JPH01149601A - Circuit device - Google Patents

Abstract

PURPOSE:To improve the workability of assembling works of a circuit device and the radio wave cut-off of the circuit by providing shielding bodies which shield plural circuit elements from a chip member and a cap which encloses the circuit elements and electrically connecting the plural circuit elements with each other by forming a wiring pattern in the chip member. CONSTITUTION:A matching chip member 21 is manufactured in such a way that an upper-layer chip 25 is put on a lower layer chip 24 and they are heated with a pressure. When they are heated with a pressure after the upper-layer chip 25 is put on the lower-layer chip 24, they are integrated and biers 30 and 31 are respectively butted and connected to biers 42 and 43. Biers 38 and 40 are respectively connected to the vicinity of both ends of a matching pattern 28 and biers 39 and 41 are respectively connected with the vicinity of both ends of another matching pattern 29. Therefore, in the matching chip member 21 a pattern 33 for earthing on the upper surface and a metallic film 27 on the lower surface are electrically connected with each other through the biers 30, 31, 42, and 43. Since no protruding terminal exists on the upper surface side of a metallic container main body 22, wire bonding can be carried out at a high workability.

Description

[Detailed Description of the Invention] (Required by IIJ) The purpose of this invention is to improve assembly workability and radio wave blocking with respect to circuit devices equipped with semiconductor circuit elements etc. that operate in the micro@ region. A plurality of circuit elements mounted on the container body, a chip-shaped chip member disposed between the plurality of circuit elements on the container body, and a shield connected to the chip member and between the circuit elements in a phase U. and a cap that is fixed to the container body and seals the circuit element,
A wiring pattern is formed inside the groove member, and the plurality of circuit elements are electrically connected via the wiring pattern.

[Industrial application field]

The present invention relates to a circuit device including a semiconductor circuit element etc. that operates in the microwave region.

[Conventional technology]

Figures 8 and 9 are conventional circuit devices! i1 is shown.

2.3 is a semiconductor circuit element that operates in the microwave region, such as a high frequency amplifier or an oscillator.

4 is a metal container body, and 5 is a metal cap.

6 is a high frequency input terminal, 7 is an intermediate frequency output terminal, 8 is a power supply terminal, and 9 is a built-in circuit control terminal.

The semiconductor circuit element 2.3G is mounted on a predetermined portion (ff) on the upper surface of the L metal container body 4.

A bowl-shaped portion 10.11 is formed in the metal 4-piece 75 in correspondence with each semiconductor circuit element 2.3. gold f14 yap 5
In this case, the bowl-shaped portions 10 and 11 cover the semiconductor circuit elements 2 and 3, respectively, and are fixed to the metal container body 4.

Thereby, the semiconductor circuit elements 2.3 are mutually shielded and hermetically sealed.

12 is a matching chip member, as shown in FIG.
This configuration has a matching pattern 14 on the surface of a ceramic chip 13.

The matching chip member 12 is fixed to the lower surface of the metal container main body 4 in such a direction that the matching pattern 14 is exposed on the lower surface.

Wires 15 and 16 are connected between the ends of the matching pattern 14 and the connection terminals 17 and 18, respectively.

As a result, the semiconductor circuit elements 2 and 3 are matched and electrically connected.

[Problem that the invention seeks to solve]

A plurality of terminals 6 to 9 protrude from the lower surface of the metal container body 4, making it difficult to bond the wires 15 and 16, resulting in poor assembly workability.

Further, the wires 15, 16 and the matching chip pattern 14 are exposed on the lower surface side of the metal container main body 4, and radio waves leak from these parts, causing interference with surrounding circuits. Therefore, in reality, a measure has been taken to cover the exposed portion shown in FIG. There was a problem with it being put away.

SUMMARY OF THE INVENTION An object of the present invention is to provide a circuit device that can improve assembly workability and radio wave blocking.

[Means for solving problems]

The present invention provides a container body, a plurality of circuit elements mounted on the container body, a chip-shaped chip member disposed between the plurality of circuit elements on the container body, and a chip member connected to the chip member. It has a shield body that mutually shields the circuit elements, and a 4-yapple that is fixed to the container body and seals the circuit elements, and a wiring pattern is formed inside the chip member, and the wiring pattern The plurality of circuit elements are electrically connected via.

[For n] ゛The chip member moves the wire wiring location from the bottom side to the top side of the metal container body. As a result, wire bonding can be performed with good work efficiency, and the mass productivity of circuit devices is improved.

Moreover, due to the structure related to the grounding pattern of the chip member,
The shield effect is not impaired in any way.

The metal cap also covers the wire and the chip member, making a shielding effect on the lower surface unnecessary.

(Embodiment) FIG. 1 is an enlarged view schematically showing the configuration of a main part of an embodiment of a circuit device of the present invention. The upper portion of the illustrated toilet compartment is shown in perspective view. FIGS. 2 and 3 are a sectional view and an exploded perspective view, respectively, of an embodiment of the circuit device of the present invention. In each figure, components that are substantially the same as those shown in FIGS. 8 and 9 are designated by the same reference numerals, and their explanations will be omitted.

The circuit device 2ff20 is constructed by removing the matching chip member 12, connection terminals 17, 18, and wires 15, 16 from FIGS. 8 and 9, and instead providing the matching chip member 21 on the upper surface of the metal container body 22. The configuration is as follows. 23 is a metal cap.

