JPH01112077U - - Google Patents
Info
- Publication number
- JPH01112077U JPH01112077U JP772788U JP772788U JPH01112077U JP H01112077 U JPH01112077 U JP H01112077U JP 772788 U JP772788 U JP 772788U JP 772788 U JP772788 U JP 772788U JP H01112077 U JPH01112077 U JP H01112077U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- equivalent
- lands
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のプリント基板実装構造の一実
施例を示す図、第２図は従来のプリント基板実装
構造の一例を示す図、第３図は半田付けのようす
を示す側面図、第４図は従来のプリント基板実装
構造における半田付けの結果を示す図、第５図は
第１図中の各ランド部の配置を示す図、第６図は
本考案のプリント基板実装構造における半田付け
の結果を示す図、第７図は実験に採用した基板上
のＩＣの配置を示す図、第８図は実験結果を示す
グラフである。
１…プリント基板、２…ランド部、２ｂ…幅広
ランド部、３…ＳＯＰ型ＩＣ、４…リード線。
1 is a diagram showing an embodiment of the printed circuit board mounting structure of the present invention, FIG. 2 is a diagram showing an example of a conventional printed circuit board mounting structure, FIG. 3 is a side view showing the soldering process, and FIG. Figure 5 shows the results of soldering in the conventional printed circuit board mounting structure, Figure 5 shows the arrangement of each land in Figure 1, and Figure 6 shows the soldering results in the printed circuit board mounting structure of the present invention. FIG. 7 is a diagram showing the arrangement of ICs on the substrate used in the experiment, and FIG. 8 is a graph showing the experimental results. 1... Printed circuit board, 2... Land portion, 2b... Wide land portion, 3... SOP type IC, 4... Lead wire.
Claims (1)
固定し噴流式半田槽を通してＳＯＰ型ＩＣ又はそ
の同等品の複数のリード線とプリント基板の複数
のランド部とを半田付けするプリント基板実装構
造において、 前記複数のランド部のうち最後に半田噴流と離
れるランド部の面積を他のランド部の面積より大
きくなした ことを特徴とするプリント基板実装構造。[Claim for Utility Model Registration] Fixing an SOP type IC or its equivalent to a printed circuit board and soldering multiple lead wires of the SOP type IC or its equivalent to multiple lands of the printed circuit board through a jet soldering bath. A printed circuit board mounting structure characterized in that the area of the last of the plurality of lands that separates from the solder jet is larger than the area of the other land sections.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP772788U JPH01112077U (en) | 1988-01-22 | 1988-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP772788U JPH01112077U (en) | 1988-01-22 | 1988-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01112077U true JPH01112077U (en) | 1989-07-27 |
Family
ID=31212985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP772788U Pending JPH01112077U (en) | 1988-01-22 | 1988-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01112077U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016086070A (en) * | 2014-10-24 | 2016-05-19 | 富士ゼロックス株式会社 | Substrate, substrate device, and method of manufacturing substrate device |
-
1988
- 1988-01-22 JP JP772788U patent/JPH01112077U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016086070A (en) * | 2014-10-24 | 2016-05-19 | 富士ゼロックス株式会社 | Substrate, substrate device, and method of manufacturing substrate device |
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