JP7749358B2 - 銀めっき材およびその製造方法 - Google Patents

銀めっき材およびその製造方法

Info

Publication number
JP7749358B2
JP7749358B2 JP2021107489A JP2021107489A JP7749358B2 JP 7749358 B2 JP7749358 B2 JP 7749358B2 JP 2021107489 A JP2021107489 A JP 2021107489A JP 2021107489 A JP2021107489 A JP 2021107489A JP 7749358 B2 JP7749358 B2 JP 7749358B2
Authority
JP
Japan
Prior art keywords
silver
plated product
plated
mass
product according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021107489A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023005513A (ja
Inventor
悠太郎 平井
健太郎 荒井
陽介 佐藤
恵理 船田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Metaltech Co Ltd
Original Assignee
Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Priority to JP2021107489A priority Critical patent/JP7749358B2/ja
Priority to US18/572,459 priority patent/US20240287697A1/en
Priority to EP22832665.8A priority patent/EP4317536B1/de
Priority to PCT/JP2022/021697 priority patent/WO2023276507A1/ja
Priority to MX2023015085A priority patent/MX2023015085A/es
Priority to CN202280040124.5A priority patent/CN117529581A/zh
Publication of JP2023005513A publication Critical patent/JP2023005513A/ja
Application granted granted Critical
Publication of JP7749358B2 publication Critical patent/JP7749358B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2021107489A 2021-06-29 2021-06-29 銀めっき材およびその製造方法 Active JP7749358B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2021107489A JP7749358B2 (ja) 2021-06-29 2021-06-29 銀めっき材およびその製造方法
US18/572,459 US20240287697A1 (en) 2021-06-29 2022-05-27 Silver-plated product and method for producing same
EP22832665.8A EP4317536B1 (de) 2021-06-29 2022-05-27 Silberplattiertes material und verfahren zur herstellung davon
PCT/JP2022/021697 WO2023276507A1 (ja) 2021-06-29 2022-05-27 銀めっき材およびその製造方法
MX2023015085A MX2023015085A (es) 2021-06-29 2022-05-27 Producto enchapado en plata y metodo para producir el mismo.
CN202280040124.5A CN117529581A (zh) 2021-06-29 2022-05-27 镀银材料及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021107489A JP7749358B2 (ja) 2021-06-29 2021-06-29 銀めっき材およびその製造方法

Publications (2)

Publication Number Publication Date
JP2023005513A JP2023005513A (ja) 2023-01-18
JP7749358B2 true JP7749358B2 (ja) 2025-10-06

Family

ID=84691269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021107489A Active JP7749358B2 (ja) 2021-06-29 2021-06-29 銀めっき材およびその製造方法

Country Status (6)

Country Link
US (1) US20240287697A1 (de)
EP (1) EP4317536B1 (de)
JP (1) JP7749358B2 (de)
CN (1) CN117529581A (de)
MX (1) MX2023015085A (de)
WO (1) WO2023276507A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119301312A (zh) * 2022-03-31 2025-01-10 同和金属技术有限公司 镀银材料及其制造方法
CN117512725B (zh) * 2023-11-07 2024-06-25 东莞市贝沃金属有限公司 用于大电流保险管的锡锌线镀银工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004048646A1 (ja) 2002-11-28 2004-06-10 Shinko Electric Industries Co., Ltd. 電解銀めっき液
JP2013216975A (ja) 2012-03-30 2013-10-24 Rohm & Haas Electronic Materials Llc めっき浴および方法
WO2016121312A1 (ja) 2015-01-30 2016-08-04 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2429970A (en) * 1944-01-11 1947-10-28 Du Pont Silver plating
US4247372A (en) * 1978-08-29 1981-01-27 Learonal, Inc. Silver plating
JPS5743995A (en) * 1980-08-27 1982-03-12 Sumitomo Electric Ind Ltd Silver plating liquid and silver plating method
JP2009079250A (ja) 2007-09-26 2009-04-16 Dowa Metaltech Kk 最表層として銀合金層が形成された銅または銅合金部材およびその製造方法
JP5854726B2 (ja) * 2010-09-21 2016-02-09 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ ニッケル上に銀ストライクを電気めっきする方法
US9074681B2 (en) * 2012-11-20 2015-07-07 United Technologies Corporation Hardened silver coated journal bearing surfaces and method
US12297556B2 (en) * 2020-02-25 2025-05-13 Dowa Metaltech Co., Ltd. Silver-plated product and method for producing same
JP6916971B1 (ja) * 2020-09-15 2021-08-11 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004048646A1 (ja) 2002-11-28 2004-06-10 Shinko Electric Industries Co., Ltd. 電解銀めっき液
JP2013216975A (ja) 2012-03-30 2013-10-24 Rohm & Haas Electronic Materials Llc めっき浴および方法
WO2016121312A1 (ja) 2015-01-30 2016-08-04 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

Also Published As

Publication number Publication date
CN117529581A (zh) 2024-02-06
US20240287697A1 (en) 2024-08-29
EP4317536A4 (de) 2025-04-23
EP4317536A1 (de) 2024-02-07
MX2023015085A (es) 2024-01-18
EP4317536B1 (de) 2026-02-25
JP2023005513A (ja) 2023-01-18
WO2023276507A1 (ja) 2023-01-05

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