JP6736404B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP6736404B2 JP6736404B2 JP2016145924A JP2016145924A JP6736404B2 JP 6736404 B2 JP6736404 B2 JP 6736404B2 JP 2016145924 A JP2016145924 A JP 2016145924A JP 2016145924 A JP2016145924 A JP 2016145924A JP 6736404 B2 JP6736404 B2 JP 6736404B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- support
- grinding
- wafer
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/10—Arrangements for cooling or lubricating tools or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
24 保持テーブル
26 支持テーブル
90 回転手段
25 枠体
52 (移動)基台
71、74 支持柱
71c、74c 貫通孔
60 エア供給源
73a、74b 供給口
72a、77a 排気口
W ウエーハ
Claims (2)
- ウエーハを保持する保持手段と、該保持手段で保持したウエーハを研削砥石で研削する研削手段とを備える研削装置であって、
該保持手段は、ウエーハを保持する保持テーブルと、該保持テーブルを支持する支持テーブルと、該支持テーブルを回転させる回転手段と、該支持テーブルを回転可能に支持する枠体と、該基台から該枠体を支持する少なくとも3つの支持柱とを備え、
該支持柱は、下端を該基台に接続し上端を該枠体に接続して、内部を貫通する貫通孔と、該下端側に配設し該貫通孔とエア供給源とを連通する供給口と、該上端側に配設し該貫通孔を流れたエアを該支持テーブルに向かって排気する排気口とを備え、
該貫通孔にエアを流して該支持柱を冷却するとともに、該貫通孔を流れたエアを該支持テーブルに向かって排気し該支持テーブルを冷却して該支持柱と該支持テーブルとの熱変形を防止する研削装置。 - 該3つの支持柱のうち少なくとも1つの支持柱は、該枠体と該基台との距離を調節する調節機構を備え、
該調節機構は、該基台の上面から垂下する方向で上端から垂下する第1の雌ネジ孔を備えて該基台に配設されるベース部と、該第1の雌ネジ孔に螺入する第1の雄ネジが下端に形成されると共に、該第1の雌ネジ孔とは異なるネジピッチで該第1の雌ネジ孔の延在方向と平行に延在し該枠体を貫通する第2の雌ネジ孔に螺入する第2の雄ネジが上端に形成されて、該基台と該枠体とを連結させるネジ柱とを備え、該調節機構の延在方向に内部を貫通する貫通孔が形成され、該供給口は該調節機構の下端側で該貫通孔とエア供給源とを連通し、該排気口は該調節機構の上端側で該貫通孔を流れたエアを該支持テーブルに向かって排気し、
該貫通孔にエアを流して該ネジ柱を冷却するとともに、該貫通孔を流れたエアを該支持テーブルに向かって排気し該支持テーブルを冷却して該ネジ柱と該支持テーブルとの熱変形を防止する請求項1記載の研削装置。
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016145924A JP6736404B2 (ja) | 2016-07-26 | 2016-07-26 | 研削装置 |
| TW106119315A TWI726113B (zh) | 2016-07-26 | 2017-06-09 | 磨削裝置 |
| KR1020170085823A KR102240210B1 (ko) | 2016-07-26 | 2017-07-06 | 연삭 장치 |
| MYPI2017702525A MY184581A (en) | 2016-07-26 | 2017-07-10 | Grinding apparatus |
| CN201710595270.5A CN107650010B (zh) | 2016-07-26 | 2017-07-20 | 磨削装置 |
| DE102017212651.5A DE102017212651B4 (de) | 2016-07-26 | 2017-07-24 | Schleifvorrichtung |
| US15/657,963 US10639764B2 (en) | 2016-07-26 | 2017-07-24 | Grinding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016145924A JP6736404B2 (ja) | 2016-07-26 | 2016-07-26 | 研削装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018015823A JP2018015823A (ja) | 2018-02-01 |
| JP6736404B2 true JP6736404B2 (ja) | 2020-08-05 |
Family
ID=61012338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016145924A Active JP6736404B2 (ja) | 2016-07-26 | 2016-07-26 | 研削装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10639764B2 (ja) |
| JP (1) | JP6736404B2 (ja) |
| KR (1) | KR102240210B1 (ja) |
| CN (1) | CN107650010B (ja) |
| DE (1) | DE102017212651B4 (ja) |
| MY (1) | MY184581A (ja) |
| TW (1) | TWI726113B (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020196100A (ja) * | 2019-06-04 | 2020-12-10 | 株式会社ディスコ | 圧電アクチュエータで構成したチャックテーブル傾き調整機構 |
| JP7393977B2 (ja) * | 2020-03-02 | 2023-12-07 | 株式会社ディスコ | 微調整ネジおよび加工装置 |
| CN112059884B (zh) * | 2020-09-19 | 2021-09-28 | 陶正云 | 一种玻化砖及其加工方法与加工系统 |
