JPH01116043A - Material for piezoelectric vibrator case - Google Patents
Material for piezoelectric vibrator caseInfo
- Publication number
- JPH01116043A JPH01116043A JP6723488A JP6723488A JPH01116043A JP H01116043 A JPH01116043 A JP H01116043A JP 6723488 A JP6723488 A JP 6723488A JP 6723488 A JP6723488 A JP 6723488A JP H01116043 A JPH01116043 A JP H01116043A
- Authority
- JP
- Japan
- Prior art keywords
- resistance
- less
- piezoelectric vibrator
- piezoelectric
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、圧電(水晶)振動子ケース用材料に関し、さ
らに詳しくは絞り加工性、耐食性に優れた封止型の圧電
振動子ケース用材料に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a material for a case of a piezoelectric (crystal) resonator, and more specifically, a material for a case of a sealed piezoelectric resonator that has excellent drawing workability and corrosion resistance. Regarding.
圧電素子は発振子、共振子、フィルタ、移相器などに広
く用いられており、特に水晶振動子は電子機器の需要の
拡大に伴い、技術開発が盛んに進められている。Piezoelectric elements are widely used in oscillators, resonators, filters, phase shifters, etc., and technical development of crystal resonators in particular is actively progressing as demand for electronic devices increases.
圧電材料には水晶やチタン酸ジルコン酸鉛セラミックな
どがあるが、これに適当な電極を配置して交流電界を加
えると、圧電効果によってこれと等しい周波数の応力、
または歪を生じ、電界の周波数が材料の弾性振動の固有
周波数に一致した場合に共振して強勢な振動を行う。圧
電素子はこの現象を利用したもので、圧電基板に電極を
配置し、これを支持線により機械的に支持してケース内
に封入しである。Piezoelectric materials include quartz and lead zirconate titanate ceramics, but when appropriate electrodes are placed on these materials and an alternating electric field is applied to them, the piezoelectric effect creates a stress of the same frequency as the piezoelectric material.
Alternatively, it causes strain, and when the frequency of the electric field matches the natural frequency of the material's elastic vibration, it resonates and causes strong vibration. A piezoelectric element takes advantage of this phenomenon, and consists of electrodes placed on a piezoelectric substrate, mechanically supported by support wires, and enclosed in a case.
従来、かかる封止型の圧電(水晶)振動子ケース用材料
としては、64Cu−18Ni−Zn等の洋白が主に使
用されてきている。この種材料としては、強度、絞り加
工性、耐食性、耐応力腐食割れ性、めっき性、はんだ付
は性等の多くの特性に優れていなければならないことは
勿論のこと、さらにベース材料であるFe−29Ni−
17C。Hitherto, nickel silver such as 64Cu-18Ni-Zn has been mainly used as a material for such a sealed piezoelectric (crystal) resonator case. This kind of material must have excellent properties such as strength, drawability, corrosion resistance, stress corrosion cracking resistance, plating performance, and solderability. -29Ni-
17C.
あるいはFe−42Niとの抵抗溶接性が優れているこ
とが必要である。Alternatively, it is necessary to have excellent resistance weldability with Fe-42Ni.
また、圧電振動子は電子部品であり、その例外として扱
われることは不可能であり、それを構成する小さな部品
まで種々の面で見直されてきている。Furthermore, piezoelectric vibrators are electronic components and cannot be treated as an exception, and even the small components that make up the piezoelectric vibrators have been reconsidered from various aspects.
この圧電振動子ケース用材料として使用されている洋白
は、強度、絞り加工性、Fe−42Niとの抵抗溶接性
は優れているが、はんだ特性、耐食性、耐応力腐食割れ
性およびめっき性等に難点があり、これを補うためにN
iめっき等のめっきが施されて使用されており、また、
洋白は一般に水平連鋳後、冷間圧延と焼鈍とを繰り返し
施されて板材とされるので工程が非常に煩雑となり、高
価になっている。The nickel silver used as the material for this piezoelectric vibrator case has excellent strength, drawing workability, and resistance weldability with Fe-42Ni, but it also has poor solderability, corrosion resistance, stress corrosion cracking resistance, and plating properties. There is a problem with N.
