JPH01126380U - - Google Patents
Info
- Publication number
- JPH01126380U JPH01126380U JP1988022767U JP2276788U JPH01126380U JP H01126380 U JPH01126380 U JP H01126380U JP 1988022767 U JP1988022767 U JP 1988022767U JP 2276788 U JP2276788 U JP 2276788U JP H01126380 U JPH01126380 U JP H01126380U
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- spool
- flange
- fixed
- starting end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Wire Bonding (AREA)
Description
第１図はこの考案の半導体装置のボンデイング
ワイヤ用スプール巻線の側面図であり、第２図は
、その平面図、第３図は、この考案のもう１つの
半導体装置のボンデイングワイヤ用スプール巻線
の側面図であり、第４図は、その平面図、第５図
および第６図は、上記ボンデイングワイヤ用スプ
ール巻線をボンデイングマシンにセツトした状態
を示す概略側面図、第７図は、従来の半導体装置
のボンデイングワイヤ用スプール巻線をボンデイ
ングマシンにセツトし、ボンデイングワイヤをガ
ラス管を通して半導体装置に送給している状態を
示す概略側面図、第８図は、従来の半導体装置の
ボンデイングワイヤ用スプールの平面図である。
１……ボンデイングワイヤ、２……フランジ、
３……接地ターミナル、４……ガラス管、５……
支持台、６，６′，６″……テープ、７……接地
導電部、８……切欠き、９……支持テープ。
FIG. 1 is a side view of a spool winding for bonding wire of a semiconductor device of this invention, FIG. 2 is a plan view thereof, and FIG. 3 is a spool winding for bonding wire of another semiconductor device of this invention. FIG. 4 is a plan view thereof, FIGS. 5 and 6 are schematic side views showing the bonding wire spool winding set in a bonding machine, and FIG. 7 is a side view of the bonding wire. FIG. 8 is a schematic side view showing a state in which a spool winding for bonding wire of a conventional semiconductor device is set in a bonding machine and the bonding wire is fed to the semiconductor device through a glass tube. It is a top view of a spool for wires. 1... bonding wire, 2... flange,
3...Ground terminal, 4...Glass tube, 5...
Support stand, 6, 6', 6''...tape, 7... ground conductive part, 8... notch, 9... support tape.
Claims (1)
から引き出されたボンデイングワイヤの始端部を
、上記フランジの外側表面に間隔をおいて２個所
以上とめてなることを特徴とする半導体装置のボ
ンデイングワイヤ用スプール巻線。 ２ 上記ボンデイングワイヤの始端部を、支持テ
ープによつて浮かしてとめてなることを特徴とす
る請求項１記載の半導体装置のボンデイングワイ
ヤ用スプール巻線。[Claims for Utility Model Registration] 1. The starting end of the bonding wire pulled out from the notch provided in the flange of the spool is fixed at two or more locations spaced apart from each other on the outer surface of the flange. Spool winding for bonding wire for semiconductor devices. 2. The spool winding for a bonding wire for a semiconductor device according to claim 1, wherein the starting end of the bonding wire is suspended and fixed by a support tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988022767U JPH01126380U (en) | 1988-02-23 | 1988-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988022767U JPH01126380U (en) | 1988-02-23 | 1988-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01126380U true JPH01126380U (en) | 1989-08-29 |
Family
ID=31241173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988022767U Pending JPH01126380U (en) | 1988-02-23 | 1988-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01126380U (en) |
-
1988
- 1988-02-23 JP JP1988022767U patent/JPH01126380U/ja active Pending