JPH01107103A - Surface flaw inspection apparatus - Google Patents
Surface flaw inspection apparatusInfo
- Publication number
- JPH01107103A JPH01107103A JP26600987A JP26600987A JPH01107103A JP H01107103 A JPH01107103 A JP H01107103A JP 26600987 A JP26600987 A JP 26600987A JP 26600987 A JP26600987 A JP 26600987A JP H01107103 A JPH01107103 A JP H01107103A
- Authority
- JP
- Japan
- Prior art keywords
- light
- inspected
- reflected light
- detection means
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 54
- 238000001514 detection method Methods 0.000 claims abstract description 52
- 230000007547 defect Effects 0.000 claims description 49
- 230000003287 optical effect Effects 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000001788 irregular Effects 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野〕
本発明は表面欠陥検査装置、特に自動車や家電製品など
の金属或いはプラスチック塗装面その他の平滑表面の欠
陥を検査光を用いて非接触で検査可能な改良された表面
欠陥検査装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention is a surface defect inspection device, particularly for non-contact inspection of defects on metal or plastic painted surfaces and other smooth surfaces of automobiles, home appliances, etc. using inspection light. The present invention relates to a possible improved surface defect inspection device.
工業製品の平滑表面における欠陥は、これら製品の外観
品質を低下させ、また製品の種類によっては、防錆特性
、絶縁特性、あるいは導電特性などの機能面における重
要な特性劣化を招く場合があり、これらの表面欠陥は厳
密に検査しなければならない。Defects on the smooth surfaces of industrial products reduce the appearance quality of these products, and depending on the type of product, may lead to deterioration of important functional properties such as rust prevention properties, insulation properties, or conductive properties. These surface defects must be closely inspected.
従来の最も一般的な欠陥検査は検査員が検査対象を目視
して、各種の表面欠陥を検査することにより行われてい
た。しかしながら、この様な一般的な検査方法では、検
査員の熟練を必要とし、また熟練検査員によっても、見
落とし、見誤りあるいは検査員の疲労が大きいという問
題があり、近年においては、このような欠陥検査は光反
射を利用した非接触の機器検査に移行しつつある。Conventionally, the most common defect inspection has been performed by an inspector visually observing the object to be inspected and inspecting for various surface defects. However, such general inspection methods require the inspectors to be highly skilled, and even experienced inspectors have problems such as oversights, misinterpretations, and inspector fatigue. Defect inspection is shifting to non-contact equipment inspection using light reflection.
従来におけるこのような表面欠陥の機器検査における困
難性は表面欠陥が各検査対象において極めて広範囲の欠
陥種類を含むことであり、これらの欠陥の代表的な事例
としては、傷(5μm以下の幅)、ブツ(直径1111
01以下)、肌荒れあるいはうねり(1−10mmの波
長)、光沢むら或いは粗さ(0,1mm以下の波長)等
があり、これら各種の欠陥を一度にかつ簡便に機器検査
する装置を得ることが極めて困難であった。The difficulty in conventional equipment inspection of such surface defects is that surface defects include an extremely wide range of defect types for each inspection target, and typical examples of these defects include scratches (width of 5 μm or less). , butsu (diameter 1111
0.01 or less), rough skin or waviness (wavelength of 1-10 mm), uneven gloss or roughness (wavelength of 0.1 mm or less), etc., and it is possible to obtain a device that can easily and easily inspect these various defects at once. It was extremely difficult.
第4図にはレーザビーム等の検査光を利用した表面欠陥
検査装置の原理が示されており、レーザ発振器10から
照射されたレーザビームLを被検査面12に供給し、こ
の時の正反射光LOを光電センサ14にて受光して電気
信号を得る。FIG. 4 shows the principle of a surface defect inspection device that uses inspection light such as a laser beam, in which a laser beam L irradiated from a laser oscillator 10 is supplied to the surface to be inspected 12, and the specular reflection at this time is The light LO is received by the photoelectric sensor 14 to obtain an electrical signal.
第4図の従来における欠陥検査装置の原理によれば、被
検査面12の傷あるいはブッ等の凹凸欠陥がある場合に
は、前記照射されたレーザビームLがこの欠陥で散乱さ
れ、光電センサ14の光電変換出力が変化するので、こ
の出力変化により、被検査面12の欠陥の合否を判定す
ることができる。According to the principle of the conventional defect inspection apparatus shown in FIG. Since the photoelectric conversion output changes, it is possible to determine whether the defect on the surface to be inspected 12 is acceptable or not based on this output change.
[発明が解決しようとする問題点]
しかしながら、このような従来の単純な検査光を用いた
装置では、前述した各種の異なる大きさあるいは傷特性
を有する種々の欠陥を一度に検査することができないと
いう問題があった。[Problems to be Solved by the Invention] However, with such a conventional device using a simple inspection light, it is not possible to simultaneously inspect the various defects described above having different sizes or flaw characteristics. There was a problem.
即ち、第4図において、欠陥検出感度を考えると、この
感度を向上させるためには、レーザビームLのビーム径
をできるだけ小さくしなければならない。That is, in FIG. 4, considering the defect detection sensitivity, in order to improve this sensitivity, the beam diameter of the laser beam L must be made as small as possible.
