JP7744994B2 - 粘着シート - Google Patents

粘着シート

Info

Publication number
JP7744994B2
JP7744994B2 JP2023542212A JP2023542212A JP7744994B2 JP 7744994 B2 JP7744994 B2 JP 7744994B2 JP 2023542212 A JP2023542212 A JP 2023542212A JP 2023542212 A JP2023542212 A JP 2023542212A JP 7744994 B2 JP7744994 B2 JP 7744994B2
Authority
JP
Japan
Prior art keywords
pressure
sensitive adhesive
meth
acrylate
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023542212A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023021773A1 (fr
Inventor
高正 平山
昭徳 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of JPWO2023021773A1 publication Critical patent/JPWO2023021773A1/ja
Application granted granted Critical
Publication of JP7744994B2 publication Critical patent/JP7744994B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C08K5/57—Organo-tin compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023542212A 2021-08-19 2022-03-23 粘着シート Active JP7744994B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021133918 2021-08-19
JP2021133918 2021-08-19
PCT/JP2022/013629 WO2023021773A1 (fr) 2021-08-19 2022-03-23 Feuille autocollante

Publications (2)

Publication Number Publication Date
JPWO2023021773A1 JPWO2023021773A1 (fr) 2023-02-23
JP7744994B2 true JP7744994B2 (ja) 2025-09-26

Family

ID=85240310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023542212A Active JP7744994B2 (ja) 2021-08-19 2022-03-23 粘着シート

Country Status (5)

Country Link
JP (1) JP7744994B2 (fr)
KR (1) KR102930766B1 (fr)
CN (1) CN117858930A (fr)
TW (1) TWI867288B (fr)
WO (1) WO2023021773A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024148256A (ja) * 2023-04-05 2024-10-18 日東電工株式会社 防爆部材
JP2025159628A (ja) * 2024-04-08 2025-10-21 日東電工株式会社 粘着シート

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100120931A1 (en) 2007-03-21 2010-05-13 Avery Dennison Corporation Pressure sensitive adhesives
JP2015021083A (ja) 2013-07-19 2015-02-02 日東電工株式会社 再剥離粘着剤組成物、粘着シート及びテープ
JP2017019955A (ja) 2015-07-14 2017-01-26 東洋インキＳｃホールディングス株式会社 両面粘着テープ
JP2017160422A (ja) 2016-03-04 2017-09-14 日東電工株式会社 表面保護フィルム
JP2020097660A (ja) 2018-12-17 2020-06-25 東亞合成株式会社 積層体の製造方法
JP2021042276A (ja) 2019-09-06 2021-03-18 日東電工株式会社 粘着シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4069625B2 (ja) 2002-01-09 2008-04-02 日立化成工業株式会社 セパレータ付き感圧型接着シート及び光学部材組立体並びにその組立方法
JP3853247B2 (ja) * 2002-04-16 2006-12-06 日東電工株式会社 電子部品用加熱剥離型粘着シートおよび電子部品の加工方法並びに電子部品
JP5689336B2 (ja) * 2011-03-03 2015-03-25 日東電工株式会社 加熱剥離型粘着シート
KR101892432B1 (ko) * 2012-12-12 2018-10-04 생-고뱅 퍼포먼스 플라스틱스 코포레이션 점착제 층을 가지는 다층 필름
JP6374761B2 (ja) * 2014-10-30 2018-08-15 リンテック株式会社 再剥離性粘着シート
JP6419626B2 (ja) * 2015-03-30 2018-11-07 日本カーバイド工業株式会社 粘着剤組成物及び粘着フィルム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100120931A1 (en) 2007-03-21 2010-05-13 Avery Dennison Corporation Pressure sensitive adhesives
JP2015021083A (ja) 2013-07-19 2015-02-02 日東電工株式会社 再剥離粘着剤組成物、粘着シート及びテープ
JP2017019955A (ja) 2015-07-14 2017-01-26 東洋インキＳｃホールディングス株式会社 両面粘着テープ
JP2017160422A (ja) 2016-03-04 2017-09-14 日東電工株式会社 表面保護フィルム
JP2020097660A (ja) 2018-12-17 2020-06-25 東亞合成株式会社 積層体の製造方法
JP2021042276A (ja) 2019-09-06 2021-03-18 日東電工株式会社 粘着シート

Also Published As

Publication number Publication date
JPWO2023021773A1 (fr) 2023-02-23
KR20240011775A (ko) 2024-01-26
CN117858930A (zh) 2024-04-09
TWI867288B (zh) 2024-12-21
KR102930766B1 (ko) 2026-02-26
WO2023021773A1 (fr) 2023-02-23
TW202308842A (zh) 2023-03-01

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