It is used with plating such as i-plating, and
Generally, after horizontal continuous casting, nickel silver is repeatedly cold rolled and annealed to make a plate material, which makes the process very complicated and expensive.
本発明は上述の圧電振動子ケース用材料として従来から
使用されてきている洋白の長所である、高強度、優れた
絞り加工性、優れたFe−42Niとの抵抗溶接性を有
しており、かつ、洋白より優れたはんだ付は性、耐食性
、耐応力腐食割れ性を有する安価なCu −Z n −
N i −M n系合金の圧電振動子ケース用材料を提
供するものである。The present invention has the advantages of nickel silver, which has been conventionally used as a material for piezoelectric vibrator cases, such as high strength, excellent drawability, and excellent resistance weldability with Fe-42Ni. , and has superior soldering properties, corrosion resistance, and stress corrosion cracking resistance than nickel silver.
The present invention provides a piezoelectric vibrator case material made of a Ni-Mn alloy.
本発明に係る圧電振動子ケース用材料は下記のとおりで
ある。The material for the piezoelectric vibrator case according to the present invention is as follows.
重量%で3%以上20%未満のZn、1%以上15%以
下のNi、0.001%以上2.0%以下のMnを含み
、さらに副成分としてCr、Go、Zr、Be、As、
P%Pb、Si、Ti、Mg、Fe、Alの各0.00
1%以上2.0%以下又はSn0.001%以上0.1
%未満の群の中から選ばれた1種又は2種以上を0.0
01%以上2.0%以下を含み、残部Cu及び不可避的
不純物からなることを特徴とする圧電振動子ケース用材
料に関する。Contains Zn of 3% to less than 20% by weight, Ni of 1% to 15%, Mn of 0.001% to 2.0%, and further contains Cr, Go, Zr, Be, As, as subcomponents.
P% Pb, Si, Ti, Mg, Fe, Al each 0.00
1% or more and 2.0% or less or Sn0.001% or more and 0.1
0.0% of one or more selected from the group less than 0.0%
The present invention relates to a material for a piezoelectric vibrator case, characterized in that it contains 0.01% or more and 2.0% or less, and the remainder consists of Cu and inevitable impurities.
上記本発明にかかる圧電振動子ケース用材料の含有成分
及び成分割合の限定理由について説明する。The reasons for limiting the components and component ratios of the piezoelectric vibrator case material according to the present invention will be explained.
Cu及びZnは本発明材料の基本成分であり、加工性、
機械的性質及び深絞り加工性を良好にする。Cu and Zn are the basic components of the material of the present invention, and improve processability,
Improves mechanical properties and deep drawing workability.
Zn含有量を3wt%以上20wt%未満とする理由は
、Zn含有量が3wt%未満では強度向上に効果がなく
、また、20wt%以上でははんだ付は性が劣化するた
めである。The reason why the Zn content is set to 3 wt% or more and less than 20 wt% is that if the Zn content is less than 3 wt%, it will not be effective in improving the strength, and if it is 20 wt% or more, the soldering properties will deteriorate.
望ましくはZnを10wt%以上含有する方が強度も高
く、しかも安価になる。Preferably, containing 10 wt % or more of Zn provides higher strength and lower cost.
Niは強度、耐食性、耐応力腐食割れ性を向上させる元
素であり、Ni含有量を1wt%以上15wt%以下と
する理由は、Ni含有量が1wt%未満では効果がほと
んどなく、15wt%を超えると、加工性、はんだ付は
性が劣化し、価格も高くなるためである。Ni is an element that improves strength, corrosion resistance, and stress corrosion cracking resistance, and the reason why the Ni content is set to 1 wt% or more and 15 wt% or less is that if the Ni content is less than 1 wt%, there is almost no effect, and if it exceeds 15 wt%. This is because processability and soldering properties deteriorate, and the price also increases.
Mnは熱間加工性を改善するとともに、深絞り性をも改
善する元素であり、かつ強度を向上させる元素である。Mn is an element that improves hot workability, deep drawability, and strength.
Mn含有量をO,001wt%以上2.0wt%以下と
する理由は、Mn含有量が0.001wt%未満では効
果がほとんどなく。The reason why the Mn content is set to 0.001 wt% or more and 2.0 wt% or less is that if the Mn content is less than 0.001 wt%, there is almost no effect.