そして、このビーム径を小さくするための改良された従
来装置が第5図に示されており、レーザビームLの光路
に短焦点距離の凸レンズ16が設けられる。この結果、
レーザビームLのビーム径が大きくとも、被検査面12
の表面ではビームが集束されて検査ビーム径を著しく小
さくすることができ、これによって、検出感度を向上さ
せることが可能となる。An improved conventional device for reducing the beam diameter is shown in FIG. 5, in which a convex lens 16 with a short focal length is provided in the optical path of the laser beam L. As a result,
Even if the beam diameter of the laser beam L is large, the surface to be inspected 12
The beam is focused on the surface, making it possible to significantly reduce the inspection beam diameter, thereby making it possible to improve detection sensitivity.
しかしながら、実際上、前述した凸レンズ16はその光
学特性から被検査面12に対して高精度に固定位置を保
つ必要があり、実際上、このような集束装置を簡単に得
ることが極めて困難であった。However, in practice, the above-mentioned convex lens 16 needs to maintain a fixed position with high precision with respect to the surface to be inspected 12 due to its optical characteristics, and in practice, it is extremely difficult to easily obtain such a focusing device. Ta.
また、第4,5図の従来装置においては、単に正反射光
のみが検出されるだけで、被検査面12の表面における
乱反射を正しく受光することができないので、全ての欠
陥に対する検査を行い得ないという問題があった。Furthermore, in the conventional apparatus shown in FIGS. 4 and 5, only specularly reflected light is detected, and the diffused reflection on the surface of the surface to be inspected 12 cannot be correctly received, so it is not possible to inspect all defects. The problem was that there was no.
第6図は前記凸レンズ16に変えてビームエキスパンダ
18を集束用に用いた従来装置を示し、レーザビームL
のビーム径を小さくすることが可能となる。FIG. 6 shows a conventional device in which a beam expander 18 is used for focusing instead of the convex lens 16, and the laser beam L
This makes it possible to reduce the beam diameter.
しかしながら、この従来装置においては、ビームエキス
パンダ18の配置が容易になる反面、ビーム径の縮小に
従い回折が大きくなり、実際」ニビーム径の細小化には
限度があった。However, in this conventional apparatus, although the arrangement of the beam expander 18 is facilitated, diffraction increases as the beam diameter is reduced, and there is a limit to the reduction in the beam diameter.
以上のように、従来におけるレーザビーム径の実際上の
大きさとしては、波長0.7〜0.8μmのヘリウムネ
オンレーザや半導体レーザを用いる場合0.511Il
程度が限度であった。As mentioned above, the actual size of the conventional laser beam diameter is 0.511 Il when using a helium neon laser or semiconductor laser with a wavelength of 0.7 to 0.8 μm.
The extent was the limit.
従って、このようなレーザビームでは、lnm以」−の
ブツに対しては良好な感度で検査することができるが、
一方において、幅が5μm前後の傷を検査することがで
きないという問題があった。Therefore, with such a laser beam, it is possible to inspect particles smaller than 1 nm with good sensitivity, but
On the other hand, there was a problem in that it was not possible to inspect flaws with a width of around 5 μm.
また、前述したように、被検査面例えば塗装面のような
場合、照射されたビームLは大部分が正反射ビームLO
となってしまい、その他の欠陥例えば光沢むら等による
正反射ビーム変化は血かしか受光することができず、こ
の結果、光沢むらの検査には不向きであるという問題が
あった。Furthermore, as mentioned above, when the surface to be inspected is a painted surface, most of the irradiated beam L is the specularly reflected beam LO.
As a result, changes in the specular reflection beam due to other defects such as uneven gloss can only receive blood stains, and as a result, there is a problem in that it is unsuitable for inspecting uneven gloss.
以上のように、従来装置では、特性の異なる各種の表面
欠陥に対して一度に検査する装置を得ることが極めて困
難である。As described above, with the conventional apparatus, it is extremely difficult to obtain an apparatus that can inspect various surface defects having different characteristics at the same time.
本発明の目的は、前述した披検査面上に存在する大小様
々の凹凸欠陥を一度に検査することかでき、特に塗装面
上に存在する傷、ブッ、肌荒れ、光沢むら等を簡単に検
査可能な改良された表面欠陥検査装置を提供することに
ある。The purpose of the present invention is to be able to simultaneously inspect uneven defects of various sizes that exist on the surface to be inspected as described above, and in particular to easily inspect scratches, bumps, rough skin, uneven gloss, etc. that exist on painted surfaces. An object of the present invention is to provide an improved surface defect inspection device.
r問題点を解決するための手段]
上記従来の課題を解決するために、本発明は、検査光の
反射には正反射と乱反射とが存在することに着目し、両
者を異なる光電検知手段にて検知することを特徴とする
。Means for Solving Problems] In order to solve the above-mentioned conventional problems, the present invention focuses on the fact that there are regular reflections and diffuse reflections in the reflection of inspection light, and uses different photoelectric detection means to detect both. It is characterized by detecting
即ち、レーザビーム等の検査光が傷に照射されると、傷
の長手方向と直交する方向に回折現象を生じ、また、肌
荒れ(凹凸の波長が小さく振幅が大きい)がある場合、
正反射ビームの方向が変動し、更に光沢むら(粗さ変化
)がある場合、正反射の偏れが増加することが知られて
おり、これらの光特性に対応して、2種類の光電検知手
段、即ち正反射光検知手段及び乱反射光検知手段を設け
たものである。That is, when a scratch is irradiated with inspection light such as a laser beam, a diffraction phenomenon occurs in a direction perpendicular to the longitudinal direction of the scratch, and if there is rough skin (the wavelength of the unevenness is small and the amplitude is large),
It is known that the deviation of specular reflection increases when the direction of the specular reflection beam changes and there is uneven gloss (change in roughness).In response to these optical characteristics, two types of photoelectric detection In this embodiment, a specular reflection light detection means and a diffused reflection light detection means are provided.
