JPH01130578A - Light emitting diode - Google Patents
Light emitting diodeInfo
- Publication number
- JPH01130578A JPH01130578A JP62288555A JP28855587A JPH01130578A JP H01130578 A JPH01130578 A JP H01130578A JP 62288555 A JP62288555 A JP 62288555A JP 28855587 A JP28855587 A JP 28855587A JP H01130578 A JPH01130578 A JP H01130578A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting element
- reflective
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
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- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野〕
本発明は、前面方向の放射に適した発光ダイオードに関
するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a light emitting diode suitable for emission in the front direction.
第４図は、従来の発光ダイオードの概略断面及び発光素
子が発する光の光路を示す図である。第４図においてｌ
はＧａＰ系又はＧａＡｓＰ系の発光素子、１２及び１３
はリードフレーム、１４はワイヤ、１５は光透過性樹脂
で形成した凸レンズ部、１５ａは凸レンズ部１５の上端
部、１６は光透過性樹脂で形成した平行光線取出部、１
６ａは平行光線取出部１６の上端部、１６ｂは平行光線
取出部１６の側面周囲部、１７は凸レンズ部１５と平行
光線取出部１６との間に形成される窪み畝Ｘ体光軸、で
ある。尚、矢印は光路を示す。FIG. 4 is a diagram showing a schematic cross section of a conventional light emitting diode and an optical path of light emitted by the light emitting element. In Figure 4, l
are GaP-based or GaAsP-based light emitting elements, 12 and 13
1 is a lead frame, 14 is a wire, 15 is a convex lens portion made of a light-transmitting resin, 15a is an upper end portion of the convex lens portion 15, 16 is a parallel light extraction portion made of a light-transmitting resin, 1
6a is the upper end of the parallel ray extraction part 16, 16b is the side peripheral part of the parallel ray extraction part 16, and 17 is the concave ridge formed between the convex lens part 15 and the parallel ray extraction part 16, and the optical axis of the X body. . Note that arrows indicate optical paths.
発光素子１は一方のリードフレーム１２の頂部に・′マ
ウントされ、他方のリードフレーム１３とはワイヤ１４
により電気的に接読されている。そして、発光素子１と
リードフレーム１２・１３の上部は、光透過性樹脂でモ
ールドして形成した凸レンズ部１５により覆われ、該凸
レンズ部１５の上端部１５ａは球面形状に形成されてい
る。そして、外形が椀状をした平行光線取出部１６が光
透過性樹脂により、凸レンズ部１５を取り囲むようにし
て凸レンズ部１５と一体的に形成されている。尚、平行
光線取出部１６の上端部１６ａは平面状に形成され、ま
た側面周囲部１６ｂは発光素子１を焦点とする放物曲面
状に形成されている。The light emitting device 1 is mounted on the top of one lead frame 12, and is connected to the other lead frame 13 by a wire 14.
It is electrically read out by The upper parts of the light emitting element 1 and the lead frames 12 and 13 are covered with a convex lens part 15 molded with a light-transmitting resin, and the upper end part 15a of the convex lens part 15 is formed in a spherical shape. A parallel light extraction part 16 having a bowl-shaped outer shape is formed integrally with the convex lens part 15 by making of a light-transmitting resin so as to surround the convex lens part 15. Incidentally, the upper end 16a of the parallel light extraction section 16 is formed in a planar shape, and the side peripheral portion 16b is formed in a parabolic curved shape with the light emitting element 1 as a focal point.
以上のように構成された発光ダイオードによれば、発光
素子１が発する光の一部は凸レンズ部１５の上端部１５
ａを経由して屈折し、残りの部分（側面方向の部分）は
平行光線取出部１Ｇの側面周囲部１６ｂに形成した反射
面により全反射し、第４図の矢印に示すように光軸Ｘに
平行な方向に放射される。According to the light emitting diode configured as above, a part of the light emitted by the light emitting element 1 is transmitted to the upper end portion 15 of the convex lens portion 15.
a, and the remaining portion (portion in the side direction) is totally reflected by the reflective surface formed on the side surface peripheral portion 16b of the parallel light extraction section 1G, and is reflected along the optical axis X as shown by the arrow in FIG. is radiated in a direction parallel to .