| CN112643472A (zh) * | 2021-01-13 | 2021-04-13 | 江阴市嘉润机械配件有限公司 | 一种用于车架总成加工的成型装置 |
| JP7845927B2 (ja) * | 2022-06-20 | 2026-04-14 | 株式会社ディスコ | 研削装置 |
| CN115816155A (zh) * | 2022-11-09 | 2023-03-21 | 深圳市爱贝科精密工业股份有限公司 | 一种主轴的中心出水机构 |
| CN116652819B (zh) * | 2023-05-17 | 2025-09-12 | 深圳市易天自动化设备股份有限公司 | 玻璃研磨平台 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2198282A (en) * | 1938-04-08 | 1940-04-23 | Elisha W Hall | Abrading or polishing tool |
| US2410812A (en) * | 1945-06-30 | 1946-11-12 | Walter J Jacobsen | Support for abrasive disks |
| DE2416654C3 (de) * | 1974-04-05 | 1980-09-04 | De Forenede Bryggerier A/S, Kopenhagen | Mahlscheibe für Scheibenmühlen |
| JPS60114431A (ja) * | 1983-11-21 | 1985-06-20 | Agency Of Ind Science & Technol | 工作機械用フレ−ム |
| DE3633530A1 (de) * | 1986-10-02 | 1988-04-14 | Thielenhaus Maschf | Vorrichtung fuer die umsetzung von druckluft-arbeitsimpulsen in hydraulische arbeitsimpulse bei schleifmaschinen, insbes. feinschleifmaschinen |
| US4857694A (en) * | 1988-05-06 | 1989-08-15 | The Babcock & Wilcox Company | Method and apparatus for automatic vapor cooling when shape melting a component |
| JPH0890376A (ja) * | 1994-09-20 | 1996-04-09 | Disco Abrasive Syst Ltd | 位置調整ユニット及びそれを用いた研削装置 |
| US6113702A (en) * | 1995-09-01 | 2000-09-05 | Asm America, Inc. | Wafer support system |
| SG70097A1 (en) * | 1997-08-15 | 2000-01-25 | Disio Corp | Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface |
| JP2000006018A (ja) | 1998-06-23 | 2000-01-11 | Disco Abrasive Syst Ltd | 研削装置 |
| EP1238755B1 (en) * | 1999-06-15 | 2010-11-10 | Ibiden Co., Ltd. | Table of wafer polisher, method of polishing wafer, and method of manufacturing semiconductor wafer |
| US6358119B1 (en) * | 1999-06-21 | 2002-03-19 | Taiwan Semiconductor Manufacturing Company | Way to remove CU line damage after CU CMP |
| US8062098B2 (en) * | 2000-11-17 | 2011-11-22 | Duescher Wayne O | High speed flat lapping platen |
| JP2002239857A (ja) * | 2001-02-13 | 2002-08-28 | Makino Milling Mach Co Ltd | 熱変形抑制機能を備えた工作機械 |
| JP4489320B2 (ja) * | 2001-04-27 | 2010-06-23 | 不二越機械工業株式会社 | 研磨装置 |
| JP4617028B2 (ja) * | 2001-08-17 | 2011-01-19 | 株式会社ディスコ | 加工歪除去装置 |
| JP2003231031A (ja) * | 2001-12-07 | 2003-08-19 | Tom Miyano Toshiharu | 工作機械アッセンブリ、基台と工作機械アッセンブリの組合せ及び工作機械アッセンブリモジュール |
| JP2004235250A (ja) * | 2003-01-28 | 2004-08-19 | Disco Abrasive Syst Ltd | 切削装置 |
| JP2005254403A (ja) * | 2004-03-12 | 2005-09-22 | Seiko Epson Corp | 研磨装置 |
| CN101437651B (zh) * | 2006-03-16 | 2012-09-26 | 专业工具制造有限责任公司 | 磨削切割工具的装置和方法 |
| US20070227901A1 (en) * | 2006-03-30 | 2007-10-04 | Applied Materials, Inc. | Temperature control for ECMP process |
| JP4616802B2 (ja) | 2006-06-28 | 2011-01-19 | 株式会社三共 | スロットマシン |
| TWI300375B (en) * | 2006-12-29 | 2008-09-01 | Hiwin Tech Corp | Cooling device of ball screw |
| JP2009043931A (ja) | 2007-08-08 | 2009-02-26 | Disco Abrasive Syst Ltd | ウェーハの裏面研削方法 |
| KR100923268B1 (ko) * | 2007-08-29 | 2009-10-23 | 세메스 주식회사 | 매엽식 기판 처리 장치 및 기판 처리 장치의 세정 방법 |
