-15 2016-06-13 金属ナノ微粒子製造用組成物

Country Status (5)

Country Link
JP (1) JP6673352B2 (fr)
KR (1) KR20180018485A (fr)
CN (1) CN107614164A (fr)
TW (1) TWI702262B (fr)
WO (1) WO2016204105A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018154806A (ja) * 2017-03-15 2018-10-04 Dic株式会社 金属微粒子分散体、導電性インク、および電子デバイス
WO2018168004A1 (fr) * 2017-03-15 2018-09-20 Dic株式会社 Dispersion de particules fines de métal, encre conductrice et dispositif électronique
JP6939015B2 (ja) * 2017-03-29 2021-09-22 住友金属鉱山株式会社 積層セラミックコンデンサ内部電極用のグラビア印刷用導電性ペースト
TWI889645B (zh) * 2017-08-03 2025-07-11 美商電子墨水股份有限公司 包含金之導電墨水組成物及用於製造其之方法
JP7257738B2 (ja) * 2017-10-10 2023-04-14 Dic株式会社 オフセット印刷用金属微粒子インク
JP2019108593A (ja) * 2017-12-19 2019-07-04 Dic株式会社 銀微粒子分散体の製造方法
JP7120314B2 (ja) * 2018-09-03 2022-08-17 株式会社大阪ソーダ 銀ナノ粒子
JPWO2022176809A1 (fr) 2021-02-18 2022-08-25

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009097074A (ja) * 2007-09-27 2009-05-07 Mitsuboshi Belting Ltd 金属ナノ粒子ペーストおよびパターン形成方法
JP2009270146A (ja) * 2008-05-02 2009-11-19 Shoei Chem Ind Co 銀超微粒子の製造方法
KR101681046B1 (ko) * 2009-11-26 2016-11-30 주식회사 동진쎄미켐 입자를 형성하지 않는 전도성 잉크 조성물 및 이의 제조방법
KR101700615B1 (ko) * 2010-03-30 2017-01-31 주식회사 동진쎄미켐 금속 나노입자의 제조방법, 이에 의해 제조된 금속 나노입자 및 이를 포함하는 금속 잉크 조성물
JP5311147B2 (ja) * 2010-08-25 2013-10-09 株式会社豊田中央研究所 表面被覆金属ナノ粒子、その製造方法、およびそれを含む金属ナノ粒子ペースト
JP2012251222A (ja) * 2011-06-03 2012-12-20 Tokyo Printing Ink Mfg Co Ltd 銀ナノ粒子の製造方法およびインク
EP2907602B1 (fr) * 2012-10-12 2019-07-31 Bando Chemical Industries, Ltd. Composition de dispersion liquide de liaison
JP6140189B2 (ja) * 2012-11-30 2017-05-31 ナミックス株式会社 導電ペースト及びその製造方法
JP2013151753A (ja) * 2013-03-04 2013-08-08 Dowa Electronics Materials Co Ltd 極性媒体との親和性に優れた銀微粉および銀インク
JP6220966B2 (ja) * 2015-04-17 2017-10-25 バンドー化学株式会社 銀微粒子組成物

Also Published As

Publication number Publication date
JPWO2016204105A1 (ja) 2018-03-29
KR20180018485A (ko) 2018-02-21
TW201710416A (zh) 2017-03-16
WO2016204105A1 (fr) 2016-12-22
CN107614164A (zh) 2018-01-19
TWI702262B (zh) 2020-08-21

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