JPH0113411Y2 - - Google Patents
Info
- Publication number
- JPH0113411Y2 JPH0113411Y2 JP1112483U JP1112483U JPH0113411Y2 JP H0113411 Y2 JPH0113411 Y2 JP H0113411Y2 JP 1112483 U JP1112483 U JP 1112483U JP 1112483 U JP1112483 U JP 1112483U JP H0113411 Y2 JPH0113411 Y2 JP H0113411Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electrode
- component element
- substrate
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 20
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Description
【考案の詳細な説明】
本考案は電子部品の収納を容易にするチツプ型
電子部品に関する。[Detailed Description of the Invention] The present invention relates to a chip type electronic component that facilitates the storage of electronic components.
電子回路の実装密度をあげるためにチツプ型電
子部品が多く用いられている。従来のチツプ型電
子部品は第１図で示す如く、１枚の絶縁基板１の
両端部に電極部２，３を形成させ、この電極部
２，３は絶縁基板１の表裏両面に電気的に結合す
るよう形成されている。一方の面の電極部２Ａ，
３Ａには電子部品素子４の電極部５，６が電気的
に接続され、他方の面の電極部２Ｂ，３Ｂはプリ
ント基板７の電極部８，９に載置され半田付け固
着される。１０は電子部品を被覆した絶縁樹脂で
ある。このチツプ型電子部品はプリント基板に実
装するさい、電極部２，３を下向けにして装填し
なければならないという方向性の制約を受けるこ
と、また電子部品素子４を被覆した絶縁樹脂１０
が不定形であることによりチツプ型電子部品の自
動実装に不都合なことがあつた。 Chip-type electronic components are often used to increase the packaging density of electronic circuits. As shown in FIG. 1, a conventional chip-type electronic component has electrode parts 2 and 3 formed at both ends of a single insulating substrate 1, and these electrode parts 2 and 3 are electrically connected to both the front and back surfaces of the insulating substrate 1. formed to join. Electrode part 2A on one side,
The electrode portions 5 and 6 of the electronic component element 4 are electrically connected to the electrode portion 3A, and the electrode portions 2B and 3B on the other side are placed on the electrode portions 8 and 9 of the printed circuit board 7 and fixed by soldering. 10 is an insulating resin that coats the electronic components. When this chip-type electronic component is mounted on a printed circuit board, it is subject to orientational constraints such that it must be loaded with the electrode parts 2 and 3 facing downward, and the insulating resin 10 covering the electronic component element 4 is
Due to its irregular shape, there have been some inconveniences in automatic mounting of chip-type electronic components.
本考案は、絶縁基板の両端部の表裏面に設けた
電極部の一部を切欠し、この切欠部に電子部品素
子を収納し、電子の電極と基板の電極とを電気的
に接続するチツプ型電子部品を提供する。 The present invention is a chip in which a part of the electrode section provided on the front and back surfaces of both ends of an insulating substrate is cut out, an electronic component element is housed in the cutout section, and the electronic electrode and the electrode of the substrate are electrically connected. Provide type electronic components.
本考案の実施例を図面に基づき説明すると、１
１は絶縁基板であり、この絶縁基板１１の両端部
に絶縁基板の表裏両面にわたつて電極部１２，１
３が形成されている。この電極部１２，１３はメ
ツキ処理したり、コ字状の金属を固着すればよ
い。１４は電子部品素子であり、この素子１４の
形状に合わせ電極部１２，１３の一部分を切欠し
た切欠部１５，１６を設ける。この切欠部１５，
１６を設けた基板１７の切欠部１５，１６に電子
部品素子１４を収納する。さらにその上に別の基
板１７を載置する。すなわち、２枚の基板１７，
１７の電極部の切欠部１５，１６に合わせ、電子
部品素子１４を収納し、素子１４の電極部１８，
１９と基板の電極部１２，１３とをそれぞれ導電
性接着剤２０等を用い電気的に結合させる。２１
は絶縁樹脂である。 The embodiments of the present invention will be explained based on the drawings: 1
Reference numeral 1 denotes an insulating substrate, and electrode portions 12, 1 are provided at both ends of the insulating substrate 11 on both the front and back surfaces of the insulating substrate.
