JP6783374B2 - 可変ビーム形状を有するレーザを利用する材料処理 - Google Patents

可変ビーム形状を有するレーザを利用する材料処理 Download PDF

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Publication number
JP6783374B2
JP6783374B2 JP2019501655A JP2019501655A JP6783374B2 JP 6783374 B2 JP6783374 B2 JP 6783374B2 JP 2019501655 A JP2019501655 A JP 2019501655A JP 2019501655 A JP2019501655 A JP 2019501655A JP 6783374 B2 JP6783374 B2 JP 6783374B2
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JP
Japan
Prior art keywords
workpiece
laser
laser output
output beam
optical element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2019501655A
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English (en)
Japanese (ja)
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JP2019523137A (ja
Inventor
パービッツ タエバティ，
パービッツ タエバティ，
フランシスコ ヴィラリアル−ソーセド，
フランシスコ ヴィラリアル−ソーセド，
ワン−ロン ジョウ，
ワン−ロン ジョウ，
ビエン チャン，
ビエン チャン，
ロビン ファン，
ロビン ファン，
Original Assignee
テラダイオード， インコーポレーテッド
テラダイオード， インコーポレーテッド
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Filing date
Publication date
Priority claimed from US15/261,096 external-priority patent/US11204506B2/en
Application filed by テラダイオード， インコーポレーテッド, テラダイオード， インコーポレーテッド filed Critical テラダイオード， インコーポレーテッド
Publication of JP2019523137A publication Critical patent/JP2019523137A/ja
Application granted granted Critical
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0734—Shaping the laser spot into an annular shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3083—Birefringent or phase retarding elements

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
JP2019501655A 2016-07-15 2017-07-14 可変ビーム形状を有するレーザを利用する材料処理 Expired - Fee Related JP6783374B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662362824P 2016-07-15 2016-07-15
US62/362,824 2016-07-15
US15/261,096 2016-09-09
US15/261,096 US11204506B2 (en) 2014-03-05 2016-09-09 Polarization-adjusted and shape-adjusted beam operation for materials processing
PCT/US2017/042089 WO2018013901A2 (fr) 2016-07-15 2017-07-14 Traitement de matériau mettant en oeuvre un laser doté d'une forme de faisceau variable

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020176654A Division JP7098696B2 (ja) 2016-07-15 2020-10-21 可変ビーム形状を有するレーザを利用する材料処理

Publications (2)

Publication Number Publication Date
JP2019523137A JP2019523137A (ja) 2019-08-22
JP6783374B2 true JP6783374B2 (ja) 2020-11-11

Family

ID=60953351

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019501655A Expired - Fee Related JP6783374B2 (ja) 2016-07-15 2017-07-14 可変ビーム形状を有するレーザを利用する材料処理
JP2020176654A Expired - Fee Related JP7098696B2 (ja) 2016-07-15 2020-10-21 可変ビーム形状を有するレーザを利用する材料処理

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020176654A Expired - Fee Related JP7098696B2 (ja) 2016-07-15 2020-10-21 可変ビーム形状を有するレーザを利用する材料処理

Country Status (4)

Country Link
JP (2) JP6783374B2 (fr)
CN (1) CN109791303A (fr)
DE (1) DE112017003592T5 (fr)
WO (1) WO2018013901A2 (fr)

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DE102019108837A1 (de) * 2019-04-04 2020-10-08 Baosteel Tailored Blanks Gmbh Verfahren zum Schmelzschweißen eines oder mehrerer Stahlbleche aus presshärtbarem Stahl
CN110614446A (zh) * 2019-09-24 2019-12-27 上海精测半导体技术有限公司 一种切割设备及切割方法
WO2022003858A1 (fr) * 2020-07-01 2022-01-06 日本電信電話株式会社 Dispositif de traitement au laser
CN114603250A (zh) * 2020-12-08 2022-06-10 通快机床两合公司 激光束调节装置、激光束发射系统、激光切割机以及方法
CN114633018A (zh) * 2020-12-16 2022-06-17 阳程科技股份有限公司 使用于光轴倾斜加工的光学透镜模块
JP7768757B2 (ja) * 2021-12-24 2025-11-12 株式会社ディスコ 面処理装置
US20250244596A1 (en) * 2024-01-29 2025-07-31 Raytheon Company Beam divergence control without creation of boresight or other errors

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US6208679B1 (en) 1998-09-08 2001-03-27 Massachusetts Institute Of Technology High-power multi-wavelength external cavity laser
US6469275B2 (en) * 1999-01-20 2002-10-22 Lsp Technologies, Inc Oblique angle laser shock processing
ES2149637T3 (es) * 1999-01-28 2000-11-01 Leister Process Tech Procedimiento de ensamblaje por laser y dispositivo para unir distintas piezas de plastico o plastico con otros materiales.
JP2000263257A (ja) * 1999-03-15 2000-09-26 Hitachi Cable Ltd 非金属材料のレーザによる割断方法及びその装置
JP3722731B2 (ja) 2000-09-13 2005-11-30 浜松ホトニクス株式会社 レーザ加工方法
US7164152B2 (en) * 2003-09-16 2007-01-16 The Trustees Of Columbia University In The City Of New York Laser-irradiated thin films having variable thickness
JP2005230834A (ja) * 2004-02-18 2005-09-02 Campus Create Co Ltd レーザ光を用いた加工方法および加工装置
JP4350558B2 (ja) 2004-03-09 2009-10-21 三菱電機株式会社 レーザビーム光学系およびレーザ加工装置
JP2005314198A (ja) * 2004-04-26 2005-11-10 Lemi Ltd ガラス割断用レーザ装置
JP2006061954A (ja) * 2004-08-27 2006-03-09 Sony Corp 基板加工装置および基板加工方法
JP4753048B2 (ja) * 2007-04-16 2011-08-17 トヨタ自動車株式会社 重ね合わせワークのレーザ溶接方法
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Also Published As

Publication number Publication date
JP7098696B2 (ja) 2022-07-11
JP2019523137A (ja) 2019-08-22
JP2021007985A (ja) 2021-01-28
WO2018013901A3 (fr) 2018-07-26
DE112017003592T5 (de) 2019-03-28
WO2018013901A2 (fr) 2018-01-18
CN109791303A (zh) 2019-05-21

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