しかしながら、従来の発光ダイオードでは上記構成の発
光ダイオードを面発光光源として使用するときには、各
発光ダイオードを形成し、更にこれを同一平面上に複数
個配列して組み立てなければならないので、製造が容易
でなく、量産性に欠けるという欠点があった。However, with conventional light emitting diodes, when using the light emitting diode with the above structure as a surface emitting light source, it is necessary to form each light emitting diode and then arrange and assemble multiple light emitting diodes on the same plane, which makes manufacturing easy. However, there was a drawback that mass production was lacking.
また、従来の発光ダイオードは、凸レンズ部１５の周囲
に、凸レンズ部１５を囲うようにして平行光線取出部１
６が形成されているので、凸レンズ部１５と平行光線取
出部１６との間に窪み部１７ができる。このため、発光
素子Ｉが発する熱を十分に放熱することができず、特に
上記発光ダイオードを多数個配列して面発光光源として
用いるときには、温度上昇の問題が生じていた。Further, in the conventional light emitting diode, the parallel light extraction section 1 is arranged around the convex lens section 15 so as to surround the convex lens section 15.
6 is formed, a recessed portion 17 is formed between the convex lens portion 15 and the parallel light extraction portion 16. For this reason, the heat generated by the light emitting element I cannot be sufficiently dissipated, resulting in a problem of temperature rise, especially when a large number of the above light emitting diodes are arranged and used as a surface emitting light source.
一方、発光素子１を放熱性の良い基板上にマウントして
面発光光源を製造する方法もある。しがし、この方法で
は、多数の発光ダイオードを一括的に形成することは製
造上困難であり、特開昭６１−１４７５８６号のように
レンズとキャップとをそれぞれ個別に形成し取り付けな
ければならないので、量産性に欠けるという欠点があっ
た。On the other hand, there is also a method of manufacturing a surface emitting light source by mounting the light emitting element 1 on a substrate with good heat dissipation. However, with this method, it is difficult to form a large number of light emitting diodes all at once, and lenses and caps must be formed and attached individually, as in JP-A-61-147586. Therefore, it had the disadvantage of lack of mass production.
本発明は、上記事情に基づいてなされたものであり、発
光素子が発する光を有効に前面方向に放射することがで
きると共に、構造が簡易で、且つ製造が容易であり、し
かも放熱性の良好な発光ダイオードを提供することを目
的とするものである。The present invention has been made based on the above circumstances, and is capable of effectively emitting light emitted by a light emitting element in the front direction, has a simple structure, is easy to manufacture, and has good heat dissipation. The purpose of this invention is to provide a light-emitting diode with a light emitting diode.
上記の目的を達成するための本発明は、表面に回路パタ
ーンが形成された基板部と、該基板部上に載置され前記
回路パターンから電力の供給を受ける少なくとも１つの
発光素子と、該各発光素子毎に設けられた回転面状の反
射面を有し且つ前記基板部上に載置された反射部材と、
前記各発光素子と前記反射部材の反射面との空間に充填
され且つ前記各発光素子が発する光を外部に放射する光
放射面の周辺部は前記基板部に平行な平面状に形成され
前記光放射面の中央部は前記周辺部に対して凸レンズ状
に突出して形成された光透過性樹脂とを具備するように
構成したものである。To achieve the above object, the present invention includes: a substrate portion having a circuit pattern formed on its surface; at least one light emitting element placed on the substrate portion and receiving power from the circuit pattern; a reflective member having a rotating surface-shaped reflective surface provided for each light emitting element and placed on the substrate portion;
A peripheral portion of a light emitting surface that fills the space between each of the light emitting elements and the reflective surface of the reflecting member and radiates the light emitted by each of the light emitting elements to the outside is formed in a planar shape parallel to the substrate portion. The central portion of the radiation surface is configured to include a light-transmitting resin formed to protrude in the shape of a convex lens with respect to the peripheral portion.
