JPH01133393U - - Google Patents

Info

Publication number
JPH01133393U
JPH01133393U JP3013988U JP3013988U JPH01133393U JP H01133393 U JPH01133393 U JP H01133393U JP 3013988 U JP3013988 U JP 3013988U JP 3013988 U JP3013988 U JP 3013988U JP H01133393 U JPH01133393 U JP H01133393U
Authority
JP
Japan
Prior art keywords
conductive panel
conductive
memory chip
chip element
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3013988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3013988U priority Critical patent/JPH01133393U/ja
Publication of JPH01133393U publication Critical patent/JPH01133393U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のメモリカードの構造を示す図
であり、第2図は、本考案によるメモリカードの
断面図である。 1……回路基板、2……メモリチツプ、4……
フレーム、5……パネルA、6……パネルB、7
……フイルムA、8……フイルムB。
FIG. 1 is a diagram showing the structure of a memory card according to the present invention, and FIG. 2 is a cross-sectional view of the memory card according to the present invention. 1... Circuit board, 2... Memory chip, 4...
Frame, 5...Panel A, 6...Panel B, 7
...Film A, 8...Film B.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] メモリチツプ素子と該メモリチツプ素子を制御
する周辺回路及び外部回路との接合部を有し、さ
らに外被材として導電性パネルと該導電性パネル
上に貼合せる塩化ビニール系等の非導電性フイル
ムによつて構成されるメモリカードにおいて、前
記非導電性パネルは少なくとも前記導電性パネル
の全面を覆うことを特徴とするメモリカード。
It has a joint between the memory chip element, a peripheral circuit that controls the memory chip element, and an external circuit, and is further made of a conductive panel as an outer covering material and a non-conductive film made of vinyl chloride or the like that is laminated on the conductive panel. The memory card is characterized in that the non-conductive panel covers at least the entire surface of the conductive panel.
JP3013988U 1988-03-07 1988-03-07 Pending JPH01133393U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3013988U JPH01133393U (en) 1988-03-07 1988-03-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3013988U JPH01133393U (en) 1988-03-07 1988-03-07

Publications (1)

Publication Number Publication Date
JPH01133393U true JPH01133393U (en) 1989-09-11

Family

ID=31254937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3013988U Pending JPH01133393U (en) 1988-03-07 1988-03-07

Country Status (1)

Country Link
JP (1) JPH01133393U (en)

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