JPH01136873U - - Google Patents
Info
- Publication number
- JPH01136873U JPH01136873U JP3193388U JP3193388U JPH01136873U JP H01136873 U JPH01136873 U JP H01136873U JP 3193388 U JP3193388 U JP 3193388U JP 3193388 U JP3193388 U JP 3193388U JP H01136873 U JPH01136873 U JP H01136873U
- Authority
- JP
- Japan
- Prior art keywords
- air conditioner
- semiconductor device
- accumulator
- compressor
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 13
- 239000003507 refrigerant Substances 0.000 claims description 6
- 238000005057 refrigeration Methods 0.000 claims description 4
- 239000011232 storage material Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Description
第１図はこの考案による空気調和機用半導体装
置の冷却装置の第１実施例の斜視図、第２図は空
気調和機が冷房時の冷凍サイクルの流れを示す説
明図、第３図はこの考案による空気調和機用半導
体装置の冷却装置の第２実施例の断面図、第４図
は従来の空気調和機用半導体装置の冷却装置の斜
視図である。
図において、１は空気調和機用半導体装置、２
，１３は放熱板、４は外壁、５は内壁、６，１４
はアキユムレータ、７は蓄冷剤、８は圧縮機、９
は四方弁、１０は凝縮器、１１は毛細管、１２は
冷却器である。なお、各図中同一符号は同一また
は相当部分を示す。
FIG. 1 is a perspective view of the first embodiment of the cooling device for a semiconductor device for an air conditioner according to this invention, FIG. 2 is an explanatory diagram showing the flow of the refrigeration cycle when the air conditioner is cooling, and FIG. FIG. 4 is a sectional view of a second embodiment of the invented cooling device for a semiconductor device for an air conditioner, and FIG. 4 is a perspective view of a conventional cooling device for a semiconductor device for an air conditioner. In the figure, 1 is a semiconductor device for an air conditioner; 2 is a semiconductor device for an air conditioner;
, 13 is a heat sink, 4 is an outer wall, 5 is an inner wall, 6, 14
is an accumulator, 7 is a cold storage agent, 8 is a compressor, 9
is a four-way valve, 10 is a condenser, 11 is a capillary tube, and 12 is a cooler. Note that the same reference numerals in each figure indicate the same or corresponding parts.
補正 昭６３．９．２１
考案の名称を次のように補正する。
考案の名称 空気調和機用半導体装置の冷却
装置
実用新案登録請求の範囲、図面の簡単な説明を
次のように補正する。Amendment September 21, 1981 The name of the invention is amended as follows. Title of the invention Cooling device for semiconductor devices for air conditioners The scope of the utility model registration claims and the brief description of the drawings are amended as follows.
【実用新案登録請求の範囲】
冷媒を高温・高圧のガス状冷媒にする圧縮機と
、該圧縮機によつて形成された高温・高圧のガス
状冷媒が熱交換器で熱交換して、アキユムレータ
を通過して再び前記圧縮機に導かれる冷凍サイク
ルを有する空気調和機に用いる空気調和機用半導
体装置を強制冷却する空気調和機用半導体装置の
冷却装置において、
前記アキユムレータ若しくは、前記空気調和機
用半導体装置の放熱板内に吸熱を蓄える蓄冷剤を
設け、前記放熱板を前記アキユムレータの表面に
密着させて取り付けたことを特徴とする空気調和
機用半導体装置の冷却装置。[Claim for Utility Model Registration] A compressor that converts refrigerant into a high-temperature, high-pressure gaseous refrigerant, and a heat exchanger in which the high-temperature, high-pressure gaseous refrigerant formed by the compressor exchanges heat, In a cooling device for a semiconductor device for an air conditioner, which forcibly cools a semiconductor device for an air conditioner that has a refrigeration cycle that passes through an accumulator and is guided to the compressor again, the accumulator or the air conditioner 1. A cooling device for a semiconductor device for an air conditioner, characterized in that a cool storage agent for storing absorbed heat is provided in a heat sink of the semiconductor device for use in an air conditioner, and the heat sink is attached in close contact with the surface of the accumulator.