更に、詳述するならば、本発明は、被検査面に対して検
査光を照射する検査光供給手段と、被検査面で反射され
た正反射光を受光して電気信号に変換出力する正反射光
検知手段と、被検査面で反射された拡散反射光及び零次
以外の回折光を含む乱反射光を受光して電気信号に変換
出力する乱反射光検知手段と、
前記両検知手段の電気信号を演算処理して被検査面上の
欠陥の合否判別を行なう演算処理手段と、を含み、
前記正反射光検知手段は正反射光の光路、]−に配置さ
れた正反射用光電変換器を含み、
前記乱反射光検知手段は、前記正反射用光電変換器と被
検査面との間に配置され正反射光の光路に対して開口部
が設けられ比較的広い受光面を有する乱反射用光電変換
器を含む、
ことを特徴とする。More specifically, the present invention includes an inspection light supply means for irradiating inspection light onto a surface to be inspected, and a specular means for receiving regular reflection light reflected by the surface to be inspected, converting it into an electrical signal, and outputting it. a reflected light detecting means; a diffusely reflected light detecting means for receiving the diffusely reflected light including the diffusely reflected light and non-zero-order diffracted light reflected from the surface to be inspected, converting it into an electrical signal and outputting it; and the electrical signals of both the detecting means. an arithmetic processing means for performing arithmetic processing to determine the pass/fail of defects on the surface to be inspected, and the specular reflection light detection means includes a photoelectric converter for specular reflection disposed in the optical path of the specular reflection light. The diffused reflection light detection means is a diffused reflection photoelectric converter that is disposed between the specular reflection photoelectric converter and the surface to be inspected, has an opening for the optical path of the specular reflection light, and has a relatively wide light-receiving surface. It is characterized by including a container.
従って、本発明によれば、正反射光検知手段は正反射光
の強度と位置を光電検出し、また乱反射検知手段は検査
面からの散乱反射光および零次(正反射光)以外の回折
光を含む乱反射光を光電検出し、これら2種類の検知信
号によって複数種類の欠陥を同時に検出して表面欠陥の
合否を判定可能としたものである。Therefore, according to the present invention, the specular reflection light detection means photoelectrically detects the intensity and position of the specular reflection light, and the diffuse reflection detection means photoelectrically detects the intensity and position of the specular reflection light, and the diffuse reflection detection means detects the scattered reflection light from the inspection surface and the diffracted light other than the zero-order (specular reflection light). It is possible to photoelectrically detect the diffusely reflected light including the surface defects, detect multiple types of defects at the same time using these two types of detection signals, and determine whether the surface defects are acceptable or not.
第1図には本発明にかかる表面欠陥検査装置の原理が示
されており、レーザ発振器等の検査光供給手段20から
照射されたレーザビームして示される検査光は被検査面
22に照射され、その反射光は正反射光LOの光路に配
置された正反射光検知手段24及びこの正反射光検知手
段24と被検査面22との間に配置され、前記1′−、
反射光LOの光路には開口部26aが設けられた乱反射
光検知手段26にて受光される。FIG. 1 shows the principle of the surface defect inspection apparatus according to the present invention, in which inspection light shown as a laser beam irradiated from an inspection light supply means 20 such as a laser oscillator is irradiated onto a surface 22 to be inspected. , the reflected light is detected by a specular reflection light detection means 24 disposed in the optical path of the specular reflection light LO, and a specular reflection light detection means 24 disposed between the specular reflection light detection means 24 and the surface to be inspected 22, said 1'-,
The reflected light LO is received by the diffusely reflected light detection means 26, which has an opening 26a in its optical path.
そして、両検知手段24.26はそれぞれ光電変換器か
らなり、乱反射光検知手段26の乱反射光電変換器は、
正反射光検知手段24の光電変換器より比較的広い受光
面を宵する。Both the detection means 24 and 26 each include a photoelectric converter, and the diffused reflection photoelectric converter of the diffused reflection light detection means 26 is
A relatively wider light-receiving surface than the photoelectric converter of the specular reflection light detection means 24 is provided.
そして、両検知手段24.26の出力は演算処理手段2
8に供給され所望の合否判別が行われる。Then, the outputs of both the detection means 24 and 26 are processed by the calculation processing means 2.
8, and desired pass/fail determination is performed.
[作用]
第1図において、検査光供給手段20から照射されたレ
ー・ザビームLは被検査面12において正反射あるいは
乱反射される。[Operation] In FIG. 1, the laser beam L emitted from the inspection light supply means 20 is specularly or diffusely reflected on the inspection surface 12.
仮に、被検査面22が表面欠陥を有さず、良好な平滑状
態に保たれている場合には、レーザビームしは大部分が
正反射ビームLOとなり、残りの僅かな量が拡散反射光
L2となる。If the surface 22 to be inspected has no surface defects and is kept in a good smooth state, most of the laser beam becomes a specularly reflected beam LO, and the remaining small amount becomes a diffusely reflected light L2. becomes.
