JPH01129678U - - Google Patents
Info
- Publication number
- JPH01129678U JPH01129678U JP2018288U JP2018288U JPH01129678U JP H01129678 U JPH01129678 U JP H01129678U JP 2018288 U JP2018288 U JP 2018288U JP 2018288 U JP2018288 U JP 2018288U JP H01129678 U JPH01129678 U JP H01129678U
- Authority
- JP
- Japan
- Prior art keywords
- magnetic sensor
- exposed portion
- electrode exposed
- wiring pattern
- probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 7
- 238000000605 extraction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Measuring Magnetic Variables (AREA)
Description
第1図は本考案の一実施例になる磁気センサー
プローブの斜視図、第2図は本考案になる第2実
施例の要部を示す斜視図、第3図aは従来のホー
ル素子を用いた一般的な磁気センサープローブ1
0斜視図、同図bは同図aのホール素子の斜視図
、第4図は他の従来例の磁気センサープローブの
組立説明図である。
11……磁気センサー、12〜15……端子、
30……磁気センサープローブ、31,51……
配線基板、32……第1の基板、33〜36,5
2〜55……引き出し電極、37……第2の基板
、38,56……凹状スペース。
Fig. 1 is a perspective view of a magnetic sensor probe according to an embodiment of the present invention, Fig. 2 is a perspective view showing main parts of a second embodiment of the present invention, and Fig. 3a is a perspective view of a magnetic sensor probe using a conventional Hall element. General magnetic sensor probe 1
FIG. 4 is a perspective view of the Hall element shown in FIG. 11...Magnetic sensor, 12-15...Terminal,
30... Magnetic sensor probe, 31, 51...
Wiring board, 32...first board, 33-36,5
2-55...Extraction electrode, 37...Second substrate, 38, 56...Concave space.
Claims (1)
パターン面を有する配線基板の先端部に搭載し、
前記電極露出部と配線パターンとを電気的に接続
してなる磁気センサープローブにおいて、前記配
線基板先端部に磁気センサーの厚さに等しい深さ
を有する凹部を形成し、前記磁気センサーを前記
電極露出面と前記配線パターン面とが同一面とな
る如く前記凹部に設けてなることを特徴とする磁
気センサープローブ。 A magnetic sensor having an electrode exposed portion on one side is mounted on the tip of a wiring board having a wiring pattern surface,
In the magnetic sensor probe in which the electrode exposed portion and the wiring pattern are electrically connected, a recessed portion having a depth equal to the thickness of the magnetic sensor is formed at the tip of the wiring board, and the magnetic sensor is connected to the electrode exposed portion. A magnetic sensor probe, characterized in that the probe is provided in the recess so that the surface and the wiring pattern surface are flush with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018288U JPH01129678U (en) | 1988-02-18 | 1988-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018288U JPH01129678U (en) | 1988-02-18 | 1988-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129678U true JPH01129678U (en) | 1989-09-04 |
Family
ID=31236328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018288U Pending JPH01129678U (en) | 1988-02-18 | 1988-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129678U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009180596A (en) * | 2008-01-30 | 2009-08-13 | Hamamatsu Koden Kk | Magnetic field probe |
| US8957678B2 (en) | 2010-03-12 | 2015-02-17 | Denso Corporation | Sensor unit and magnetic flux concentrating module |
| US11079446B2 (en) | 2016-04-27 | 2021-08-03 | Infineon Technologies Ag | Compact sensor package |
-
1988
- 1988-02-18 JP JP2018288U patent/JPH01129678U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009180596A (en) * | 2008-01-30 | 2009-08-13 | Hamamatsu Koden Kk | Magnetic field probe |
| US8957678B2 (en) | 2010-03-12 | 2015-02-17 | Denso Corporation | Sensor unit and magnetic flux concentrating module |
| US11079446B2 (en) | 2016-04-27 | 2021-08-03 | Infineon Technologies Ag | Compact sensor package |
| US11506728B2 (en) | 2016-04-27 | 2022-11-22 | Infineon Technologies Ag | Compact sensor package |