JPH01118439U - - Google Patents

Info

Publication number
JPH01118439U
JPH01118439U JP1988013789U JP1378988U JPH01118439U JP H01118439 U JPH01118439 U JP H01118439U JP 1988013789 U JP1988013789 U JP 1988013789U JP 1378988 U JP1378988 U JP 1378988U JP H01118439 U JPH01118439 U JP H01118439U
Authority
JP
Japan
Prior art keywords
gripping
wire
clamp
wire diameter
outer edges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988013789U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988013789U priority Critical patent/JPH01118439U/ja
Publication of JPH01118439U publication Critical patent/JPH01118439U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP1988013789U 1988-02-03 1988-02-03 Pending JPH01118439U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988013789U JPH01118439U (2) 1988-02-03 1988-02-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988013789U JPH01118439U (2) 1988-02-03 1988-02-03

Publications (1)

Publication Number Publication Date
JPH01118439U true JPH01118439U (2) 1989-08-10

Family

ID=31224402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988013789U Pending JPH01118439U (2) 1988-02-03 1988-02-03

Country Status (1)

Country Link
JP (1) JPH01118439U (2)

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