JPH01145189U - - Google Patents
Info
- Publication number
- JPH01145189U JPH01145189U JP4111088U JP4111088U JPH01145189U JP H01145189 U JPH01145189 U JP H01145189U JP 4111088 U JP4111088 U JP 4111088U JP 4111088 U JP4111088 U JP 4111088U JP H01145189 U JPH01145189 U JP H01145189U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- device package
- upper frame
- lower frame
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第1図は本考案に係る電子機器パツケージの一
実施例を示す一部破断斜視図、第2図、第3図、
第5図、第6図はそれぞれ従来の電子機器パツケ
ージを示す側面図、第4図は第3図の正面図であ
る。
7……ガイドレール、8……ラツク、10,1
1……上部フレーム、12……下部フレーム、1
4……電子機器パツケージ(パツケージ)、15
……取付孔、19……案内ピン、20……案内孔
。
FIG. 1 is a partially cutaway perspective view showing an embodiment of an electronic device package according to the present invention, FIG. 2, FIG.
5 and 6 are side views showing a conventional electronic equipment package, and FIG. 4 is a front view of FIG. 3, respectively. 7...Guide rail, 8...Rack, 10,1
1... Upper frame, 12... Lower frame, 1
4...Electronic equipment package (package), 15
...Mounting hole, 19...Guide pin, 20...Guide hole.
Claims (1)
けられた一対のガイドレールに案内されてラツク
内に挿入され、前記上部フレーム及び下部フレー
ムの前面側に所定間隔でそれぞれ列設された固定
用の取付孔を用いて該ラツク側に固定される電子
機器パツケージにおいて、該電子機器パツケージ
が挿入される前記ガイドレールの位置の取付孔か
ら任意の長さ離れた位置にある取付孔に設けられ
た案内ピンと嵌合する案内孔が前記電子機器パツ
ケージの表面パネルに形成されてあることを特徴
とする電子機器パツケージ。 Fixing mounting holes inserted into the rack guided by a pair of guide rails provided perpendicularly to the upper frame and the lower frame, and provided in rows at predetermined intervals on the front sides of the upper frame and the lower frame, respectively. In an electronic equipment package that is fixed to the rack side using An electronic device package, wherein a matching guide hole is formed in a surface panel of the electronic device package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4111088U JPH01145189U (en) | 1988-03-30 | 1988-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4111088U JPH01145189U (en) | 1988-03-30 | 1988-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01145189U true JPH01145189U (en) | 1989-10-05 |
Family
ID=31267561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4111088U Pending JPH01145189U (en) | 1988-03-30 | 1988-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145189U (en) |
-
1988
- 1988-03-30 JP JP4111088U patent/JPH01145189U/ja active Pending
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