JPH01125542U - - Google Patents

Info

Publication number
JPH01125542U
JPH01125542U JP1988019998U JP1999888U JPH01125542U JP H01125542 U JPH01125542 U JP H01125542U JP 1988019998 U JP1988019998 U JP 1988019998U JP 1999888 U JP1999888 U JP 1999888U JP H01125542 U JPH01125542 U JP H01125542U
Authority
JP
Japan
Prior art keywords
wire insertion
wedge
opening
wire
positioning engagement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988019998U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988019998U priority Critical patent/JPH01125542U/ja
Publication of JPH01125542U publication Critical patent/JPH01125542U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案のワイヤ挿通装置の斜視図、第
２図ａ，ｂ，ｃは本考案の作動を示す説明図、第
３図は従来のワイヤ挿通装置の概略断面図である
。 １……ウエツジ、１１……ワイヤ案内孔、１２
……挿通用開口、１５……位置決め用凹部、２…
…ワイヤ挿通治具、２１……ワイヤ案内孔、２２
……大径の開口、２４……位置決め用凸部、３…
…クランプ、４……スプリング、５……ワイヤ。 FIG. 1 is a perspective view of the wire insertion device of the present invention, FIGS. 2a, b, and c are explanatory diagrams showing the operation of the present invention, and FIG. 3 is a schematic sectional view of the conventional wire insertion device. 1... Wedge, 11... Wire guide hole, 12
...Insertion opening, 15...Positioning recess, 2...
... Wire insertion jig, 21 ... Wire guide hole, 22
...Large diameter opening, 24...Protrusion for positioning, 3...
...Clamp, 4...Spring, 5...Wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ウエツジのワイヤ挿通用開口を備えた側面に位
置決め用係合部を形成し、ウエツジのワイヤ挿通
用開口を備えた側面に対して接離しうるワイヤ挿
通治具を設け、該ワイヤ挿通治具に形成したワイ
ヤ挿通孔の一端を大径の開口とし、他端をウエツ
ジのワイヤ挿通用開口と対向する大きさの小径の
開口とし、該小径の開口を備えた側面にウエツジ
の位置決め用係合部に嵌合しうる位置決め用係合
部を形成したことを特徴とするワイヤボンダー用
ワイヤ挿通装置。 A positioning engagement portion is formed on the side surface of the wedge having the wire insertion opening, a wire insertion jig that can be moved toward and away from the side surface of the wedge having the wire insertion opening is provided, and the wire insertion jig is formed. One end of the wire insertion hole is a large-diameter opening, the other end is a small-diameter opening that faces the wire insertion opening of the wedge, and the side surface with the small-diameter opening is provided with a positioning engagement part of the wedge. A wire insertion device for a wire bonder, characterized in that a positioning engagement portion that can be fitted is formed.
JP1988019998U 1988-02-19 1988-02-19 Pending JPH01125542U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988019998U JPH01125542U (en) 1988-02-19 1988-02-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988019998U JPH01125542U (en) 1988-02-19 1988-02-19

Publications (1)

Publication Number Publication Date
JPH01125542U true JPH01125542U (en) 1989-08-28

Family

ID=31236003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988019998U Pending JPH01125542U (en) 1988-02-19 1988-02-19

Country Status (1)

Country Link
JP (1) JPH01125542U (en)

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