JPH01145587A - Probe apparatus with function of automatic replacement of probe card - Google Patents

Abstract

PURPOSE:To make it possible to execute inspection exactly, by indicating an information on each probe card on a accommodating vessel wherein a plurality of kinds of probe cards are accommodated. CONSTITUTION:During the inspection of the kind of a probe card in a prober element, each probe card 8 corresponding to another kind is stocked in a stand-by state in a stocker 12. An information on each kind of card 8 in the stocked state is indicated on an indication panel 13 provided in the stocker 12 so that it can be recognized from outside. Based on the content of this indication, the maintenance of the card 8 and the replacement thereof by another kind of card 8 are conducted according to the state of the stocked card 8. In this way, the state of employment of the card 8 can be recognized beforehand, and thus the execution of accurate inspection is enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a probe device with an automatic probe card exchange function.

(Prior Art) A probe device measures the electrical characteristics of each IC chip formed in large numbers on an object to be measured, such as a semiconductor wafer, and eliminates chips determined to be defective before the assembly process, thereby reducing costs. This is a device that contributes to improving productivity and productivity.

In recent years, due to the high integration and diversification of IC chips, the number of low-volume, high-mix production processes has increased, and as a result, the number of operations required by operators has increased significantly. In particular, the probe card must be replaced for each type of IC chip to be measured and for each different arrangement pattern of electrode pads. In this type of probe card replacement means, an operator manually loosens screws and the like at the mounting portion of the probe card, removes the probe card, and then installs a replacement probe card.

(Problems to be Solved by the Invention) However, in the above-mentioned probe device, the operator manually replaces the probe card every time the type of wafer is changed, which is contrary to automation in the semiconductor manufacturing process. Needless to say, it is extremely difficult to improve productivity, yield, quality, etc.

In addition, as an automatic exchange of probe cards, JP-A-58-19
No. 6029, JP-A-60-47433, JP-A-61-
No. 15339 and Japanese Unexamined Patent Publication No. 61-283138 have been proposed, but complete automatic exchange has not yet been put into practical use.

Especially when automatically replacing probe cards.

It is necessary to store multiple probe cards of different types in a storage container such as a stocker, but in this case, the accuracy of each probe card may decrease as the number of times it is used increases. If the state, for example, the number of contacts with the object to be measured, cannot be recognized, a deteriorated probe card is used to perform the measurement, resulting in a problem in that only unreliable results are obtained.

Further, due to the automation of the probe device, the operator only has to monitor each device, but there is a problem in that when checking the type of probe card stored therein, the operator must take the trouble to take out the probe card from the storage container.

This invention was made in response to the above-mentioned problems, and it is now possible to always store various normal probe cards in the storage position, and the type of probe card can be identified by looking.
To provide a probe device with an automatic probe card exchange function that can perform accurate measurements even when the probe card is automatically exchanged.

[Structure of the invention]

(Means for solving the problem) In a probe device that automatically attaches and measures probe cards corresponding to the object to be measured, information on each probe card can be recognized in a storage container that stores multiple types of probe cards. A probe device with an automatic probe card exchange function is provided.

(Effect) By providing the storage container that stores multiple probe cards in such a way that the information on each probe card can be recognized, the type and usage status of the probe card can be recognized, and various normal probe cards can always be stored in the storage container. This provides the effect of increasing reliability when measuring the object to be measured.

(Embodiment) Next, an embodiment of the probe device with a probe card automatic exchange function of the present invention will be described with reference to the drawings.

The configuration of this device mainly consists of a prober section and a probe card automatic exchange section (2). In the prober section (2), for example, 25 objects to be measured, such as semiconductor wafers (4), are placed in a vertical row at predetermined intervals in the thickness direction of the cassette (2).

The cassette (2) containing this wafer (4) is carried into the cassette storage section. The wafers (4) are taken out one by one from this storage section and transported to the preliminary positioning stage (2). After rotating this preliminary positioning stage (4) to perform preliminary positioning to an accuracy of approximately ±1° based on the orientation flat of the wafer (4), the wafer (2) is transferred to the measurement stage 0.

In order to accurately position the wafer (4) transferred to the measurement stage 0, a pattern recognition mechanism using a COD camera or a recognition mechanism using a laser is installed.

After accurately positioning the wafer (4) based on the pattern using this recognition mechanism, the probe card (c) attached to the insert ring installed above the measurement stage The probe needle (■) of the probe card (■) is soft-touched, and the electrical characteristics of the wafer (4) are automatically measured and inspected by the test head (10) provided above the probe card (to). When performing the measurement and inspection process for semiconductor wafers (4) using the prober unit (2) with such a continuous automatic measurement function, it is necessary to use the prober unit Probe card (8
) The zero-order probe card automatic exchange unit (■) that needs to be replaced will be explained.