第1図から明らかなように、正反射ビームLOは乱反射
光検知手段26の開口部26aを通過して正反射光検知
手段24に到達し、これに対応した電気信号が演算処理
手段28に供給される。−方、僅かな量の拡散反射光L
2は前記開口部26aを通過することができないので、
乱反射光検知手段26に受光され、演算処理手段28に
所定の電気信号を供給する。As is clear from FIG. 1, the specularly reflected beam LO passes through the aperture 26a of the diffusely reflected light detecting means 26 and reaches the specularly reflected light detecting means 24, and an electrical signal corresponding thereto is supplied to the arithmetic processing means 28. be done. - On the other hand, a small amount of diffuse reflected light L
2 cannot pass through the opening 26a, so
The diffusely reflected light detection means 26 receives the light, and supplies a predetermined electrical signal to the arithmetic processing means 28.
前記演算処理手段28は、両人力信号と予め設定された
基準値とを比較演算処理し、正反射光が基準値より大き
く、また乱反射光が基準値より小さい場合には、良信号
を出力する。The arithmetic processing means 28 compares and arithmetic-processes both human power signals and a preset reference value, and outputs a good signal if the specularly reflected light is larger than the reference value and the diffusely reflected light is smaller than the reference value. .
一方、被検査面22にブツ等の大きな凹凸結果がある場
合、レーザビームしは大部分が正反射ビ−ムLOの方向
から大きく外れた方向に反射され、不整反射ビームL1
となり、両検知手段24,26には残りの僅かの正反射
ビームLO及び拡散反射光L2が照射されるのみである
。On the other hand, if there are large irregularities such as bumps on the surface 22 to be inspected, most of the laser beam is reflected in a direction far away from the direction of the specularly reflected beam LO, and the irregularly reflected beam L1
Therefore, both the detection means 24 and 26 are irradiated with only a small amount of the remaining specularly reflected beam LO and diffusely reflected light L2.
従って、演算処理手段28はこれらの両検知手段24.
26からの出力信号をそれぞれ前述した基準値と比較し
て正反射光が基準値より小さい場合あるいは乱反射光が
基準値より大きい場合には否信号を出力する。Therefore, the arithmetic processing means 28 processes both of these detection means 24.
The output signals from 26 are compared with the reference values mentioned above, and if the specularly reflected light is smaller than the reference value or if the diffusely reflected light is larger than the reference value, a negative signal is output.
次に、被検査面22に傷等の細長い凹凸欠陥があると、
レーザビームしは凹凸の長手方向に直交する方向に回折
される。Next, if there is an elongated irregularity defect such as a scratch on the surface 22 to be inspected,
The laser beam is diffracted in a direction perpendicular to the longitudinal direction of the unevenness.
この場合、回折光のうち、零次の回折光は正反射ビーム
LOと区別できないので、正反射光検知手段24に照射
されるが、零次より高次の回折光L3は乱反射光検知手
段26にて受光される。In this case, among the diffracted lights, the zero-order diffracted light cannot be distinguished from the specularly reflected beam LO, so it is irradiated onto the specularly reflected light detection means 24, but the diffracted light L3 of orders higher than the zeroth order is irradiated to the diffusely reflected light detecting means 26. The light is received at
従って演算処理手段28は正反射光が基準値より小さい
場合或いは乱反射光が基準値より大きい場合には否信号
を、一方正反射光が基準値より大きく乱反射光が基準値
より小さい場合には良信号を出力する。Therefore, the arithmetic processing means 28 outputs a failure signal when the specularly reflected light is smaller than the reference value or when the diffusely reflected light is larger than the reference value, and on the other hand, when the specularly reflected light is larger than the reference value and the diffusely reflected light is smaller than the reference value. Output a signal.
更に、被検査面22に光沢むらがある場合、光沢の悪い
部分において、レーザビームLの大部分は輝度の低下し
た正反射ビームLOとなり、また拡散反射光L2も若干
増加する。従って、演算処理手段28は正反射光が基準
値より小さいか、乱反射光が基準値より大きい場合には
、否信号を、そして正反射光が基準値より大きくかつ乱
反射光が基準値より小さい場合には良信号を出力する。Further, when the surface to be inspected 22 has uneven gloss, most of the laser beam L becomes a specularly reflected beam LO with reduced brightness in a portion with poor gloss, and the diffusely reflected light L2 also increases slightly. Therefore, the arithmetic processing means 28 outputs a negative signal when the specularly reflected light is smaller than the reference value or when the diffusely reflected light is larger than the reference value, and when the specularly reflected light is larger than the reference value and the diffusely reflected light is smaller than the reference value. outputs a good signal.
次に、被検査面22に肌荒れがある場合、レーザビーム
Lの大部分は僅かに反射角度の異なる正反射ビームLO
−となる。この時の正反射光検知手段24での受光位置
は肌荒れの状態によってずれが生じ、この位置によって
ずれ量に対応する電気信号を得ることができる。Next, when the surface to be inspected 22 has rough skin, most of the laser beam L is a specularly reflected beam LO with a slightly different reflection angle.
− becomes. At this time, the light receiving position of the specularly reflected light detecting means 24 is shifted depending on the condition of the rough skin, and an electric signal corresponding to the amount of shift can be obtained depending on this position.