【図面の簡単な説明】
第１図はこの考案による空気調和機用半導体装
置の冷却装置の第１実施例の斜視図、第２図は空
気調和機が冷房時の冷凍サイクルの流れを示す説
明図、第３図はこの考案による空気調和機用半導
体装置の冷却装置の第２実施例の断面図、第４図
は従来の空気調和機用半導体装置の冷却装置の斜
視図である。
図において、１は空気調和機用半導体装置、２
，１３は放熱板、４は外壁、５は内壁、６，１４
はアキユムレータ、７は蓄冷剤、８は圧縮機、９
は四方弁、１０は凝縮器、１１は毛細管、１２は
冷却器である。なお、各図中同一符号は同一また
は相当部分を示す。[Brief Description of the Drawings] Fig. 1 is a perspective view of the first embodiment of the cooling device for a semiconductor device for an air conditioner according to this invention, and Fig. 2 is an explanation showing the flow of the refrigeration cycle when the air conditioner is cooling. 3 is a sectional view of a second embodiment of the cooling device for a semiconductor device for an air conditioner according to this invention, and FIG. 4 is a perspective view of a conventional cooling device for a semiconductor device for an air conditioner. In the figure, 1 is a semiconductor device for an air conditioner; 2 is a semiconductor device for an air conditioner;
, 13 is a heat sink, 4 is an outer wall, 5 is an inner wall, 6, 14
is an accumulator, 7 is a cold storage agent, 8 is a compressor, 9
is a four-way valve, 10 is a condenser, 11 is a capillary tube, and 12 is a cooler. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
該圧縮機によつて形成された高温・高圧ガス状冷
媒が熱交換器で熱交換し室内を冷却して、アキユ
ムレータを通過して再び前記圧縮機に導かれる冷
凍サイクルを有する空気調和機に用いる空気調和
機用半導体装置を強制冷却する空気調和機用半導
体装置の冷却装置において、 前記アキユムレータ若しくは、前記空気調和機
用半導体装置の放熱板内に吸熱を蓄える蓄冷剤を
設け、前記放熱板を前記アキユムレータの表面に
密着させて取り付けたことを特徴とする空気調和
機用半導体装置の冷却装置。[Scope of claim for utility model registration] A compressor that converts refrigerant into a high-temperature, high-pressure gaseous refrigerant;
The high-temperature, high-pressure gaseous refrigerant formed by the compressor exchanges heat with a heat exchanger to cool the room, passes through an accumulator, and is led back to the compressor. Used in an air conditioner having a refrigeration cycle. In a cooling device for a semiconductor device for an air conditioner that forcibly cools a semiconductor device for an air conditioner, a cool storage agent for storing absorbed heat is provided in the accumulator or a heat sink of the semiconductor device for an air conditioner, and the heat sink is A cooling device for a semiconductor device for an air conditioner, characterized in that it is attached closely to the surface of an accumulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3193388U JPH01136873U (en) | 1988-03-10 | 1988-03-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3193388U JPH01136873U (en) | 1988-03-10 | 1988-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01136873U true JPH01136873U (en) | 1989-09-19 |
Family
ID=31258163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3193388U Pending JPH01136873U (en) | 1988-03-10 | 1988-03-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01136873U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014017933A (en) * | 2012-07-06 | 2014-01-30 | Mitsubishi Electric Corp | Freezer unit |
| JP2014122724A (en) * | 2012-12-20 | 2014-07-03 | Mitsubishi Electric Corp | Air conditioner and freezer |
-
1988
- 1988-03-10 JP JP3193388U patent/JPH01136873U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014017933A (en) * | 2012-07-06 | 2014-01-30 | Mitsubishi Electric Corp | Freezer unit |
| JP2014122724A (en) * | 2012-12-20 | 2014-07-03 | Mitsubishi Electric Corp | Air conditioner and freezer |
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