本発明は前記の構成によって、各発光素子が発する光を
反射部材の反射面により効率良く前面に放射することが
できると共に、各発光素子が発する光を外部に放射する
光放射面に窪みがないので放熱性が良好であり、然も光
放射面は平面に凸レンズ状の凸部が設けられただけの簡
単な形状であるので、光透過性樹脂の成形が容易となり
量産性の向上を図ることができる。With the above configuration, the present invention can efficiently radiate the light emitted from each light emitting element to the front by the reflective surface of the reflective member, and there is no depression in the light emitting surface that radiates the light emitted from each light emitting element to the outside. Therefore, heat dissipation is good, and since the light emitting surface has a simple shape with a convex lens-like convex portion on a flat surface, it is easy to mold the light-transmitting resin and improve mass productivity. Can be done.
本発明の第１の実施例を第１図及び第２図を参照し９て
説明する。第１図は本発明の第１の実施例である発光ダ
イオードの概略断面及び発光素子が発する光の光路を示
す図である。第１図において１は発光素子、“２は基板
、３及び４は回路パターン、５はワイヤ、６は光透過性
樹脂、６ａは光透過性樹脂６の光放射面の中央部、６ｂ
は光透過性樹脂６の光放射面の周辺部、７は高反射樹脂
（例えば、白色のもの）を平板状に形成した反射部材、
７ａは反射部材７に設けられた回転面状の反射面である
。尚、Ｘは光軸であり、矢印は光路を示す。A first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a diagram showing a schematic cross section of a light emitting diode according to a first embodiment of the present invention and an optical path of light emitted by the light emitting element. In FIG. 1, 1 is a light emitting element, 2 is a substrate, 3 and 4 are circuit patterns, 5 is a wire, 6 is a light-transmitting resin, 6a is the center of the light-emitting surface of the light-transmitting resin 6, 6b
7 is the peripheral part of the light emitting surface of the light-transmitting resin 6, and 7 is a reflective member made of a highly reflective resin (for example, a white one) formed into a flat plate.
7a is a rotating surface-shaped reflecting surface provided on the reflecting member 7. Note that X is the optical axis and the arrow indicates the optical path.
ＧａＰ系及びＧａＡｓＰ系の発光素−子１は、基板２上
に形成された一方の回路パターン３上にマウントされ、
他方の回路パターン４とはワイヤ５により電気的に接続
されている。そして、基板２上には、反射面７ａが発光
素子１を囲むように反射部材７が取り付けられ、発光素
子１と反射面７ａとの空間には光透過性樹脂６が充填さ
れている。A GaP-based and GaAsP-based light emitting element 1 is mounted on one circuit pattern 3 formed on a substrate 2,
It is electrically connected to the other circuit pattern 4 by a wire 5. A reflective member 7 is mounted on the substrate 2 so that the reflective surface 7a surrounds the light emitting element 1, and a space between the light emitting element 1 and the reflective surface 7a is filled with a light-transmitting resin 6.
尚、発光素子１が発する光を外部に放射する光透過性樹
脂６の光放射面は中央部６ａと周辺部６ｂとからなり、
中央部６ａは周辺部６ｂに対して凸レンズ状に突出して
形成されている。また、周辺部６ｂは反射部材７の前面
と同一平面状になるように形成されている。The light emitting surface of the light-transmitting resin 6 that emits the light emitted by the light emitting element 1 to the outside consists of a central portion 6a and a peripheral portion 6b.
The central portion 6a is formed to protrude in the shape of a convex lens with respect to the peripheral portion 6b. Further, the peripheral portion 6b is formed to be flush with the front surface of the reflecting member 7.
上記の構成によれば、基板２上に形成された回路パター
ン３・４とワイヤ５とにより発光素子ｌに電力が供給さ
れ、発光素子１が発光する。そして、第１図の矢印に示
すように、発光素子１が発する光のうち光透過性樹脂６
の中央部６ａを通過した光は凸レンズの屈折率により光
軸Ｘに平行な光として前面方向に放射され、側面方向に
発した光は反射面７ａで反射して前゛面方向に放射され
る。According to the above configuration, power is supplied to the light emitting element 1 by the circuit patterns 3 and 4 formed on the substrate 2 and the wire 5, and the light emitting element 1 emits light. As shown by the arrow in FIG.
The light that passes through the central part 6a is emitted toward the front as light parallel to the optical axis X due to the refractive index of the convex lens, and the light emitted toward the side is reflected by the reflective surface 7a and emitted toward the front. .