従って、演算処理手段28はこのずれ量が所定の基準値
を超えた時に否信号を出力し、また正反射光が前記基準
値より小さいかあるいは乱反射光が前記基準値より大き
い場合も同様に否信号を出力する。Therefore, the arithmetic processing means 28 outputs a rejection signal when the amount of deviation exceeds a predetermined reference value, and also outputs a rejection signal when the specularly reflected light is smaller than the reference value or the diffusely reflected light is larger than the reference value. Output a signal.
以−りのように、本発明によれば、各種の異なる欠陥に
対してそれぞれ被検査面22はその状態に応じた異なる
反射特性を示すことに着目し、正反射光及び乱反射光を
異なる検知手段によって受光し、各受光手段からの電気
信号を演算処理することによって表面欠陥の良否を判別
することができる。As described above, according to the present invention, attention is paid to the fact that the surface to be inspected 22 exhibits different reflection characteristics depending on the state of various different defects, and specularly reflected light and diffusely reflected light are detected differently. It is possible to determine whether the surface defect is good or bad by receiving light by the light receiving means and processing the electrical signals from each light receiving means.
【実施例1 以下図面に基づいて本発明の好適な実施例を説明する。[Example 1 Preferred embodiments of the present invention will be described below based on the drawings.
第2図には本発明の表面欠陥検査装置の好適な実施例が
示されており、図示した実施例は据置型検査装置を示し
、装置の光学系はフレーム30内に組込み固定されてい
る。FIG. 2 shows a preferred embodiment of the surface defect inspection apparatus of the present invention. The illustrated embodiment is a stationary inspection apparatus, and the optical system of the apparatus is installed and fixed within a frame 30.
そしてこのフレーム30の下面には位置決め足32.3
4が設けられており、被検査面22の所定位置にフレー
ム30を正しく位置決め保持することができる。Positioning feet 32.3 are provided on the lower surface of this frame 30.
4, the frame 30 can be correctly positioned and held at a predetermined position on the surface to be inspected 22.
勿論、本発明において、フレーム30は、連続的に移動
する被検査面22に近接して被検査面22と非接触状態
に保持することも可能である。Of course, in the present invention, the frame 30 can also be held in close proximity to the continuously moving surface to be inspected 22 and out of contact with the surface to be inspected 22.
前記フレーム30内には検査光供給手段20が設けられ
ており、実施例における検査光O1−1手段20は半導
体レーザ36とコリメータレンズ38とを含み、レーザ
ビームが検査光として用いられる。このレーザビーム検
査光りはフレーム30内に設けられているミラー40に
てその光路が折り曲げられ、被検査面22の所定検査部
に検査光が照射される。An inspection light supply means 20 is provided within the frame 30, and the inspection light O1-1 means 20 in the embodiment includes a semiconductor laser 36 and a collimator lens 38, and a laser beam is used as the inspection light. The optical path of this laser beam inspection light is bent by a mirror 40 provided within the frame 30, and a predetermined inspection portion of the surface to be inspected 22 is irradiated with the inspection light.
被検査面22からの反射光はフレーム30に固定された
ミラー42によって受光側に導かれ、フレーム30の受
光部には本発明の特徴である正反射光検知手段24及び
乱反射光検知手段26が配置されている。The reflected light from the surface to be inspected 22 is guided to the light receiving side by a mirror 42 fixed to the frame 30, and the light receiving portion of the frame 30 is equipped with a specular reflection light detection means 24 and a diffuse reflection light detection means 26, which are the features of the present invention. It is located.
実施例において前記検査光りはコリメータレンズ38に
よって1a+i径の平行ビームとして被検査面22に照
射され、前記各検査手段24.26もこの反射光に対応
した大きさの受光面を有する。In the embodiment, the inspection light is irradiated onto the surface to be inspected 22 as a parallel beam with a diameter of 1a+i by the collimator lens 38, and each of the inspection means 24 and 26 also has a light receiving surface of a size corresponding to this reflected light.
実施例において、正反射光検知手段24はCCDイメー
ジセンサからなり、その感光部中心は正反射光の光路と
一致するようにその固定位置が選択されている。In the embodiment, the specularly reflected light detection means 24 is composed of a CCD image sensor, and its fixed position is selected so that the center of its photosensitive portion coincides with the optical path of the specularly reflected light.
従って、正反射光検知手段24は被検査面22からの正
反射方向の反射光を受光し、反射光強度及びCCDイメ
ージセンサ−Lのビームスポット位置を光電検出し、正
反射光の大きさ及びその振れ量を電気信号として出力す
ることができる。Therefore, the specularly reflected light detection means 24 receives the reflected light in the specularly reflected direction from the surface to be inspected 22, photoelectrically detects the intensity of the reflected light and the beam spot position of the CCD image sensor L, and detects the magnitude of the specularly reflected light and the beam spot position of the CCD image sensor L. The amount of vibration can be output as an electrical signal.
