JPH01104735U - - Google Patents

Info

Publication number
JPH01104735U
JPH01104735U JP20008287U JP20008287U JPH01104735U JP H01104735 U JPH01104735 U JP H01104735U JP 20008287 U JP20008287 U JP 20008287U JP 20008287 U JP20008287 U JP 20008287U JP H01104735 U JPH01104735 U JP H01104735U
Authority
JP
Japan
Prior art keywords
hybrid
chip
heat sink
generation density
heat generation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20008287U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20008287U priority Critical patent/JPH01104735U/ja
Publication of JPH01104735U publication Critical patent/JPH01104735U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例のハイブリツドＩＣ
の要部を示す縦断面図、第２図は第１図の要部を
拡大して示す平面図、第３図は従来のハイブリツ
ドＩＣの要部を示す縦断面図、第４図は第３図の
要部を拡大して示す平面図である。 １１……セラミツク基板、１２……ヒートシン
クブロツク、１３……銀ろう、１４……発熱密度
の大きいＩＣチツプ、１５……表面パターン、１
６……ボンデイングワイヤ、１７……チツプ部品
、１８……メタルキヤツプ、１９……ウエルドリ
ング。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板上にヒートシンクブロツクを介して発熱密
    度の大きいＩＣチツプが搭載され、このＩＣチツ
    プと電極パターンとがワイヤボンデイングによつ
    て接続されたハイブリツドＩＣにおいて、前記ヒ
    ートシンクブロツクを、前記ＩＣチツプを搭載さ
    れた側の角部を斜めに削除した形状としたことを
    特徴とするハイブリツドＩＣ。
JP20008287U 1987-12-30 1987-12-30 Pending JPH01104735U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20008287U JPH01104735U (ja) 1987-12-30 1987-12-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20008287U JPH01104735U (ja) 1987-12-30 1987-12-30

Publications (1)

Publication Number Publication Date
JPH01104735U true JPH01104735U (ja) 1989-07-14

Family

ID=31490508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20008287U Pending JPH01104735U (ja) 1987-12-30 1987-12-30

Country Status (1)

Country Link
JP (1) JPH01104735U (ja)

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