JPH01120393U - - Google Patents

Info

Publication number
JPH01120393U
JPH01120393U JP1988016640U JP1664088U JPH01120393U JP H01120393 U JPH01120393 U JP H01120393U JP 1988016640 U JP1988016640 U JP 1988016640U JP 1664088 U JP1664088 U JP 1664088U JP H01120393 U JPH01120393 U JP H01120393U
Authority
JP
Japan
Prior art keywords
generating component
heat generating
heat
case
dissipation structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988016640U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988016640U priority Critical patent/JPH01120393U/ja
Publication of JPH01120393U publication Critical patent/JPH01120393U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988016640U 1988-02-09 1988-02-09 Pending JPH01120393U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988016640U JPH01120393U (2) 1988-02-09 1988-02-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988016640U JPH01120393U (2) 1988-02-09 1988-02-09

Publications (1)

Publication Number Publication Date
JPH01120393U true JPH01120393U (2) 1989-08-15

Family

ID=31229746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988016640U Pending JPH01120393U (2) 1988-02-09 1988-02-09

Country Status (1)

Country Link
JP (1) JPH01120393U (2)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4833924U (2) * 1971-08-30 1973-04-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4833924U (2) * 1971-08-30 1973-04-24

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