3 is formed. The electrode portions 12 and 13 may be plated or fixed with U-shaped metal. Reference numeral 14 denotes an electronic component element, and cutout parts 15 and 16 are provided in accordance with the shape of this element 14 by cutting out part of the electrode parts 12 and 13. This notch 15,
The electronic component element 14 is housed in the notches 15 and 16 of the substrate 17 provided with the electronic component element 16. Furthermore, another substrate 17 is placed on top of it. That is, two substrates 17,
The electronic component element 14 is housed in accordance with the notches 15 and 16 of the electrode part 17, and the electrode part 18 of the element 14,
19 and the electrode parts 12 and 13 of the substrate are electrically coupled using a conductive adhesive 20 or the like. 21
is an insulating resin.
本考案のチツプ型電子部品は以上に述べた構成
のもので、２枚の基板を用い電子部品素子をはさ
み込むようにしたため、上下が相似形状であつ
て、表裏の区別なくプリント基板にセツトでき
る。また、基板の電極部に電子部品と同一形状の
切欠部を設け、この切欠部に電子部品素子を収納
するため、作業中に移動することなく、一体化が
確実に行える。さらに切欠部に素子を収納したこ
とにより小型化がはかれた等の効果を奏した考案
である。 The chip-type electronic component of the present invention has the above-mentioned configuration, and since the electronic component element is sandwiched between two substrates, the top and bottom have similar shapes, and can be set on a printed circuit board without distinguishing between the front and back. . Further, since a notch having the same shape as the electronic component is provided in the electrode portion of the substrate and the electronic component element is housed in this notch, integration can be ensured without movement during work. Furthermore, by housing the element in the notch, the device has the advantage of being more compact.
第１図は従来の断面図、第２図は本考案の断面
図、第３図は本考案の斜視図、第４図は素子を組
込んだ状態を示す斜視図。
図面において、１１：絶縁基板、１２，１３：
電極部、１４：電子部品素子、１５，１６：切欠
部、１７：基板、１８，１９：素子電極部、２
０：導電性接着剤。
FIG. 1 is a sectional view of the conventional device, FIG. 2 is a sectional view of the present invention, FIG. 3 is a perspective view of the present invention, and FIG. 4 is a perspective view showing a state in which the device is assembled. In the drawings, 11: insulating substrate, 12, 13:
Electrode part, 14: Electronic component element, 15, 16: Notch part, 17: Substrate, 18, 19: Element electrode part, 2
0: Conductive adhesive.
Claims (1)
形成した基板を２枚用い、これら基板間に電子部
品素子をはさみ込み、この電子部品素子の電極と
基板の電極とを電気的に接続したチツプ型電子部
品において、この電子部品素子の形状に合わせ基
板の電極部を切欠し、この切欠部に電子部品素子
を収納することを特徴とするチツプ型電子部品。 A chip type device that uses two substrates with electrode parts formed on both the front and back sides of both ends of the insulating substrate, an electronic component element is sandwiched between these substrates, and the electrodes of the electronic component element and the electrodes of the substrate are electrically connected. A chip type electronic component characterized in that an electrode portion of a substrate is cut out to match the shape of the electronic component element, and the electronic component element is housed in the notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1112483U JPS59119030U (en) | 1983-01-31 | 1983-01-31 | Chip type electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1112483U JPS59119030U (en) | 1983-01-31 | 1983-01-31 | Chip type electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59119030U JPS59119030U (en) | 1984-08-11 |
| JPH0113411Y2 true JPH0113411Y2 (en) | 1989-04-19 |
Family
ID=30142547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1112483U Granted JPS59119030U (en) | 1983-01-31 | 1983-01-31 | Chip type electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59119030U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2887913B2 (en) * | 1991-02-01 | 1999-05-10 | 日本電気株式会社 | Chip-shaped solid electrolytic capacitor |
-
1983
- 1983-01-31 JP JP1112483U patent/JPS59119030U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59119030U (en) | 1984-08-11 |
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