また、光透過性樹脂６の周辺部６ｂの方向に発した光は
周辺部６ｂにより全反射し、更にその反射光は反射面７
ａで反射して前面に放射される。Further, the light emitted in the direction of the peripheral part 6b of the light-transmitting resin 6 is totally reflected by the peripheral part 6b, and the reflected light is further reflected by the reflective surface 7.
It is reflected by a and radiated to the front.
第２図は光透過性樹脂の周辺部における全反射を示す図
である。第２図においてＸは光軸、Ｙは水平軸、０は発
光素子１の中心点、Ｐは光透過性樹脂６の中央部６ａと
周辺部６ｂの境界部における任意の点、Ｄは水平軸Ｙか
ら周辺部６ｂまでの距離、ｎは光透過性樹脂６の屈折率
、θは発光素子１が発する光の水平軸Ｙに対する角度（
，４ＰＯＹ）である、また、矢印は光路を示す、尚、第
２図において上記第１図と同一の機能を有するものは同
一の符号を付すことによりその詳細な説明を省略する。FIG. 2 is a diagram showing total reflection in the peripheral area of the light-transmitting resin. In FIG. 2, X is the optical axis, Y is the horizontal axis, 0 is the center point of the light emitting element 1, P is an arbitrary point on the boundary between the central part 6a and the peripheral part 6b of the light-transmitting resin 6, and D is the horizontal axis. The distance from Y to the peripheral portion 6b, n is the refractive index of the light-transmitting resin 6, and θ is the angle of the light emitted by the light emitting element 1 with respect to the horizontal axis Y (
, 4POY), and arrows indicate optical paths. In FIG. 2, those having the same functions as those in FIG.
一般に、光透過性樹脂６として用いられるエポキシ樹脂
では周辺部６ｂへの入射光の角度θがｔａｎ−’（１／
〜α］７−＝ゴゴ）以下の値になると、入射光を全
反射する性質がある。そして周辺部６ｂで全反射した光
は反射面７ａで反射して前面に放射される。従って、水
平軸Ｙから周辺部６ｂまでの距離をＤとすると、光軸Ｘ
からの境界部の距離が−５１：了・Ｄとなるように光透
過性樹脂６を形成すれば、発光素子１が周辺部６ｂに発
した光は周辺部６ｂで全反射し、更に反射面７ａで反射
して前面方向に放射され、発光素子ｌが周辺部６ｂに発
した光も有効に前面放射することができる。Generally, in the case of epoxy resin used as the light-transmitting resin 6, the angle θ of the incident light to the peripheral part 6b is tan-'(1/
~α]7−=gogo) or less, it has the property of total reflection of incident light. The light totally reflected by the peripheral portion 6b is reflected by the reflective surface 7a and radiated to the front. Therefore, if the distance from the horizontal axis Y to the peripheral portion 6b is D, then the optical axis
If the light-transmitting resin 6 is formed so that the distance from the boundary part from the light emitting element 1 to the peripheral part 6b is -51:D, the light emitted from the light emitting element 1 to the peripheral part 6b will be totally reflected by the peripheral part 6b, and furthermore, the light emitted from the peripheral part 6b will be reflected by the reflective surface. The light reflected by the light emitting element 7a and radiated toward the front surface, and the light emitted from the light emitting element 1 to the peripheral portion 6b can also be effectively radiated from the front surface.
上記の実施例によれば、発光素子１が発する光を、はぼ
損失なく光軸Ｘに対して平行な光として、有効に利用す
ることができる。また、上記の実施例によれば、反射面
７ａを有する反射部材７は平板状であり、容易に基板２
上に取り付けることができ、また光透過性樹脂６の光放
射面の構造が簡易であるので、容易に製造することがで
き、量産性の向上を図ることができる。特に、発光ダイ
オードを面発光光源として用いるときには、従来のよう
に各発光ダイオードを個別に製造した後に結合するので
はなく、−時に一括して製造することができるので便宜
である。According to the above embodiment, the light emitted by the light emitting element 1 can be effectively used as light parallel to the optical axis X without any loss. Further, according to the above embodiment, the reflecting member 7 having the reflecting surface 7a is in the shape of a flat plate, and can easily
Since the structure of the light emitting surface of the light-transmitting resin 6 is simple, it can be easily manufactured, and mass productivity can be improved. In particular, when using a light emitting diode as a surface emitting light source, it is convenient because the light emitting diodes can be manufactured all at once, instead of being manufactured individually and then combined together as in the conventional method.