2.0wt%を超えると、はんだ付は性が劣化するため
である。This is because if it exceeds 2.0 wt%, soldering properties will deteriorate.
また、副成分のCr、Co、Zr、Be、As、P、P
b、Si、Ti、Mg、Fe、AI、Snは脱酸剤又は
強度を向上させる元素として添加するものであり、これ
らの1種又は2種以上を0゜001wt%以上2.0w
t%以下添加する(但し、SnについてはO,001w
t%以上0.1wt%未満の範囲で)理由は、O,00
1wt%未満ではその効果がなく、2.0wt%を超え
ると強度は向上するが、加工性、はんだ付は性が劣化す
るためである。In addition, the subcomponents Cr, Co, Zr, Be, As, P, P
b, Si, Ti, Mg, Fe, AI, and Sn are added as deoxidizers or elements that improve strength, and one or more of these are added at a concentration of 0°001wt% or more 2.0w
Add up to t% (however, for Sn, O,001w
t% or more and less than 0.1wt%) The reason is O,00
This is because if it is less than 1 wt%, there is no effect, and if it exceeds 2.0 wt%, the strength will improve, but the workability and soldering properties will deteriorate.
次に本発明の詳細な説明する。 Next, the present invention will be explained in detail.
第1表に示す組成の合金を溶製し、熱間圧延及び適宜冷
間圧延、焼鈍を行い、10〜15μm程度の結晶粒の大
きさの厚さQ、25mn+の板を作製した。An alloy having the composition shown in Table 1 was melted and subjected to hot rolling, appropriate cold rolling, and annealing to produce a plate having a thickness Q of 25 mm+ and a crystal grain size of about 10 to 15 μm.
これらの合金について、引張強さ、伸び、限界絞り比、
はんだ付は性、Niめっき性、耐食性。For these alloys, tensile strength, elongation, critical drawing ratio,
Good soldering properties, Ni plating properties, and corrosion resistance.
耐応力腐食割れ性を調査した。結果を第1表に併記する
。The stress corrosion cracking resistance was investigated. The results are also listed in Table 1.
引張り強さ、伸びはJISS号引張試験片を用い、テン
シロン型引張試験機を使用し評価した。Tensile strength and elongation were evaluated using a JISS No. tensile test piece and a Tensilon type tensile tester.
限界絞り比は、33mφのポンチを使用し、深絞り試験
を行い求めた。The critical drawing ratio was determined by performing a deep drawing test using a 33 mφ punch.
はんだ付は性は230’C56S n / 4 P b
はんだ浴中に、ロジン−メタノールをフラックスとして
使用し、表面を$1200エメリー紙により、研摩tw
Q
した試験片(0,25xlOx50 )を5秒間浸漬
し、はんだの濡れ状態を調査した。Soldering is 230'C56S n/4P b
In a solder bath, use rosin-methanol as a flux and polish the surface with $1200 emery paper.
A test piece (0.25xlOx50) was immersed for 5 seconds to investigate the wetting state of the solder.
Niめっき性は、ワット浴(硫酸ニッケル240 g
/ Q、塩化ニッケル40g/Q、ホウ酸35g/Q)
にてNiめっきを1.5μm行った後、180゜密着面
げを1回行い、曲げ部でのめっき密着性を調べた。Ni plating properties were determined using Watts bath (240 g of nickel sulfate).
/ Q, nickel chloride 40g/Q, boric acid 35g/Q)
After Ni plating was performed to a thickness of 1.5 μm, 180° close contact surface bevelling was performed once, and the plating adhesion at the bent portion was examined.
を196時間暴露し、外観をll!察した。Exposed for 196 hours, the appearance is ll! I guessed it.
耐応力腐食割れ性は、JIS C8306に準じ、ブ
ランク径66+m、ポンチ径33閤でカップに成形した
各材料のNiめっき(1,5μ@)前後のものについて
試験液IQ含む内容積10flのデシケータ中(20+
2℃)ニ入れ、100,200,500時間経過後デ
シケータ中より取り出し、割れ発生の有無を確認した。Stress corrosion cracking resistance was determined in accordance with JIS C8306 for each material before and after Ni plating (1.5 μ@) formed into a cup with a blank diameter of 66+ m and a punch diameter of 33 in a desiccator with an internal volume of 10 fl containing test liquid IQ. (20+
After 100, 200, and 500 hours, the samples were taken out of the desiccator and checked for cracks.
