JPH01111495U - - Google Patents
Info
- Publication number
- JPH01111495U JPH01111495U JP686088U JP686088U JPH01111495U JP H01111495 U JPH01111495 U JP H01111495U JP 686088 U JP686088 U JP 686088U JP 686088 U JP686088 U JP 686088U JP H01111495 U JPH01111495 U JP H01111495U
- Authority
- JP
- Japan
- Prior art keywords
- mica
- heating wire
- latching groove
- mica plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010445 mica Substances 0.000 claims description 6
- 229910052618 mica group Inorganic materials 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 2
Landscapes
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Cookers (AREA)
Description
第１図ないし第３図は第１実施例を示しており
、第１図は平面図、第２図は取付け状態を示す断
面図、第３図は要部の分解斜視図、第４図は第２
実施例を示す分解斜視図、第５図は同断面図、第
６図は第３実施例を示す平面図、第７図は第４実
施例を示す平面図である。
４…マイカヒータ、５…電熱線、６…マイカ板
、１２…応力分散用切込み溝、１３…掛止め溝。
Figures 1 to 3 show the first embodiment, where Figure 1 is a plan view, Figure 2 is a sectional view showing the installed state, Figure 3 is an exploded perspective view of the main parts, and Figure 4 is Second
FIG. 5 is an exploded perspective view showing the embodiment, FIG. 5 is a sectional view thereof, FIG. 6 is a plan view showing the third embodiment, and FIG. 7 is a plan view showing the fourth embodiment. 4... Mica heater, 5... Heating wire, 6... Mica plate, 12... Cut groove for stress dispersion, 13... Latching groove.
Claims (1)
成し、該掛止め溝に電熱線を介装してなるマイカ
ヒータにおいて、前記マイカ板の外周に複数の応
力分散用切込み溝を放射状に設けたことを特徴と
するマイカヒータ。 In a mica heater in which a heating wire latching groove is formed at the edge of a disc-shaped mica plate, and a heating wire is inserted into the latching groove, a plurality of stress dispersion cut grooves are radially formed on the outer periphery of the mica plate. A mica heater characterized by being installed in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP686088U JPH01111495U (en) | 1988-01-21 | 1988-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP686088U JPH01111495U (en) | 1988-01-21 | 1988-01-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01111495U true JPH01111495U (en) | 1989-07-27 |
Family
ID=31211383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP686088U Pending JPH01111495U (en) | 1988-01-21 | 1988-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01111495U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03100390U (en) * | 1989-07-31 | 1991-10-21 |
-
1988
- 1988-01-21 JP JP686088U patent/JPH01111495U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03100390U (en) * | 1989-07-31 | 1991-10-21 |