更に、上記の実施例によれば光放射面に富みが無いので
光放射面の通風性が良く、したがって放熱性が良好とな
り、温度上昇を防止−することができる。Furthermore, according to the above-mentioned embodiment, since there is no abundance on the light emitting surface, the light emitting surface has good ventilation, so that heat dissipation is good, and a rise in temperature can be prevented.
第３図は本発明の第２の実施例である発光ダイオードの
概略断面及び発光素子が発す杢光の光路を示す図である
。第３図において８は高反射樹脂（例えば、白色のもの
）を平板状に形成した反射部材、８ａは反射部材８の下
部に設けた高反射樹脂からなる下部反射面、８ｂは反射
部材８の上部に設けた高反射樹脂からなる上部反射面で
ある。FIG. 3 is a diagram showing a schematic cross section of a light emitting diode according to a second embodiment of the present invention and an optical path of heather light emitted by the light emitting element. In FIG. 3, reference numeral 8 denotes a reflective member made of a highly reflective resin (for example, a white one) formed into a flat plate shape, 8a is a lower reflective surface made of a highly reflective resin provided at the lower part of the reflective member 8, and 8b is a reflective member 8 of the reflective member 8. This is an upper reflective surface made of highly reflective resin provided on the upper part.
下部反射面８ａは発光素子１を焦点とする回転放物面状
に形成され、発光素子１が発した側面方向の光を前面方
向に反射する。また、上部反射面８ｂは周辺部６ｂに対
する発光素子１の鏡映点を焦点とする回転放物面状に形
成され、発光素子１が発する光のうち光放射面の周辺部
６ｂで全反射された光を前面方向に反射する。尚、第３
図に示す第２の実施例において上記第１図に示す第１の
実施例と同一の機能を有するものは同一の符号を付すこ
とによりその詳細な説明を省略する。The lower reflective surface 8a is formed in the shape of a paraboloid of revolution with the light emitting element 1 as its focal point, and reflects the light emitted from the light emitting element 1 in the side direction toward the front. Further, the upper reflective surface 8b is formed in the shape of a paraboloid of revolution whose focal point is the reflection point of the light emitting element 1 with respect to the peripheral part 6b, so that part of the light emitted by the light emitting element 1 is totally reflected at the peripheral part 6b of the light emitting surface. reflects the light towards the front. Furthermore, the third
Components in the second embodiment shown in the figures that have the same functions as those in the first embodiment shown in FIG.
上記の実施例によれば、発光素子１が側面方向や周辺部
６ｂに発する光を反射面８ａ・８ｂにより損失なく光軸
Ｘに対して平行方向に放射することができるので、前記
第１の実施例よりも更に効率よ（発光素子１が発する光
を前面方向に放射することができる。その他の作用、効
果は第１の実施例と同様である。According to the above embodiment, the light emitted by the light emitting element 1 toward the side surface or the peripheral portion 6b can be emitted in a direction parallel to the optical axis X without loss by the reflecting surfaces 8a and 8b. This embodiment is more efficient than the embodiment (the light emitted by the light emitting element 1 can be emitted in the front direction).Other functions and effects are the same as in the first embodiment.
以上説明したように本発明によれば、反射部材により発
光素子が発する光を有効に前面方向に放射することがで
きると共に、光放射面の形状が簡易であるので製造が容
易となり、然も光放射面には富みがないので放熱性の良
好な発光ダイオードを提供することができる。また、特
に発光ダイオードを複数個結合して面発光光源にすると
きには、−時に一括して製造することができるので、量
産性の向上を図ることができる。As explained above, according to the present invention, the light emitted by the light emitting element can be effectively radiated in the front direction by the reflective member, and the shape of the light emitting surface is simple, making manufacturing easy. Since the radiation surface is not rich, it is possible to provide a light emitting diode with good heat dissipation. Furthermore, especially when a plurality of light emitting diodes are combined to form a surface emitting light source, they can be manufactured all at once, thereby improving mass productivity.
