JPH01129652U - - Google Patents
Info
- Publication number
- JPH01129652U JPH01129652U JP2110188U JP2110188U JPH01129652U JP H01129652 U JPH01129652 U JP H01129652U JP 2110188 U JP2110188 U JP 2110188U JP 2110188 U JP2110188 U JP 2110188U JP H01129652 U JPH01129652 U JP H01129652U
- Authority
- JP
- Japan
- Prior art keywords
- sample
- heat flow
- thermal conductivity
- heat
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005259 measurement Methods 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Description
第１図ないし第４図はこの考案の一実施例を示
すもので、第１図はこの実施例の熱伝導率測定装
置の全体概略構成を示す立断面図、第２図は熱流
補償筒を示す斜視図、第３図は試料、熱流補償筒
、断熱材の内部温度状態を示す断面図、第４図は
熱流補償筒の作用を説明するための図であつて、
このうちイは熱流の流れる向きを示す拡大断面図
、ロは試料および熱流補償筒の内部温度曲線を示
す図である。第５図はこの考案の熱伝導率装置の
他の構成例を示す部分断面図、第６図は熱流補償
筒の他の構成例を示す斜視図である。第７図は従
来の熱伝導率測定装置の概略構成を示す立断面図
である。
Ｓ……試料、１……炉容器、４……側部断熱材
（断熱材）、６……計測室、１１……熱流計測板
、１２……冷却板、１３……熱流補償筒、１６…
…伝熱板、２１……熱流補償筒。
Figures 1 to 4 show an embodiment of this invention. Figure 1 is an elevational sectional view showing the overall schematic configuration of the thermal conductivity measuring device of this embodiment, and Figure 2 shows a heat flow compensating tube. FIG. 3 is a cross-sectional view showing the internal temperature state of the sample, heat flow compensator, and heat insulating material, and FIG. 4 is a diagram for explaining the action of the heat flow compensator.
Of these, A is an enlarged sectional view showing the direction of heat flow, and B is a diagram showing the internal temperature curves of the sample and the heat flow compensating tube. FIG. 5 is a partial sectional view showing another example of the structure of the thermal conductivity device of this invention, and FIG. 6 is a perspective view showing another example of the structure of the heat flow compensation tube. FIG. 7 is an elevational sectional view showing a schematic configuration of a conventional thermal conductivity measuring device. S...Sample, 1...Furnace vessel, 4...Side insulation material (insulation material), 6...Measurement chamber, 11...Heat flow measurement plate, 12...Cooling plate, 13...Heat flow compensation tube, 16 …
...Heat transfer plate, 21...Heat flow compensation cylinder.
Claims (1)
計測室を設けるとともに、その計測室の内部に、
筒状に形成されていてその厚み方向の熱伝導率が
径方向の熱伝導率および前記断熱材の熱伝導率よ
りも大きくされた熱流補償筒を、その外面が前記
断熱材の内面に密着する状態で配し、その熱流補
償筒の内側に熱伝導率を測定するべき試料を配す
るとともに、その試料の表面および前記熱流補償
筒の表面を伝熱板により覆い、かつ、試料の裏面
側には熱流計測板を配するとともにその周囲には
冷却板を配してその冷却板によつて熱流補償筒の
裏面を覆うようになし、前記計測室の内部に前記
試料をその表面側から裏面側に向かつて透過する
定常熱量を生ぜしめて試料を所定の設定温度に保
持するとともに、前記熱流補償筒の表面温度、裏
面温度をそれぞれ試料の表面温度、裏面温度と同
等に保持して、前記熱流計測板によつて計測され
る定常熱流の熱流量と、試料の表裏両面の温度差
とから、試料の前記設定温度における熱伝導率を
測定するように構成したことを特徴とする熱伝導
率測定装置。 A measurement chamber surrounded by a heat insulating material is provided inside the furnace vessel, and inside the measurement chamber,
A heat flow compensating tube formed in a cylindrical shape and having a thermal conductivity in the thickness direction larger than a thermal conductivity in the radial direction and a thermal conductivity of the heat insulating material, the outer surface of which is in close contact with the inner surface of the heat insulating material. A sample whose thermal conductivity is to be measured is placed inside the heat flow compensator, and the surface of the sample and the surface of the heat flow compensator are covered with a heat transfer plate, and a heat transfer plate is placed on the back side of the sample. A heat flow measurement plate is arranged and a cooling plate is arranged around it so that the back side of the heat flow compensation tube is covered by the cooling plate, and the sample is placed inside the measurement chamber from the front side to the back side. The sample is maintained at a predetermined set temperature by generating a steady amount of heat transmitted toward the sample, and the surface temperature and back surface temperature of the heat flow compensating tube are maintained equal to the surface temperature and back surface temperature of the sample, respectively, and the heat flow measurement is performed. A thermal conductivity measurement device characterized by being configured to measure the thermal conductivity of a sample at the set temperature based on the heat flow rate of a steady heat flow measured by a plate and the temperature difference between the front and back surfaces of the sample. .
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2110188U JPH0613485Y2 (en) | 1988-02-19 | 1988-02-19 | Thermal conductivity measuring device |
| US07/298,052 US4929089A (en) | 1988-01-18 | 1989-01-18 | Apparatus for measuring temperatures indicative of thermal conductivity |
| EP89300450A EP0325430B1 (en) | 1988-01-18 | 1989-01-18 | An apparatus for measuring thermal conductivity |
| DE68926356T DE68926356T2 (en) | 1988-01-18 | 1989-01-18 | Device for measuring thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2110188U JPH0613485Y2 (en) | 1988-02-19 | 1988-02-19 | Thermal conductivity measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01129652U true JPH01129652U (en) | 1989-09-04 |
| JPH0613485Y2 JPH0613485Y2 (en) | 1994-04-06 |
Family
ID=31238034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2110188U Expired - Lifetime JPH0613485Y2 (en) | 1988-01-18 | 1988-02-19 | Thermal conductivity measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0613485Y2 (en) |
-
1988
- 1988-02-19 JP JP2110188U patent/JPH0613485Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0613485Y2 (en) | 1994-04-06 |
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