一方、乱反射光検知手段26は実施例においてフォトダ
イオードからなり、前述したごとく、このフォトダイオ
ードは前記正反射光検知手段24と被検査面22との間
に配置され、正反射光の光路に対して開口部26aが設
けられている。従って、検知手段24は正反射光あるい
は前記開口部26aで許容される所定偏り量の正反射光
の受光を可能としている。そして、乱反射光検出手段2
6を構成するフォトダイオード自体は、前記正反射光検
知手段24のCCDイメージセンサより、大きな受光面
を形成している。On the other hand, the diffusely reflected light detecting means 26 is composed of a photodiode in the embodiment, and as described above, this photodiode is disposed between the specularly reflected light detecting means 24 and the surface to be inspected 22, and is connected to the optical path of the specularly reflected light. An opening 26a is provided. Therefore, the detection means 24 is capable of receiving specularly reflected light or specularly reflected light having a predetermined amount of deviation allowed by the aperture 26a. Then, the diffused reflected light detection means 2
The photodiode 6 itself forms a larger light-receiving surface than the CCD image sensor of the specular reflection light detection means 24.
従って、このフォトダイオードは正反射光の周りの拡散
反射光及び回折光を含む乱反射光を確実に受光し、この
乱反射光強度を光電検出することができる。前記両検知
手段24.26の出力であるアナログ電気信号は演算処
理手段28にて処理される。Therefore, this photodiode can reliably receive diffusely reflected light including diffusely reflected light and diffracted light around specularly reflected light, and photoelectrically detect the intensity of this diffusely reflected light. The analog electrical signals output from both the detection means 24 and 26 are processed by the arithmetic processing means 28.
実施例において、この演算処理手段28は、正反射光検
知手段24の出力を増幅する増幅器44a及びフィルタ
46aそして乱反射光検知手段26の出力を増幅する増
幅器44b及びフィルタ46bを含む。そして、両フィ
ルタ46a、46bの出力はADコンバータ48にてデ
ジタル信号に変換され、CPU50にこのデジタル信号
が出力される。CPU50は各信号に対する基準値を保
持しており、各入力信号とこれらの基準値とを比較して
表面欠陥の合否判別を行ない、実施例においては、その
合否結果が表示器52にて欠陥の合否判定結果として表
示される。In the embodiment, the arithmetic processing means 28 includes an amplifier 44a and a filter 46a for amplifying the output of the specularly reflected light detecting means 24, and an amplifier 44b and a filter 46b for amplifying the output of the diffusely reflected light detecting means 26. The outputs of both filters 46a and 46b are converted into digital signals by the AD converter 48, and this digital signal is output to the CPU 50. The CPU 50 holds reference values for each signal, and compares each input signal with these reference values to determine pass/fail for surface defects. Displayed as a pass/fail judgment result.
本実施例は以上の構成からなり、以下にその作用を説明
する。The present embodiment has the above configuration, and its operation will be explained below.
被検査面22の一例として、直径1ms前後のブツ、幅
5μm前後の傷、波長が1−10mm程度の肌荒れある
いはうねり、波長が0.1mm以下の光沢むら(粗さ)
が混在する塗装面の欠陥を検査する場合を考える。Examples of the inspected surface 22 include bumps with a diameter of about 1 ms, scratches with a width of about 5 μm, rough skin or undulations with a wavelength of about 1-10 mm, and uneven gloss (roughness) with a wavelength of 0.1 mm or less.
Consider the case where defects on a painted surface are inspected.
実施例の表面欠陥検査装置により、前述した塗装面の検
査を行なう場合、装置のフレーム30は被検査面22上
に位置決め足32.34にて載置され、所定の被検査面
に検査光が照射される。When inspecting the painted surface described above using the surface defect inspection device of the embodiment, the frame 30 of the device is placed on the surface to be inspected 22 with the positioning feet 32 and 34, and the inspection light is directed onto a predetermined surface to be inspected. irradiated.
本発明において、前記演算処理手段28は、フレーム3
0内に組込まれても、あるいはフレーム30からケーブ
ル等にて信号を導き、検査部とは異なる場所にて所定の
演算処理及び表示を行なうことも可能である。In the present invention, the arithmetic processing means 28
It is also possible to conduct predetermined arithmetic processing and display at a location different from the inspection section by leading the signal from the frame 30 via a cable or the like.
このような分離型装置によれば、作業環境の悪い部位で
の検査あるいは危険な場所での検査に好適である。Such a separate device is suitable for inspections in locations with poor working environments or in dangerous locations.
前記フレームの位置決めが完了すると、装置の電源がオ
ン操作され、この結果、検査光供給手段20の半導体レ
ーザ36からはレーザビームが放射され、前述した光路
をたどってビーム径1waの平行ビームが被検査面22
の所定検査部に照射される。When the positioning of the frame is completed, the power of the apparatus is turned on, and as a result, a laser beam is emitted from the semiconductor laser 36 of the inspection light supply means 20, and a parallel beam with a beam diameter of 1 wa is emitted by following the above-mentioned optical path. Inspection surface 22
is irradiated onto a predetermined inspection area.
前記ミラー40は115@のビーム折り曲げを行ない、
この結果、被検査面22では入射角65@のレーザビー
ム検査光が照射される。The mirror 40 performs beam bending of 115@,
As a result, the surface to be inspected 22 is irradiated with the laser beam inspection light having an incident angle of 65@.
被検査面22では、前述した各種の表面欠陥に応じた正
反射あるいは乱反射が起こり、これらの反射光がミラー
42によって115@の折り曲げ角度で各検知手段24
.26に導かれる。On the inspected surface 22, specular reflection or diffuse reflection occurs depending on the various surface defects described above, and these reflected lights are bent by the mirror 42 at an angle of 115@ to each detection means 24.
