JPH01127295U - - Google Patents
Info
- Publication number
- JPH01127295U JPH01127295U JP2239388U JP2239388U JPH01127295U JP H01127295 U JPH01127295 U JP H01127295U JP 2239388 U JP2239388 U JP 2239388U JP 2239388 U JP2239388 U JP 2239388U JP H01127295 U JPH01127295 U JP H01127295U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- generating electronic
- radiator
- contact surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000003377 silicon compounds Chemical class 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
Landscapes
- Connection Of Plates (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図および第2図は、この考案の実施例を示
すもので、第1図は要部断面側面図、第2図は平
面図である。第3図および第4図は、従来例を示
すもので、第3図は要部断面側面図、第4図は平
面図である。
主要部分の符号の説明、1:放熱器、1a:接
触面、1b:ネジ穴、2:発熱電子部品(パワー
トランジスタ)、3:シリコンコンパウンド、4
:ネジ、5,6:溝。
1 and 2 show an embodiment of this invention, with FIG. 1 being a cross-sectional side view of the main part, and FIG. 2 being a plan view. 3 and 4 show a conventional example, with FIG. 3 being a cross-sectional side view of the main part, and FIG. 4 being a plan view. Explanation of symbols of main parts, 1: Heatsink, 1a: Contact surface, 1b: Screw hole, 2: Heat generating electronic component (power transistor), 3: Silicon compound, 4
: Screw, 5, 6: Groove.
Claims (1)
する放熱器において、 発熱電子部品との接触面にシリコンコンパウン
ドの逃げ溝を設けたことを特徴とする発熱電子部
品用放熱器の構造。 2 ネジ穴近くにシリコンコンパウンドに逃げ溝
を設けたことを特徴とする請求項1記載の発熱電
子部品用放熱器の構造。[Scope of Claim for Utility Model Registration] 1. A heat radiator for fixing a heat generating electronic component that requires heat radiation with screws, characterized in that a relief groove made of silicone compound is provided on the contact surface with the heat generating electronic component. Structure of radiator for use. 2. The structure of a heat sink for a heat-generating electronic component according to claim 1, characterized in that an escape groove is provided in the silicon compound near the screw hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2239388U JPH01127295U (en) | 1988-02-24 | 1988-02-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2239388U JPH01127295U (en) | 1988-02-24 | 1988-02-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127295U true JPH01127295U (en) | 1989-08-31 |
Family
ID=31240471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2239388U Pending JPH01127295U (en) | 1988-02-24 | 1988-02-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127295U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0357988U (en) * | 1989-10-09 | 1991-06-05 | ||
| JP2011071550A (en) * | 2010-12-21 | 2011-04-07 | Denso Corp | Electronic apparatus |
| JP2017098392A (en) * | 2015-11-24 | 2017-06-01 | パナソニックIpマネジメント株式会社 | Electronic circuit equipment |
-
1988
- 1988-02-24 JP JP2239388U patent/JPH01127295U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0357988U (en) * | 1989-10-09 | 1991-06-05 | ||
| JP2011071550A (en) * | 2010-12-21 | 2011-04-07 | Denso Corp | Electronic apparatus |
| JP2017098392A (en) * | 2015-11-24 | 2017-06-01 | パナソニックIpマネジメント株式会社 | Electronic circuit equipment |
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