JPH01115929A - ジアセチレン基を含有するポリアミドの製造方法 - Google Patents
ジアセチレン基を含有するポリアミドの製造方法Info
- Publication number
- JPH01115929A JPH01115929A JP27167287A JP27167287A JPH01115929A JP H01115929 A JPH01115929 A JP H01115929A JP 27167287 A JP27167287 A JP 27167287A JP 27167287 A JP27167287 A JP 27167287A JP H01115929 A JPH01115929 A JP H01115929A
- Authority
- JP
- Japan
- Prior art keywords
- group
- groups
- diacetylene
- containing diacetylene
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polyamides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27167287A JPH01115929A (ja) | 1987-10-29 | 1987-10-29 | ジアセチレン基を含有するポリアミドの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27167287A JPH01115929A (ja) | 1987-10-29 | 1987-10-29 | ジアセチレン基を含有するポリアミドの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01115929A true JPH01115929A (ja) | 1989-05-09 |
| JPH0359088B2 JPH0359088B2 (th) | 1991-09-09 |
Family
ID=17503270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27167287A Granted JPH01115929A (ja) | 1987-10-29 | 1987-10-29 | ジアセチレン基を含有するポリアミドの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115929A (th) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002024785A1 (fr) * | 2000-09-21 | 2002-03-28 | Sumitomo Bakelite Company, Ltd. | Precurseur de resine resistant a la chaleur, resine resistante a la chaleur, couche isolante isolant et dispositif semiconducteur |
| US6518390B2 (en) | 2000-03-29 | 2003-02-11 | Sumitomo Bakelite Company, Ltd. | Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device |
| JP2005015406A (ja) * | 2003-06-27 | 2005-01-20 | Fuji Photo Film Co Ltd | 化合物、液晶材料、液晶組成物、光学フィルム、及び該化合物の製造方法 |
| EP1158839A3 (en) * | 2000-04-27 | 2006-01-11 | Fujitsu Limited | Organic luminous material and organic light-emitting device |
| WO2010036170A1 (en) * | 2008-09-23 | 2010-04-01 | Nexam Chemical Ab | Acetylenic polyamide |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0198626A (ja) * | 1987-10-12 | 1989-04-17 | Agency Of Ind Science & Technol | ジアセチレン基を含有するポリアミドの成形体 |
-
1987
- 1987-10-29 JP JP27167287A patent/JPH01115929A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0198626A (ja) * | 1987-10-12 | 1989-04-17 | Agency Of Ind Science & Technol | ジアセチレン基を含有するポリアミドの成形体 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6518390B2 (en) | 2000-03-29 | 2003-02-11 | Sumitomo Bakelite Company, Ltd. | Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device |
| EP1158839A3 (en) * | 2000-04-27 | 2006-01-11 | Fujitsu Limited | Organic luminous material and organic light-emitting device |
| EP1760799A3 (en) * | 2000-04-27 | 2007-06-27 | Fujitsu Ltd. | Organic luminous material and organic light-emitting device |
| WO2002024785A1 (fr) * | 2000-09-21 | 2002-03-28 | Sumitomo Bakelite Company, Ltd. | Precurseur de resine resistant a la chaleur, resine resistante a la chaleur, couche isolante isolant et dispositif semiconducteur |
| KR100787284B1 (ko) * | 2000-09-21 | 2007-12-20 | 스미토모 베이클리트 컴퍼니 리미티드 | 내열성 수지 전구체, 내열성 수지 및 절연막 및 반도체장치 |
| JP2005015406A (ja) * | 2003-06-27 | 2005-01-20 | Fuji Photo Film Co Ltd | 化合物、液晶材料、液晶組成物、光学フィルム、及び該化合物の製造方法 |
| WO2010036170A1 (en) * | 2008-09-23 | 2010-04-01 | Nexam Chemical Ab | Acetylenic polyamide |
| US8492507B2 (en) | 2008-09-23 | 2013-07-23 | Nexam Chemical Ab | Acetylenic polyamide |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0359088B2 (th) | 1991-09-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |