JP7128310B2 - ポリアミドイミドフィルムの製造方法 - Google Patents
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- B29C39/22—Component parts, details or accessories; Auxiliary operations
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- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
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- C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
- C08G79/08—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule a linkage containing boron
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- C—CHEMISTRY; METALLURGY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/136—Phenols containing halogens
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
- B29K2079/08—PI, i.e. polyimides or derivatives thereof
- B29K2079/085—Thermoplastic polyimides, e.g. polyesterimides, PEI, i.e. polyetherimides, or polyamideimides; Derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
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Description
実施形態の効果は、以上で言及した効果に限定されない。実施形態の効果は、以下の説明において推論可能なすべての効果を含むものと理解されるべきである。
前記ポリアミドイミド重合体が形成されるために、まず、ポリアミック酸が調製され得る。
次いで、前記ポリアミック酸は、脱水反応によりポリイミドに転換され得、前記ポリイミドはイミド(imide)繰り返し単位を含む。
例えば、前記ポリイミドは、下記化学式3で表される化合物を含み得るが、これに限定されるものではない。
前記のポリアミック酸溶液に前記芳香族ジカルボニル化合物が添加され反応するとき、前記反応系の粘度が所望の粘度まで上昇するまで、前記芳香族ジカルボニル化合物が添加される。
前記乾燥工程は、約80℃~約150℃の温度で、約5分~約15分間行える。
さらにより詳しく、一実施形態によるポリアミドイミドフィルムは、前記の基準に、透過度が89%以上、ヘイズが1%未満、黄色度が4以下であり得る。
さらにより詳しく、一実施形態によるポリアミドイミドフィルムは、透過度が89%以上、ヘイズが0.5%以下、黄色度が3以下であり得る。
[発明を実施するための形態]
(実施例1)
(実施例2~実施例4および比較例1~比較例5)
(比較例6)
乾燥したポリアミドイミド重合物をガラス板から剥離した後、ピンフレームに固定して、窒素パージ条件、すなわち、窒素(N2)99体積%以上、酸素(O2)を1体積%以下で含む雰囲気下で熱処理した。具体的に、前記熱処理は、80℃~300℃の温度範囲で2℃/minの速度で昇温させながら行い、その結果、厚さ30μmのポリアミドイミドフィルムを得た。
(比較例7)
(1)表面硬度測定
(2)透過度(TT)およびヘイズ(HZ)
(3)黄色度(YI)
(4)引張強度(modulus)
(5)収率
Claims (8)
- 溶媒中に芳香族ジアミン(aromatic diamine)、芳香族ジアンヒドリド(aromatic dianhydride)および芳香族ジカルボニル(aromatic dicarbonyl compound)化合物を含む単量体を順次に重合してポリアミドイミド重合体溶液を調製する段階と、
前記ポリアミドイミド重合体溶液を、別途の沈殿、乾燥および再溶解の過程なしにそのまま注型体にキャスティングして、ゲルシートを製造する段階と、
前記ゲルシートに含まれている溶媒を除去し、窒素(N2)65体積%~85体積%および酸素(O2)15体積%~35体積%を含む雰囲気下において、前記ゲルシートを熱処理して、ポリアミドイミドフィルムを製造する段階とを含む、ポリアミドイミドフィルムの製造方法であって、
前記ポリアミドイミドフィルムの黄色度は5以下であり、
前記ポリアミドイミドフィルムの透過度が88%以上であり、
前記ポリアミドイミドフィルムのヘイズが2%以下であり、
前記ポリアミドイミドフィルムのモジュラスは5GPa以上であり、
前記芳香族ジアミンは、2,2'-ビス(トリフルオロメチル)-4,4'-ジアミノビフェニル(2,2'-Bis(trifluoromethyl)-4,4'-diaminobiphenyl、TFDB)を含み、
前記芳香族ジアンヒドリドは、2,2'-ビス(3,4-ジカルボキシフェニル)ヘキサフルオロプロパンジアンヒドリド(2,2'-Bis(3,4-Dicarboxyphenyl)hexafluoropropane dianhydride、6-FDA)を含み、