第１図は本発明の第１の実施例である発光ダイオードの
概略断面及び発光素子が発する光の光路を示す図、第２
図は光透過性樹脂の周辺部における全反射を示す図、第
３図は本発明の第２の実施例である発光ダイオードの概
略断面及び発光素子が発する光の光路を示す図、第４図
は従来の発光ダイオードの概略断面及び発光素子が発す
る光の光路を示す図である。
１・・・発光素子、２・・・基板、
３．４・・・回路パターン、５・・・ワイヤ、６・・・
光透過性樹脂、６ａ・・・中央部６ｂ・・・周辺部、７
・・・反射部材、７ａ・・・反射面、８・・・反射部材
、８ａ・・・下部反射面、８ｂ・・・上部反射面Ｘ・・
・光軸。
出願人 岩 崎 電 気 株式会社FIG. 1 is a diagram showing a schematic cross section of a light emitting diode according to the first embodiment of the present invention and the optical path of light emitted by the light emitting element, and FIG.
The figure shows total reflection in the peripheral area of the light-transmitting resin, Figure 3 is a schematic cross-section of a light-emitting diode according to the second embodiment of the present invention, and the optical path of light emitted by the light-emitting element. Figure 4 1 is a diagram showing a schematic cross section of a conventional light emitting diode and an optical path of light emitted by a light emitting element. DESCRIPTION OF SYMBOLS 1... Light emitting element, 2... Substrate, 3.4... Circuit pattern, 5... Wire, 6...
Light-transmitting resin, 6a...Central part 6b...Peripheral part, 7
... Reflective member, 7a... Reflective surface, 8... Reflective member, 8a... Lower reflective surface, 8b... Upper reflective surface X...
·optical axis. Applicant Iwasaki Electric Co., Ltd.
Claims (3)
板部上に載置され前記回路パターンから電力の供給を受
ける少なくとも１つの発光素子と、該各発光素子毎に設
けられた回転面状の反射面を有し且つ前記基板部上に載
置された反射部材と、前記各発光素子と前記反射部材の
反射面との空間に充填され且つ前記各発光素子が発する
光を外部に放射する光放射面の周辺部は前記基板部に平
行な平面状に形成され前記光放射面の中央部は前記周辺
部に対して凸レンズ状に突出して形成された光透過性樹
脂とを具備することを特徴とする発光ダイオード。(1) A substrate portion having a circuit pattern formed on its surface, at least one light emitting element placed on the substrate portion and receiving power from the circuit pattern, and a rotating surface provided for each light emitting element. a reflective member having a shaped reflective surface and placed on the substrate portion, a space between each of the light emitting elements and the reflective surface of the reflective member, and the light emitted by each of the light emitting elements being emitted to the outside; A peripheral portion of the light emitting surface is formed in a planar shape parallel to the substrate portion, and a central portion of the light emitting surface includes a light-transmitting resin formed to protrude in the shape of a convex lens with respect to the peripheral portion. A light emitting diode featuring
物面状に形成された下部反射面と、前記光放射面の周辺
部に対する前記発光素子の鏡映点を焦点とする回転放物
面状に形成された上部反射面とからなることを特徴とす
る特許請求の範囲第１項記載の発光ダイオード。(2) The reflecting surface includes a lower reflecting surface formed in the shape of a paraboloid of rotation with each of the light emitting elements as a focal point, and a paraboloid of rotation with a focal point as a reflection point of the light emitting element with respect to the periphery of the light emitting surface. 2. The light emitting diode according to claim 1, further comprising an upper reflecting surface formed in the shape of an object surface.
とを特徴とする特許請求の範囲第１項又は第２項記載の
発光ダイオード。(3) The light emitting diode according to claim 1 or 2, wherein the reflective member is made of a highly reflective resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62288555A JPH01130578A (en) | 1987-11-17 | 1987-11-17 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62288555A JPH01130578A (en) | 1987-11-17 | 1987-11-17 | Light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01130578A true JPH01130578A (en) | 1989-05-23 |
Family
ID=17731762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62288555A Pending JPH01130578A (en) | 1987-11-17 | 1987-11-17 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01130578A (en) |
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