.. 26.
正反射光検知手段24を形成するCCDイメージセンサ
上に照射された正反射光はイメージセンサの各ビクセル
毎に順次アナログ電気信号に変換され、演算処理手段2
8に供給される。The specularly reflected light irradiated onto the CCD image sensor forming the specularly reflected light detecting means 24 is sequentially converted into an analog electrical signal for each pixel of the image sensor, and is converted into an analog electrical signal by the arithmetic processing means 2.
8.
第3図には、前記正反射光検知手段24のCCDイメー
ジセンサの受光面が模式的に示されており、図において
、受光面をXY座標で区切った各ピクセルが符号60で
示されている。FIG. 3 schematically shows the light-receiving surface of the CCD image sensor of the specular reflection light detection means 24, and in the figure, each pixel of the light-receiving surface divided by XY coordinates is indicated by 60. .
前記演算処理手段28において、前記各ピクセル60毎
のアナログ電気信号は増幅器44aで増幅された後にフ
ィルタ46aにてノイズ成分が除去され、ADコンバー
タ48によってデジタル信号としてCPU50に供給さ
れる。一方、被検査面22の凹凸欠陥に応じた反射光分
布を有する反射のうち乱反射光はミラー42で115
’折り曲げられたのち乱反射光検知手段26のフォトダ
イオード上に照射される。In the arithmetic processing means 28, the analog electrical signal for each pixel 60 is amplified by an amplifier 44a, noise components are removed by a filter 46a, and the AD converter 48 supplies the signal to the CPU 50 as a digital signal. On the other hand, among the reflections having a distribution of reflected light according to the unevenness defects on the surface to be inspected 22, the diffused reflected light is reflected by the mirror 42 at 115
'After being bent, it is irradiated onto the photodiode of the diffusely reflected light detection means 26.
従って、この乱反射光はフォトダイオードによってアナ
ログ電気信号に変換され、前記正反射光と同様に増幅及
びノイズ成分の除去が行われた後、デジタル信号として
CPU50に供給される。CPU50は前記両検知手段
24.26からの信号を基準値と比較して所定の合否判
定を行なう。正反射光に対して、CCDイメージセンサ
の各ピクセル60から得られる信号はその位置及び大き
さが予め定められた基準値と比較される。例えば直径1
1以上のブツに対しては、反射光はほとんど正反射光路
から外れ、この結果、CCDイメージセンサ上に照射さ
れる反射光強度は著しく減少するので、この大きさが基
準値より小さい場合には否信号を出力する。Therefore, this diffusely reflected light is converted into an analog electrical signal by a photodiode, and after being amplified and noise components removed in the same manner as the specularly reflected light, it is supplied to the CPU 50 as a digital signal. The CPU 50 compares the signals from both the detection means 24 and 26 with a reference value to make a predetermined pass/fail judgment. For specularly reflected light, the signal obtained from each pixel 60 of the CCD image sensor is compared in position and magnitude with a predetermined reference value. For example, diameter 1
For one or more dots, most of the reflected light deviates from the specular reflection optical path, and as a result, the intensity of the reflected light irradiated onto the CCD image sensor is significantly reduced, so if this size is smaller than the reference value, Outputs a rejection signal.
一方、正反射光の強度が基準値より大きい場合において
も、その位置即ち受光したピクセルの座標が例えば原点
イから所定値以上離れた口にある場合、正反射光の偏れ
部は被検査面22の肌荒れ 〜あるいはうねり
等を示すこととなり、この偏れ量が所定値を超えた場合
にも否信号を出力する。On the other hand, even if the intensity of the specularly reflected light is greater than the reference value, if the position, that is, the coordinates of the pixel that received the light, is, for example, at the mouth more than a predetermined distance from the origin A, the deflected portion of the specularly reflected light will be 22 indicates rough skin or undulation, and a negative signal is also output when this amount of deviation exceeds a predetermined value.
一方、乱反射光検知手段26からの信号はフォトダイオ
ードの出力強度と基桑値との比較を行なって合否の判定
に洪される。On the other hand, the signal from the diffusely reflected light detection means 26 is used to determine pass/fail by comparing the output intensity of the photodiode with the reference value.
即ち、被検査面22の表面に光沢むらがある場合、また
被検査面に傷、表面粗さによる拡散あるいは傷による回
折がある場合、前記乱反射光が増加し、CPU50は乱
反射光が所定値を超えたときに否信号を出力する。That is, when the surface of the surface to be inspected 22 has uneven gloss, or when the surface to be inspected has scratches, diffusion due to surface roughness, or diffraction due to scratches, the diffusely reflected light increases, and the CPU 50 determines whether the diffusely reflected light has reached a predetermined value. Outputs a rejection signal when the limit is exceeded.
以上のようにCPU50は予め定められた基準値に対し
て各検知手段24.26の出力を比較し、この結果に応
じて被検査面の合否を判定し、表示器50によってその
結果を表示する。As described above, the CPU 50 compares the output of each detection means 24 and 26 with a predetermined reference value, determines whether the surface to be inspected is acceptable or not according to the result, and displays the result on the display 50. .
従って、本発明によれば、被検査面22上に大小の凹凸
欠陥が異なる種類として混在する場合においても、この
ような欠陥を一度に正確に検査することが可能となる。Therefore, according to the present invention, even when different types of large and small uneven defects coexist on the surface to be inspected 22, it is possible to accurately inspect such defects at once.