前記芳香族ジカルボニル化合物は、テレフタロイルクロリド(terephthaloyl chloride、TPC)および1,1'-ビフェニル-4,4'-ジカルボニルジクロリド(1,1'-biphenyl-4,4'-dicarbonyl dichloride、BPDC)のうち少なくとも1つを含み、
前記ポリアミドイミド重合体溶液を調製する段階は、
前記芳香族ジアミン化合物、前記芳香族ジアンヒドリド化合物および前記芳香族ジカルボニル化合物を重合して粘度が15万cps未満である第1重合体溶液を調製する段階と、
前記第1重合体溶液に前記芳香族ジカルボニル化合物をさらに添加して、粘度が15万cps~50万cpsである第2重合体溶液を調製する段階とを含む、ポリアミドイミドフィルムの製造方法。 - 前記熱処理する段階において、
前記ゲルシートは150℃~470℃の温度で10分~20分間熱処理される、請求項1に記載のポリアミドイミドフィルムの製造方法。 - 前記芳香族ジカルボニル化合物は、テレフタロイルクロリド(terephthaloyl chloride、TPC)および1,1'-ビフェニル-4,4'-ジカルボニルジクロリド(1,1'-biphenyl-4,4'-dicarbonyl dichloride、BPDC)のいずれも含む、請求項1に記載のポリアミドイミドフィルムの製造方法。
- 前記溶媒は、ジメチルホルムアミド(DMF)、ジメチルアセトアミド(DMAc)、N-メチル-2-ピロリドン(NMP)、m-クレゾール、テトラヒドロフラン(THF)、およびクロロホルムからなる群より選択される、請求項3に記載のポリアミドイミドフィルムの製造方法。
- 前記単量体は、前記芳香族ジアンヒドリドおよび芳香族ジカルボニル化合物の総モルに対して、
前記芳香族ジアンヒドリドを20モル%~50モル%で含み、
前記芳香族ジカルボニル化合物を50モル%~80モル%で含む、請求項3に記載のポリアミドイミドフィルムの製造方法。 - 前記芳香族ジカルボニル化合物は、テレフタロイルクロリド(TPC)および1,1'-ビフェニル-4,4'-ジカルボニルジクロリド(BPDC)であり、
前記芳香族ジカルボニル化合物は、前記テレフタロイルクロリド(TPC)および1,1'-ビフェニル-4,4'-ジカルボニルジクロリド(BPDC)の総モルに対して、
前記1,1'-ビフェニル-4,4'-ジカルボニルジクロリド(BPDC)を50モル%~70モル%で含む、請求項5に記載のポリアミドイミドフィルムの製造方法。 - 前記ポリアミドイミドフィルムは、厚さ20μm~70μmを基準に、
表面硬度がHB以上である、請求項1に記載のポリアミドイミドフィルムの製造方法。 - 前記ポリアミドイミドフィルムは、厚さ20μm~70μmを基準に、
550nmで測定した透過度が89%以上であり、ヘイズが1%未満である、請求項1に記載のポリアミドイミドフィルムの製造方法。
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| KR1020170018138A KR101888998B1 (ko) | 2017-02-09 | 2017-02-09 | 폴리아마이드-이미드 필름의 제조방법 |
| KR10-2017-0018138 | 2017-02-09 | ||
| JP2019538326A JP6850355B2 (ja) | 2017-02-09 | 2018-02-06 | ポリアミドイミドフィルムの製造方法 |
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| JP7128310B2 true JP7128310B2 (ja) | 2022-08-30 |
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| US (1) | US11559923B2 (ja) |
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| KR (1) | KR101888998B1 (ja) |
| CN (1) | CN110177824B (ja) |
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| KR102036227B1 (ko) * | 2018-01-31 | 2019-10-24 | 에스케이씨 주식회사 | 폴리아마이드-이미드 필름 및 이의 제조방법 |
| US11550179B2 (en) | 2018-09-28 | 2023-01-10 | Sumitomo Chemical Company, Limited | Optical film |
| TW202037642A (zh) * | 2018-12-28 | 2020-10-16 | 日商住友化學股份有限公司 | 光學膜 |
| JP7382810B2 (ja) * | 2018-12-28 | 2023-11-17 | 住友化学株式会社 | 光学フィルム |
| JP7365211B2 (ja) * | 2019-12-02 | 2023-10-19 | 住友化学株式会社 | 光学フィルム |
| WO2020138046A1 (ja) * | 2018-12-28 | 2020-07-02 | 住友化学株式会社 | 光学フィルム |
| KR102210414B1 (ko) * | 2019-06-28 | 2021-02-02 | 에스케이씨 주식회사 | 폴리이미드계 필름, 이의 제조방법, 및 이를 포함하는 커버 윈도우 및 디스플레이 장치 |