This automatic exchange part (2) is provided in the rotary base of a test head (10) used for testing high frequency characteristics. As shown in FIG. 3, the probe card (2) is positioned in advance and mounted, for example, screwed, on the probe card holder (11). The probe card integrated with this holder (11) is attached to a stocker (1), which is a storage container that can store, for example, six types of probe cards in a column with appropriate intervals in the board thickness direction.
12).

At this time, each probe card (2) can be of a different type corresponding to a plurality of types of measurement/inspection target types. The above-mentioned storage stocker (12) stores information such as the type of probe card ■, usage status, for example, the number of measurement contacts between the probe needle (9) and the object to be measured, and the date of manufacture, etc., according to the storage position of each probe card ■. A display panel (13) is provided on which information about the probe card (1) is displayed. The display panel above (
13) is connected to the CPU of the probe device, and information such as the type and date of manufacture of the probe card (2) is manually entered by the operator from an operation panel (not shown).

Information on the usage status of the probe card (2), such as the number of contacts to be measured, is processed by the CPU of the probe device and displayed on the display panel (13). or.

A contact type switch (not shown) is provided at the position where each probe card ■ is placed in the stocker (12) to confirm that the probe card ■ is stored. is activated, and a display panel (13) or a storage recognition lamp (not shown) lights up. A transport mechanism (14) is provided for selectively transporting the probe card (1) housed in the stocker (12) as described above, together with the holder (11), to the probe card (2) installation position of the prober unit. This transport mechanism (1
4) As shown in FIG. 4, a rotary base (16) is placed on the base (15) of the probe card automatic transport mechanism (14) with a gap maintained therebetween.

On the rotating base (16), there is a telescopic arm 1 that is freely telescopic and has a structure in which a number of links are connected in an X shape with pivot pins.
7) is located.

A telescoping arm drive screw (18) slides on both ends of the telescoping arm (17) parallel to the direction of extension and contraction of the telescoping arm (17).
b) is attached to the rotating base (16). A pole nut (20) is screwed onto the telescoping arm drive screw (18), and the pole nut (20) and the telescoping arm (17)
The support pin (21) is connected to the support pin (21) by a nut connecting plate (22).

Also, on the rotating base (16) is a telescopic arm drive motor (23).
A gear (24) provided on the rotating shaft of this motor (23) and a gear (25) provided at one end of the telescopic arm drive screw (18) are connected to a timing belt (26).
are connected.

That is, the telescoping action of the telescoping arm (17) is performed by the rotation base (16).
The rotation of the telescopic arm drive motor (23) installed above is transmitted to the drive screw (18) via the timing belt (26), and this rotation causes the pole nut (20) screwed to the drive screw (18) to be rotated. By moving, the nut connecting plate (22) that connects the pole nut (20) and the support pin (21) of the telescopic arm (17) is moved.

A disc-shaped probe card mounting plate (27) is attached to the tip of the telescoping arm (17), and 12
Insert the probe card support pins (2
8) is installed protrudingly.

On the other hand, a rotary motor (29) is attached to the base (15), and a gear is attached to the rotating shaft of the rotary motor (29), and the gear is connected to the rotary base (16) and the base (15). ) is connected by a timing belt to a rotary base rotation shaft (not shown) provided in a gap between the two. That is, by rotating the rotary motor (29), the base (16) rotates once.
It has a rotating structure.

By the way, the base (15) can be moved up and down in the Z-axis direction by a vertical drive mechanism, and this vertical drive mechanism is made up of three vertical guide shafts (30) vertically installed on the probe device body and a vertical drive screw. It consists of a child (31) and a vertical drive motor (32).

A gear is attached to the rotating shaft of the vertical drive motor (32), and this gear is connected to a gear inserted through the lower end of the vertical drive screw (31) via a timing belt.

Each of the three vertical guide shafts (30) passes through a bearing member (33) provided on the base (15) and is hung vertically from the probe device main body, and the penetrating portion has a slidable structure. There is. Also, the vertical drive screw (31) has a pole nut (
34) are screwed together, and this pole nut (34) is fixed to the base (15).

That is, the vertical drive motor (
The base (15) is screwed onto the vertical drive screw (31) by rotating the vertical drive screw (31) by the rotation of 32).
This is done by raising and lowering the pole nut (34) that is integrated with the pole nut (34).

As described above, the probe card automatic exchange section (2) is configured, for example, within the hinge section that reduces rotational movement of the test head (10).

Here, while the prober section ■ is inspecting the product,
Each probe card (2) compatible with other types is stocked in a stocker (12) in a standby state.

Probe card information is displayed on a display panel (12) provided in the stocker (12) so that the operator can recognize the information on the various probe cards (8) in the stocked state from the outside. Based on the contents of this display, depending on the condition of the stocked probe card (■), maintenance or replacement with another type of probe card (■) may be performed. Also, among the probe card ■ information.