なお、試験液は、特級塩化アンモニウム107gを約7
00mQの蒸留水に溶解し、その溶液に特級水酸化ナト
リウム50〜70gを約250mQの蒸留水に溶解させ
た液を加え、水素イオン濃度(pH)が10になったと
き、全量が約IQになるように蒸留水を加え調整した。In addition, the test liquid is about 7 g of special grade ammonium chloride.
00 mQ of distilled water, and add a solution of 50 to 70 g of special grade sodium hydroxide dissolved in about 250 mQ of distilled water, and when the hydrogen ion concentration (pH) reaches 10, the total amount becomes about IQ. Distilled water was added to adjust.
第1表から明らかなように比較合金に比べ、本発明合金
は、強度、はんだ付は性、耐食性が良好で、深絞り性、
耐応力腐食割れ性も優れている。As is clear from Table 1, compared to the comparative alloys, the alloy of the present invention has good strength, solderability, corrosion resistance, deep drawability,
It also has excellent stress corrosion cracking resistance.
しかも洋白などに比べ著しく安価に製造できるという特
徴を有している。Moreover, it has the characteristic that it can be manufactured at a significantly lower cost than other materials such as nickel silver.
以上詳述したように1本発明合金は、十分な強度、深絞
り性を有し、耐応力腐食割れ性も良好で、しかも安価で
あることから、圧電振動子ケース用材料に最適である。As detailed above, the alloy of the present invention has sufficient strength, deep drawability, good stress corrosion cracking resistance, and is inexpensive, so it is optimal as a material for a piezoelectric vibrator case.
Claims (1)
5%以下のNi、0.001%以上2.0%以下のMn
を含み、さらに副成分としてそれぞれ0.001%以上
2.0%以下のCr、Co、Zr、Be、As、P、P
b、Si、Ti、Mg、Fe、Al又は0.001%以
上0.1%未満のSnの群の中から選ばれた1種又は2
種以上を総量で0.001%以上2.0%以下を含み、
残部Cu及び不可避的不純物からなることを特徴とする
圧電振動子ケース用材料。(1) Zn of 3% or more and less than 20% by weight, 1% or more1
5% or less Ni, 0.001% or more and 2.0% or less Mn
Cr, Co, Zr, Be, As, P, P in an amount of 0.001% or more and 2.0% or less as subcomponents.
b, one or two selected from the group of Si, Ti, Mg, Fe, Al, or 0.001% or more and less than 0.1% Sn
Contains 0.001% or more and 2.0% or less of seeds or more in total amount,
A material for a piezoelectric vibrator case, characterized in that the remainder consists of Cu and unavoidable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6723488A JPH01116043A (en) | 1988-03-23 | 1988-03-23 | Material for piezoelectric vibrator case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6723488A JPH01116043A (en) | 1988-03-23 | 1988-03-23 | Material for piezoelectric vibrator case |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27164787A Division JPH01116041A (en) | 1987-10-29 | 1987-10-29 | Material for piezoelectric vibrator case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01116043A true JPH01116043A (en) | 1989-05-09 |
Family
ID=13339021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6723488A Pending JPH01116043A (en) | 1988-03-23 | 1988-03-23 | Material for piezoelectric vibrator case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01116043A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5578890A (en) * | 1994-12-29 | 1996-11-26 | The United States Of America As Represented By The Secretary Of The Army | Crystal resonator package |
| CN105171267A (en) * | 2015-07-21 | 2015-12-23 | 安徽江威精密制造有限公司 | Lead-free solder and manufacturing method and application thereof |
-
1988
- 1988-03-23 JP JP6723488A patent/JPH01116043A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5578890A (en) * | 1994-12-29 | 1996-11-26 | The United States Of America As Represented By The Secretary Of The Army | Crystal resonator package |
| CN105171267A (en) * | 2015-07-21 | 2015-12-23 | 安徽江威精密制造有限公司 | Lead-free solder and manufacturing method and application thereof |
| CN105171267B (en) * | 2015-07-21 | 2017-12-01 | 重庆永林机械设备有限公司 | Lead-free solder and its preparation method and application |
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