JPH01132736U - - Google Patents
Info
- Publication number
- JPH01132736U JPH01132736U JP1988025813U JP2581388U JPH01132736U JP H01132736 U JPH01132736 U JP H01132736U JP 1988025813 U JP1988025813 U JP 1988025813U JP 2581388 U JP2581388 U JP 2581388U JP H01132736 U JPH01132736 U JP H01132736U
- Authority
- JP
- Japan
- Prior art keywords
- printer head
- power line
- common power
- optical printer
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
Description
第１図は本考案の光プリンタヘツドの要部拡大
平面図、第２図は第１図のＹ―Ｙ線断面図、第３
図は従来の光プリンタヘツドの要部拡大平面図、
第４図は第３図のＸ―Ｘ線断面図である。 １，１１……絶縁性基板、２，１２……共通電
力線、６，１４……発光ダイオード、７，１５…
…駆動用ＩＣ素子、９……電線。
平面図、第２図は第１図のＹ―Ｙ線断面図、第３
図は従来の光プリンタヘツドの要部拡大平面図、
第４図は第３図のＸ―Ｘ線断面図である。 １，１１……絶縁性基板、２，１２……共通電
力線、６，１４……発光ダイオード、７，１５…
…駆動用ＩＣ素子、９……電線。
Claims (1)
- 絶縁基板上に被着された共通電力線上に複数個
の発光ダイオードを直線状に配列取着して成る光
プリンタヘツドにおいて、前記共通電力線に電圧
降下防止用の電線を並列に接続したことを特徴と
する光プリンタヘツド。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988025813U JPH01132736U (ja) | 1988-02-26 | 1988-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988025813U JPH01132736U (ja) | 1988-02-26 | 1988-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01132736U true JPH01132736U (ja) | 1989-09-08 |
Family
ID=31246877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988025813U Pending JPH01132736U (ja) | 1988-02-26 | 1988-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01132736U (ja) |
-
1988
- 1988-02-26 JP JP1988025813U patent/JPH01132736U/ja active Pending