If a specified period of time has passed since the manufacturing date or if the number of test contacts is greater than the specified number, the probe device C.
The display panel (
12) A warning lamp may be lit.

Next, the operation of the probe device will be explained.

In the prober section (2), the semiconductor wafer (4) housed in the cassette (2) is conveyed to the measurement stage 0 after preliminary alignment. Here, the wafer (A) is accurately aligned and placed in a position facing the probe card (4) by a predetermined operation. Next, the S-stage stage (2) is raised to remove the IC chips formed on the wafer (4). The electrode pad and the probe needle (2) of the probe card (2) are connected and contacted, and in this connected state, the electrical characteristics of the IC chip are measured and inspected using a tester (not shown). The number of times of contact is counted by the CPU and added and displayed on the display panel (13) of the stocker (12). The above-mentioned measurement is repeated, and after the measurement of the relevant type is completed, the probe card is replaced with the probe card (3) corresponding to the first type. Next, such an automatic probe card exchange operation will be described.

First, a probe card (C) corresponding to the wafer type is selected based on the type information of the wafer (4) programmed in advance in the storage mechanism of the probe device CPU, and the probe card mounting plate (27) is placed in the card storage stocker. After extending the retractable arm (17) so as to insert it into the underside of the selected probe card (to) stored in (12).

The vertical drive motor (32) is driven to raise the base (15), and the probe card (2) is placed on the probe card placement plate (27). Then, the probe card (2) is temporarily placed on a probe card alignment mechanism (not shown) and aligned.

After alignment is complete, place the probe card (c) again.
Drive the rotary motor (29) to rotate the rotary base (16) to 90
After rotating the probe card (c) once, the telescopic arm (17) is extended to transport the probe card (c) to the bottom surface of the insert ring (1) provided on the bottom surface of the test head (10) of the probe device, and then the vertical motor (32) is activated. The probe card (15) is driven to raise the base (15) and the probe card (2) and the insert ring (2) come into contact with each other. After this, the probe card (2) and the insert ring (2) are fixed by the probe card fixing mechanism.

As explained above, in a probe device with an automatic probe card exchange function, probe card information such as type, date of manufacture, and number of measurement/inspection contacts is displayed in a stocker that stores various probe cards, corresponding to each type of probe card. By doing this, the usage status of the probe card can be recognized in advance, probe cards of good quality can always be stored in the storage container, and accurate inspection can be performed.

This invention is not limited to the above embodiments. For example, the information of various probe cards may not be displayed on the storage container, etc., but may be displayed all together on a TV screen, etc. Also, as shown in FIG. )
An illumination mechanism (35) may be provided in the probe card so that the state of the probe card can be visually confirmed.

Furthermore, attach the probe card to the insert ring,
In a probe device configured such that a plurality of probe cards that are integrated with this insert ring are stored in a stocker and the probe card is replaced together with the insert ring from above the prober section, the probe card information can be displayed in the same way. Effects similar to those of the embodiment can be obtained.

Further, the information on the probe card may be input from a host computer connected to the probe device.

Furthermore, although the probe card stored in the stocker has been described as one in which the probe card (1) and the holder (11) are integrated, the probe card itself may have a holder function.

Further, the probe card may accommodate probe cards of the same type, and the probe card can be replaced under conditions specified by the probe device even before all the wafers in the cassette have been measured.

[Brief explanation of the drawing]

FIG. 1 is a diagram of a probe device with an automatic probe card exchange function for explaining an embodiment of the present invention, FIG. 2 is a perspective view of FIG. 1, and FIG. 3 is a diagram of the stocker of FIG. 4 is a diagram of the conveyance mechanism of FIG. 1, and FIG. 5 is a diagram for explaining another embodiment of the stocker of FIG. 1. 1... Prober section 2... Probe card automatic exchange section 8... Probe card 11... Probe card holder 12... Stocker 13... Display panel 1
4...Transportation mechanism Figure 1 Figure 2 Figure 3 Figure 4; Acceptable Figure 5 Procedure amendment form

Claims (5)

[Claims] (1) A probe device that automatically attaches and measures probe cards corresponding to the object to be measured, characterized in that a storage container that stores a plurality of types of probe cards is provided in such a way that information on each probe card can be recognized. Probe device with automatic probe card exchange function. (2) The probe device with an automatic probe card exchange function according to claim 1, wherein the information on the probe card is the type and the state of use. (3) A visible display section corresponding to each probe card is provided in the storage container, and information about the probe card is displayed on this display section so that the probe card can be recognized. Probe device with automatic probe card exchange function. (4) A probe device with a probe card automatic exchange function, characterized in that an illumination mechanism is provided for each piece of information provided corresponding to each probe card stored in a storage container so that the information on the probe card can be recognized. (5) The probe device with an automatic probe card exchange function according to claim 3, wherein the displayed content is probe card information calculated and stored in a CPU memory within the probe device.