JPH01113353U - - Google Patents

Info

Publication number
JPH01113353U
JPH01113353U JP812188U JP812188U JPH01113353U JP H01113353 U JPH01113353 U JP H01113353U JP 812188 U JP812188 U JP 812188U JP 812188 U JP812188 U JP 812188U JP H01113353 U JPH01113353 U JP H01113353U
Authority
JP
Japan
Prior art keywords
component
microwave component
shaped
components
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP812188U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP812188U priority Critical patent/JPH01113353U/ja
Publication of JPH01113353U publication Critical patent/JPH01113353U/ja
Pending legal-status Critical Current

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Landscapes

  • Waveguide Connection Structure (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａ〜Ｆは本考案に係るマイクロ波部品の
６つの実施例を示す断面図、第２図は同上マイク
ロ波部品の外観図、第３図は従来のマイクロ波部
品の断面図である。 １……金属基板、２……マイクロ波素子、３…
…はんだ層または接着層、４……余剰はんだまた
は余剰接着剤、５……溝状空間。 Figures 1 A to F are cross-sectional views showing six embodiments of the microwave component according to the present invention, Figure 2 is an external view of the same microwave component, and Figure 3 is a cross-sectional view of a conventional microwave component. . 1...metal substrate, 2...microwave element, 3...
...Solder layer or adhesive layer, 4... Surplus solder or excess adhesive, 5... Groove-shaped space.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ２つの板状部品を重ねてはんだ付けまたは接着
する構造のマイクロ波部品であつて、部品端面よ
り内側において両部品の接合面の最外周部分に余
剰はんだまたは接着剤を収容するための溝状空隙
を形成したことを特徴とするマイクロ波部品。 A microwave component having a structure in which two plate-shaped components are stacked and soldered or bonded, and a groove-shaped void for accommodating excess solder or adhesive at the outermost periphery of the joint surface of both components inside the end surface of the component. A microwave component characterized by forming.
JP812188U 1988-01-27 1988-01-27 Pending JPH01113353U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP812188U JPH01113353U (en) 1988-01-27 1988-01-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP812188U JPH01113353U (en) 1988-01-27 1988-01-27

Publications (1)

Publication Number Publication Date
JPH01113353U true JPH01113353U (en) 1989-07-31

Family

ID=31213716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP812188U Pending JPH01113353U (en) 1988-01-27 1988-01-27

Country Status (1)

Country Link
JP (1) JPH01113353U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173861A (en) * 1984-02-20 1985-09-07 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173861A (en) * 1984-02-20 1985-09-07 Hitachi Ltd Semiconductor device

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