| JP2009070896A (ja) * | 2007-09-11 | 2009-04-02 | Bon Koatsu Kogyo Kk | 薄板材貼付装置および薄板材貼付方法 |
| JP5184910B2 (ja) * | 2008-02-13 | 2013-04-17 | 株式会社岡本工作機械製作所 | 基板の平面研削装置 |
| JP5424864B2 (ja) * | 2009-12-28 | 2014-02-26 | 株式会社ディスコ | 加工装置 |
| GB2482345A (en) * | 2010-07-30 | 2012-02-01 | Vestas Wind Sys As | Tapering an edge of a fibrous reinforcement sheet using a rotary tool |
| JP2012148376A (ja) * | 2011-01-20 | 2012-08-09 | Ebara Corp | 研磨方法及び研磨装置 |
| JP5755979B2 (ja) * | 2011-09-08 | 2015-07-29 | 株式会社ディスコ | バイト工具を備えた加工装置 |
| JP6140457B2 (ja) * | 2013-01-21 | 2017-05-31 | 東京エレクトロン株式会社 | 接着方法、載置台及び基板処理装置 |
| CN106716604A (zh) * | 2014-10-09 | 2017-05-24 | 应用材料公司 | 具有内部通道的化学机械研磨垫 |
| JP6444717B2 (ja) * | 2014-12-12 | 2018-12-26 | Towa株式会社 | 切断装置及び切断方法 |
| TWM513085U (zh) * | 2015-03-06 | 2015-12-01 | Zheng-Xiong Qiu | 超音波砂輪機 |
-
2016
- 2016-07-26 JP JP2016145924A patent/JP6736404B2/ja active Active
-
2017
- 2017-06-09 TW TW106119315A patent/TWI726113B/zh active
- 2017-07-06 KR KR1020170085823A patent/KR102240210B1/ko active Active
- 2017-07-10 MY MYPI2017702525A patent/MY184581A/en unknown
- 2017-07-20 CN CN201710595270.5A patent/CN107650010B/zh active Active
- 2017-07-24 DE DE102017212651.5A patent/DE102017212651B4/de active Active
- 2017-07-24 US US15/657,963 patent/US10639764B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018015823A (ja) | 2018-02-01 |
| US10639764B2 (en) | 2020-05-05 |
| KR20180012200A (ko) | 2018-02-05 |
| CN107650010A (zh) | 2018-02-02 |
| US20180029187A1 (en) | 2018-02-01 |
| TW201811505A (zh) | 2018-04-01 |
| DE102017212651A1 (de) | 2018-02-15 |
| DE102017212651B4 (de) | 2024-08-01 |
| MY184581A (en) | 2021-04-06 |
| CN107650010B (zh) | 2021-03-26 |
| KR102240210B1 (ko) | 2021-04-13 |
| TWI726113B (zh) | 2021-05-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6736404B2 (ja) | 研削装置 | |
| TWI710427B (zh) | 磨削輪及被加工物的磨削方法 | |
| JP7701191B2 (ja) | ウェーハの加工方法 | |
| TW201808528A (zh) | 研磨裝置 | |
| JP6732382B2 (ja) | 加工装置及び被加工物の加工方法 | |
| JP5632215B2 (ja) | 研削加工ツール | |
| JP5947605B2 (ja) | ノズル調整治具 | |
| JP6736367B2 (ja) | スピンドルユニット | |
| TWI668751B (zh) | Grinding method of workpiece | |
| JP2018015825A (ja) | 加工装置 | |
| JP7171128B2 (ja) | 研削装置 | |
| JP2016132071A (ja) | 研削装置 | |
| KR102662485B1 (ko) | 연삭 장치 | |
| JP6008548B2 (ja) | ノズル調整治具 | |
| JP2012016770A (ja) | 研削方法および研削装置 | |
| TWI788575B (zh) | 加工設備 | |
| JP2022094577A (ja) | チップの製造方法 | |
| JP6765267B2 (ja) | 研磨ユニット | |
| JP6800689B2 (ja) | チャックテーブル機構 | |
| JP2018027588A (ja) | 研削装置のアイドリング方法 | |
| JP7638605B2 (ja) | 保持テーブルの整形方法 | |
| JP7642293B2 (ja) | 加工装置 | |
| JP6345981B2 (ja) | 支持治具 | |
| JP7596035B2 (ja) | 単結晶炭化珪素基板の加工方法 | |
| TWI916532B (zh) | 磨削方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190523 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200528 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200616 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200715 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6736404 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |