JPH01110454U - - Google Patents
Info
- Publication number
- JPH01110454U JPH01110454U JP517188U JP517188U JPH01110454U JP H01110454 U JPH01110454 U JP H01110454U JP 517188 U JP517188 U JP 517188U JP 517188 U JP517188 U JP 517188U JP H01110454 U JPH01110454 U JP H01110454U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- conductive metal
- material layer
- insulating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
Description
第１図は本考案の一実施例を示す発光ダイオー
ド配線基材の縦断面図、第２図は同上の斜視図、
第３図は他の実施例を示す縦断面図、第４図は同
上の配線基材の使用例を示す縦断面図、第５図は
従来例を示す縦断面図である。
１，１１……発光ダイオード配線基材、２……
発光ダイオード、２ａ……針状端子、３，１３…
…絶縁材層、４……導電性金属板。
FIG. 1 is a vertical sectional view of a light emitting diode wiring base material showing an embodiment of the present invention, FIG. 2 is a perspective view of the same as above,
FIG. 3 is a longitudinal sectional view showing another embodiment, FIG. 4 is a longitudinal sectional view showing an example of use of the above wiring base material, and FIG. 5 is a longitudinal sectional view showing a conventional example. 1, 11... Light emitting diode wiring base material, 2...
Light emitting diode, 2a... Needle terminal, 3, 13...
...Insulating material layer, 4... Conductive metal plate.
Claims (1)
属板とで、発光ダイオードの１対の針状端子が挾
持して両導電性金属板と接触可能な厚みを有する
可撓性の帯板状に形成されてなる発光ダイオード
配線基材。 A flexible band plate consisting of an insulating material layer and conductive metal plates attached to both sides of the insulating material layer and having a thickness such that a pair of needle-like terminals of a light emitting diode can be sandwiched and come into contact with both conductive metal plates. A light emitting diode wiring base material formed into a shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP517188U JPH01110454U (en) | 1988-01-19 | 1988-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP517188U JPH01110454U (en) | 1988-01-19 | 1988-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01110454U true JPH01110454U (en) | 1989-07-26 |
Family
ID=31208314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP517188U Pending JPH01110454U (en) | 1988-01-19 | 1988-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01110454U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009532882A (en) * | 2006-03-31 | 2009-09-10 | スリーエム イノベイティブ プロパティズ カンパニー | LED mounting structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6161854B2 (en) * | 1984-04-23 | 1986-12-27 | Hitachi Ltd |
-
1988
- 1988-01-19 JP JP517188U patent/JPH01110454U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6161854B2 (en) * | 1984-04-23 | 1986-12-27 | Hitachi Ltd |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009532882A (en) * | 2006-03-31 | 2009-09-10 | スリーエム イノベイティブ プロパティズ カンパニー | LED mounting structure |