JPH01137529U - - Google Patents
Info
- Publication number
- JPH01137529U JPH01137529U JP3331088U JP3331088U JPH01137529U JP H01137529 U JPH01137529 U JP H01137529U JP 3331088 U JP3331088 U JP 3331088U JP 3331088 U JP3331088 U JP 3331088U JP H01137529 U JPH01137529 U JP H01137529U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- resist
- wafers
- plasma
- remove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010453 quartz Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000004380 ashing Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 9
- 238000010849 ion bombardment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Description
第１図ないし第３図は本考案の一実施例による
レジスト灰化用石英治具の構成を示すもので、第
１図はその平面図、第２図は立面図、第３図は側
面図である。
１：プラズマ遮蔽板、２：石英棒、３：溝、４
，５：結合部材。
Figures 1 to 3 show the structure of a quartz jig for resist ashing according to an embodiment of the present invention, in which Figure 1 is a plan view, Figure 2 is an elevation view, and Figure 3 is a side view. It is a diagram. 1: Plasma shielding plate, 2: Quartz rod, 3: Groove, 4
, 5: Connection member.
Claims (1)
数のウエーハから一括して前記表面のレジストを
灰化除去するためウエーハを互いに平行にかつ所
定の間隔をおいて並置せしめるバツチ式のレジス
ト灰化用石英治具であつて、前記並置されたウエ
ーハ中両端または１端にあるウエーハの外側で該
ウエーハからウエーハの並び間隔にほぼ等しい間
隔をおいた位置にウエーハと平行にウエーハと同
径以上のプラズマ遮蔽板が設置され、前記両端ま
たは１端にあるウエーハの外側の面をプラズマ中
のイオン衝撃から保護しつつレジスト除去を行わ
しめることを特徴とするレジスト灰化用石英治具
。 Quartz for resist ashing of batch type in which wafers are arranged parallel to each other at a predetermined interval in order to ash and remove the resist on the surface of a large number of wafers having resist attached to their surfaces in a plasma. The jig is a plasma shielding device having a diameter equal to or larger than that of the wafer and parallel to the wafer at a position on the outside of the wafer at both ends or one end of the juxtaposed wafers and spaced from the wafer at a distance approximately equal to the distance between the wafers. A quartz jig for resist ashing, characterized in that a plate is installed to remove the resist while protecting the outer surface of the wafer at both ends or one end from ion bombardment in plasma.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3331088U JPH01137529U (en) | 1988-03-14 | 1988-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3331088U JPH01137529U (en) | 1988-03-14 | 1988-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01137529U true JPH01137529U (en) | 1989-09-20 |
Family
ID=31259964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3331088U Pending JPH01137529U (en) | 1988-03-14 | 1988-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01137529U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59161825A (en) * | 1983-03-07 | 1984-09-12 | Mitsubishi Electric Corp | Manufacture of semiconductor element |
| JPS6117730B2 (en) * | 1975-12-15 | 1986-05-09 | Ricoh Kk |
-
1988
- 1988-03-14 JP JP3331088U patent/JPH01137529U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117730B2 (en) * | 1975-12-15 | 1986-05-09 | Ricoh Kk | |
| JPS59161825A (en) * | 1983-03-07 | 1984-09-12 | Mitsubishi Electric Corp | Manufacture of semiconductor element |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR910003762A (en) | A substrate having a semiconductor structure on an insulator having a gettering sheet and a method for manufacturing the same | |
| JPH0137871Y2 (en) | ||
| JPS6035766Y2 (en) | clamp device | |
| JPH0270429U (en) | ||
| JPH0713216Y2 (en) | Plasma processing device | |
| JPS5923414Y2 (en) | Double-sided alignment exposure machine wafer chuck mechanism | |
| JPH0316655U (en) | ||
| JPS6336923Y2 (en) | ||
| JP2551126Y2 (en) | Ion implanter | |
| JPS63157926U (en) | ||
| JPS61164042U (en) | ||
| JPH0358817U (en) | ||
| JPH0352071U (en) | ||
| JPS5811851U (en) | Arc extinguishing device for circuit breakers and breakers | |
| JPH01106558U (en) | ||
| JPS63118416U (en) | ||
| JPH0335920U (en) | ||
| JPH02106821U (en) | ||
| JPH0284322U (en) | ||
| JPH01171035U (en) | ||
| JPH02141950U (en) | ||
| JPS6350128U (en) | ||
| JPS6331529U (en) | ||
| JPS6331039U (en) | ||
| JPS6440230U (en) |