JPH01104043U - - Google Patents
Info
- Publication number
- JPH01104043U JPH01104043U JP19780787U JP19780787U JPH01104043U JP H01104043 U JPH01104043 U JP H01104043U JP 19780787 U JP19780787 U JP 19780787U JP 19780787 U JP19780787 U JP 19780787U JP H01104043 U JPH01104043 U JP H01104043U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor component
- heatsink
- metal fitting
- presser metal
- mounting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の一実施例による半導体部品
の取付装置を示す斜視図、第２図は従来の半導体
部品の取付装置を示す斜視図である。
図において、１は放熱器、２，３は半導体部品
、７，８は固定具、１０は押え金具である。なお
図中、同一符号は同一または相当部分を示す。
FIG. 1 is a perspective view showing a semiconductor component mounting device according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional semiconductor component mounting device. In the figure, 1 is a heat sink, 2 and 3 are semiconductor components, 7 and 8 are fixtures, and 10 is a presser metal fitting. In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (1)
付装置において、上記放熱器の所定位置に位置決
め用突起を設けるとともに一面側の内側が上記半
導体部品の外壁絶縁部に当接するよう略Ｌ字状に
折曲げ形成され、他面側端部に切欠部を有する押
さえ金具と、この押さえ金具の上記切欠部を上記
位置決め用突起に係合させるとともに、上記押え
金具を介して上記半導体部品を上記放熱器に押圧
固定する固定具を備えたことを特徴とする半導体
部品の取付装置。 In a semiconductor component mounting device for attaching a semiconductor component to a heatsink, a positioning protrusion is provided at a predetermined position on the heatsink, and the heatsink is bent into a substantially L shape so that the inside of one side comes into contact with the outer wall insulation part of the semiconductor component. a presser metal fitting having a cutout portion on the other side end thereof, and engaging the notch portion of the presser metal fitting with the positioning protrusion, and pressing the semiconductor component against the heat sink via the presser metal fitting. A semiconductor component mounting device characterized by being equipped with a fixture for fixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19780787U JPH01104043U (en) | 1987-12-26 | 1987-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19780787U JPH01104043U (en) | 1987-12-26 | 1987-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104043U true JPH01104043U (en) | 1989-07-13 |
Family
ID=31488342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19780787U Pending JPH01104043U (en) | 1987-12-26 | 1987-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104043U (en) |
-
1987
- 1987-12-26 JP JP19780787U patent/JPH01104043U/ja active Pending