| TWI730820B (zh) * | 2019-06-28 | 2021-06-11 | 南韓商Skc股份有限公司 | 聚合物薄膜 |
| CN110734545A (zh) * | 2019-10-28 | 2020-01-31 | 中仑塑业(福建)有限公司 | 一种聚酰亚胺树脂及其制备方法和用途 |
| CN111282457B (zh) * | 2020-02-21 | 2022-03-25 | 太原理工大学 | 点击化学修饰的聚酰胺-聚酰亚胺煤层气脱氮浓缩分离膜 |
| TWI877444B (zh) * | 2021-01-29 | 2025-03-21 | 南韓商愛思開邁克沃股份有限公司 | 聚醯胺-醯亞胺薄膜、其製備方法及包含其之覆蓋窗及顯示裝置 |
| KR102689315B1 (ko) * | 2021-12-20 | 2024-07-29 | 에스케이마이크로웍스 주식회사 | 필름, 다층전자장비 및 필름의 제조방법 |
| CN116041957B (zh) * | 2023-01-03 | 2025-03-25 | 吉林高琦聚酰亚胺材料有限公司 | 聚酰亚胺薄膜及其制备方法 |
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| US20160222249A1 (en) | 2015-01-30 | 2016-08-04 | Samsung Electronics Co., Ltd. | Composition for preparing article containing poly(imide-amide), method of preparing the same, and article containing poly(imide-amide) |
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| KR101583845B1 (ko) | 2010-12-31 | 2016-01-08 | 코오롱인더스트리 주식회사 | 공중합 폴리아마이드-이미드 필름 및 공중합 폴리아마이드―이미드의 제조방법 |
| KR101459178B1 (ko) * | 2011-09-30 | 2014-11-07 | 코오롱인더스트리 주식회사 | 공중합 폴리아마이드-이미드 필름 및 공중합 폴리아마이드-이미드의 제조방법 |
| KR101968258B1 (ko) * | 2012-02-07 | 2019-04-12 | 삼성전자주식회사 | 폴리(아미드-이미드) 블록 코폴리머, 이를 포함하는 성형품 및 상기 성형품을 포함하는 디스플레이 장치 |
| KR101583855B1 (ko) * | 2012-05-29 | 2016-01-08 | 코오롱인더스트리 주식회사 | 폴리아미드-이미드 필름 및 그 제조방법 |
| KR102232009B1 (ko) | 2014-12-30 | 2021-03-25 | 코오롱인더스트리 주식회사 | 폴리아마이드-이미드 전구체, 폴리아마이드-이미드 필름 및 이를 포함하는 표시소자 |
| KR102227672B1 (ko) * | 2014-12-31 | 2021-03-16 | 코오롱인더스트리 주식회사 | 폴리아마이드-이미드 전구체, 폴리아마이드-이미드 필름 및 이를 포함하는 표시소자 |
| KR20160083738A (ko) * | 2015-01-02 | 2016-07-12 | 삼성전자주식회사 | 표시 장치용 윈도우 및 이를 포함하는 표시 장치 |
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| WO2016108631A1 (ko) | 2014-12-30 | 2016-07-07 | 코오롱인더스트리 주식회사 | 폴리아마이드-이미드 전구체, 폴리아마이드-이미드 필름 및 이를 포함하는 표시소자 |
| US20160222249A1 (en) | 2015-01-30 | 2016-08-04 | Samsung Electronics Co., Ltd. | Composition for preparing article containing poly(imide-amide), method of preparing the same, and article containing poly(imide-amide) |
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| WO2018147618A1 (ko) | 2018-08-16 |
| JP2021101019A (ja) | 2021-07-08 |
| CN110177824A (zh) | 2019-08-27 |
| CN110177824B (zh) | 2022-09-09 |
| US11559923B2 (en) | 2023-01-24 |
| TWI682946B (zh) | 2020-01-21 |
| US20190358865A1 (en) | 2019-11-28 |
| JP6850355B2 (ja) | 2021-03-31 |
| JP2020505488A (ja) | 2020-02-20 |
| KR101888998B1 (ko) | 2018-08-21 |
| TW201833187A (zh) | 2018-09-16 |
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