JPH01143144U - - Google Patents
Info
- Publication number
- JPH01143144U JPH01143144U JP3931088U JP3931088U JPH01143144U JP H01143144 U JPH01143144 U JP H01143144U JP 3931088 U JP3931088 U JP 3931088U JP 3931088 U JP3931088 U JP 3931088U JP H01143144 U JPH01143144 U JP H01143144U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor element
- heat radiation
- circuit pattern
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案実施例半導体装置のリードフレ
ームの平面図、第２図ａはその半導体素子リレー
の平面図、第２図ｂは同図ａのＢ―Ｂ断面図、第
３図は従来の半導体装置の半導体素子リレーの回
路図、第４図ａはその内部構造を示す平面図、第
４図ｂは同図ａのＡ―Ａ断面図である。
１１：半導体素子、１２：光結合素子、１３：
トライアツクチツプ、１４：リードフレーム、１
５：放熱部、１６：回路パターン、１７：回路形
成部、１８：モールド樹脂。
FIG. 1 is a plan view of a lead frame of a semiconductor device according to an embodiment of the present invention, FIG. 2 a is a plan view of its semiconductor element relay, FIG. FIG. 4(a) is a plan view showing the internal structure thereof, and FIG. 4(b) is a sectional view taken along line AA in FIG. 4(a). 11: semiconductor element, 12: optical coupling element, 13:
Triax chip, 14: Lead frame, 1
5: heat radiation part, 16: circuit pattern, 17: circuit forming part, 18: mold resin.
Claims (1)
ドフレームに放熱部と回路パターンとを有し、前
記半導体素子のうち電力用半導体素子チツプを前
記放熱部上に直接配設するとともに、前記半導体
素子と前記リードフレーム上の回路パターンによ
り回路形成し、この回路形成部と前記放熱部をモ
ールド樹脂で絶縁被覆したことを特徴とする半導
体装置。 The lead frame includes a semiconductor element and a lead frame, the lead frame has a heat radiation part and a circuit pattern, and a power semiconductor element chip of the semiconductor element is directly disposed on the heat radiation part, and the semiconductor element and the circuit pattern are arranged directly on the heat radiation part. A semiconductor device characterized in that a circuit is formed by a circuit pattern on a lead frame, and the circuit forming part and the heat dissipation part are insulated and coated with a molding resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3931088U JPH01143144U (en) | 1988-03-24 | 1988-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3931088U JPH01143144U (en) | 1988-03-24 | 1988-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143144U true JPH01143144U (en) | 1989-10-02 |
Family
ID=31265820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3931088U Pending JPH01143144U (en) | 1988-03-24 | 1988-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143144U (en) |
-
1988
- 1988-03-24 JP JP3931088U patent/JPH01143144U/ja active Pending