前述した実施例は、塗装面の凹凸欠陥検査に対して説明
したが、本発明は、勿論、各種の製品あるいは物体表面
の欠陥検査として広範囲に利用可能である。Although the above-described embodiments have been described for inspecting unevenness defects on painted surfaces, the present invention can of course be widely used for inspecting defects on the surfaces of various products or objects.
「発明の効果〕
以」ユ説明したように、本発明によれば、被検査面から
の反射光を2種類の検知手段すなわち正反射光検知手段
と乱反射光検知手段によって光電変換し、この結果、正
反射光の大きさ及び偏れ量、そして乱反射光の大きさを
それぞれ別個に電気信号として険出し、この結果、被検
査面の異なる種類の凹凸欠陥に対して一度に迅速かつ正
確に表面欠陥の検査を行なうことができるという優れた
効果を奏する。[Effects of the Invention] As explained below, according to the present invention, reflected light from a surface to be inspected is photoelectrically converted by two types of detection means, that is, a specular reflection light detection means and a diffused reflection light detection means, and the resulting , the size and deflection of the specularly reflected light, and the size of the diffusely reflected light are separately output as electrical signals.As a result, different types of uneven defects on the surface to be inspected can be quickly and accurately inspected at the same time. This provides an excellent effect in that defects can be inspected.
第1図は本発明にかかる表面欠陥検査装置の原理を説明
する構成図、
第2図は本発明にかかる表面欠陥検査装置の好適な実施
例を示す説明図、
第3図は第2図の実施例における正反射光検知手段24
のCCDイメージセンサの受光面を示す説明図、
第4. 5. 6図は従来の表面欠陥検査装置の原理を
示す説明図である。
20・・・検査光供給手段
22・・・被検査面
24・・・正反射光検知手段
26・・・乱反射光検知手段
28・・・演算処理手段
26a・・・開口部
出願人 株式会社 豊田中央研究所FIG. 1 is a configuration diagram explaining the principle of the surface defect inspection device according to the present invention, FIG. 2 is an explanatory diagram showing a preferred embodiment of the surface defect inspection device according to the present invention, and FIG. 3 is the same as in FIG. Specular reflection light detection means 24 in the embodiment
Explanatory diagram showing the light receiving surface of the CCD image sensor of 4th. 5. FIG. 6 is an explanatory diagram showing the principle of a conventional surface defect inspection device. 20... Inspection light supply means 22... Surface to be inspected 24... Specular reflection light detection means 26... Diffuse reflection light detection means 28... Arithmetic processing means 26a... Aperture Applicant Toyota Co., Ltd. Central Research Institute
Claims (1)
段と、 被検査面で反射された正反射光を受光して電気信号に変
換出力する正反射光検知手段と、 被検査面で反射された拡散反射光及び零次以外の回折光
を含む乱反射光を受光して電気信号に変換出力する乱反
射光検知手段と、 前記両検知手段の電気信号を演算処理して被検査面上の
欠陥の合否判別を行なう演算処理手段と、を含み、 前記正反射光検知手段は正反射光の光路上に配置された
正反射用光電変換器を含み、 前記乱反射光検知手段は、前記正反射用光電変換器と被
検査面との間に配置され正反射光の光路に対して開口部
が設けられ比較的広い受光面を有する乱反射用光電変換
器を含む、 ことを特徴とする表面欠陥検査装置。(1) Inspection light supply means for irradiating inspection light onto the surface to be inspected; specular reflection light detection means for receiving the specularly reflected light reflected by the surface to be inspected, converting it into an electrical signal, and outputting it; and the surface to be inspected. a diffusely reflected light detecting means for receiving diffusely reflected light including diffusely reflected light and non-zero-order diffracted light reflected by the object, converting it into an electrical signal, and outputting it; arithmetic processing means for determining whether the defect is acceptable, the specular reflection light detection means includes a specular reflection photoelectric converter disposed on the optical path of the specular reflection light, and the diffused reflection light detection means A surface defect characterized by comprising a photoelectric converter for diffuse reflection that is disposed between the photoelectric converter for reflection and a surface to be inspected, has an opening for the optical path of specularly reflected light, and has a relatively wide light-receiving surface. Inspection equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26600987A JPH01107103A (en) | 1987-10-20 | 1987-10-20 | Surface flaw inspection apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26600987A JPH01107103A (en) | 1987-10-20 | 1987-10-20 | Surface flaw inspection apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01107103A true JPH01107103A (en) | 1989-04-25 |
Family
ID=17425104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26600987A Pending JPH01107103A (en) | 1987-10-20 | 1987-10-20 | Surface flaw inspection apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107103A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993000566A1 (en) * | 1991-06-27 | 1993-01-07 | Macmillan Bloedel Limited | Roughness detector |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62163951A (en) * | 1986-01-14 | 1987-07-20 | Kobe Steel Ltd | Surface defect detector |
-
1987
- 1987-10-20 JP JP26600987A patent/JPH01107103A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62163951A (en) * | 1986-01-14 | 1987-07-20 | Kobe Steel Ltd | Surface defect detector |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993000566A1 (en) * | 1991-06-27 | 1993-01-07 | Macmillan Bloedel Limited | Roughness detector |
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