JPH01140899U - - Google Patents
Info
- Publication number
- JPH01140899U JPH01140899U JP1988036474U JP3647488U JPH01140899U JP H01140899 U JPH01140899 U JP H01140899U JP 1988036474 U JP1988036474 U JP 1988036474U JP 3647488 U JP3647488 U JP 3647488U JP H01140899 U JPH01140899 U JP H01140899U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- conductive resin
- potential
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036474U JPH01140899U (2) | 1988-03-18 | 1988-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036474U JPH01140899U (2) | 1988-03-18 | 1988-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140899U true JPH01140899U (2) | 1989-09-27 |
Family
ID=31263076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988036474U Pending JPH01140899U (2) | 1988-03-18 | 1988-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140899U (2) |
-
1988
- 1988-03-18 JP JP1988036474U patent/JPH01140899U/ja active Pending
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