First, the matching chip member 21 will be explained.

The matching chip member 21 is manufactured by stacking an upper layer chip 25 shown in FIG. 5 on a lower chip 24 shown in FIG. 4, and pressing and heating the same. This manufacturing technique is the same as that of the laminated ceramic substrate, and detailed explanation will be omitted. Furthermore, for convenience of illustration, FIGS. 4 and 5 are shown in perspective views.

As shown in FIG. 4, the lower chip 24 has a chip 26 made of alumina ceramic as its main body, has a metal film 27 on its entire lower surface, and has two 500-diameter stripes on its upper surface that cross this in the direction of the arrow X. It has a matching pattern 28°29, and also has an arrow Y
Near both ends of the direction, the lower end is the metal l! 27 and has an exposed upper end 730.31.

As shown in FIG. 5, the upper depth 25 has an alumina ceramic depth 32 as its main body, and has an arrow Y in the center of the upper surface.
The grounding pattern 33 extends across the direction, and also has two wire bonding pads 34.35° and 36.37 at both ends of the top surface in the direction of the arrow X, and corresponds to each of the wire bonding pads 34 to 37. Via 38.39
．． It is of 411G construction with a diameter of 40° 41 and vias 42 and 43 corresponding to both ends of the grounding pattern 33.

By stacking the chips 24 and 25 and heating them under pressure, they are integrated, and as shown in FIG. 38 and 40 are connected to the vicinity of both ends of the matching pattern 28, respectively, and vias 39 and 41 are connected to the matching pattern 29, respectively.
connected near both ends of. Matching patterns 28 and 29 are hidden inside.

As a result, in the matching chip part @21, the grounding pattern 33 on the upper surface and the metal film 27 on the lower surface are connected to the via 30°, 31.42°.
43, wire bonding pads 34 and 36 are electrically connected via via 38.40 and matching pattern 28 hidden inside, and wire bonding pads 35 and 37 are electrically connected via via 40 and matching pattern 28 hidden inside. 39, 41 and the matching pattern 29 hidden inside.

Vias 30.31 and 42.43 constitute a first via;
Vias 38 to 41 constitute a second via.

The size of the matching chip member 21 is, for example, a thickness of 0.8
m+, and the length of each side is 5a111.

Further, the gold 11 film 27 and the internal alignment patterns 28 and 29 are metallized layers made of, for example, molybdenum, and the vias 30 and 31 are formed by filling with silver solder or the like.

The matching chip member 21 is provided on the upper surface of the metal container body 22.
A recess 45 having a size corresponding to that is formed.

As shown in FIG. 1, the matching tip part @21
Fits inside IS45, gold wAIg on the bottom! 27 and the bottom surface of the recess 45 are fixed with solder 46.

With the matching chip member 21 fixed in this manner, the grounding pattern 33 has the same potential as the metal container body 22.

Here, as shown in FIG. 6, the solder 46 is solidified while the flat weight 47 is bent, and the alignment chip member 21 is solidified.
In this case, the grounding pattern 33 is connected to the upper surface 48 of the metal container body 22.
It is fixed at the same height. Further, instead of the solder 46, a galvanic W4 resin may be used.

50, 51, 52, and 53 are wires, respectively.

54.55 are pads on the semiconductor circuit element 2, 56°57
is a pad on the semiconductor circuit element 3.

The wire 50 is bonded to the pad 54 and the pad 34 for wiring. Similarly, the wire 51 is wired between pads 55 and 35, the wire 52 is wired between pads 56 and 35, and the wire 53 is wired between pads 57 and 37.

In this way, the wires 50 to 53 are wired on the upper surface side of the metal container body 22. Terminals protrude from the upper surface of the metal container body 22, and wire bonding can be performed with good workability. This significantly improves the mass productivity of the circuit device 120. As shown in FIG.
51, the bowl-shaped portion 11 covers the semiconductor circuit element 3 and the wires 52, 53, and further, as shown in FIGS. 1 and 7, the protruding portion 61 of the partition portion 60 covers the matching chip member. It is in contact with the entire length of the grounding pattern 33 in the longitudinal direction at a location 21, and is fixed to the metal container body 22 while being in contact with the upper surface 48 of the metal container body 22 at other locations.

As a result, the semiconductor circuit element 2.3 is connected to the wires 50 to 53.
They are each hermetically sealed and shielded from each other.

Especially regarding the shield, metal cap 23G,
L! The section crossing the P-coupling chip member 21 is in contact with the grounding pattern 33 and has the same potential as the metal container body 22 . Therefore, the above-mentioned section has a shielding effect like the other parts where the protrusion 61 is in contact with the metal container main body 22, and the space between the small rooms 62 and 63 is completely shielded. .

Here, the wires 50 to 53 are also shielded, and there is no need for a dedicated shield member on the lower surface side for the wires 50 to 53 and the matching chip member 21.

Furthermore, there is no need to provide a cap 19 as shown in FIG. 8 on the lower surface of the metal container body 4, and the circuit device 20 can be stably mounted on the circuit board.

Note that by appropriately changing the shape of the metal cap, no recess is formed in the metal container body 22, and the matching chip member 21
It is also possible to have a structure in which the metal cap is fixed to the upper surface of the metal container main body 22 and the metal cap contacts the alignment chip member 21 along the alignment tip member 21.

Further, both the metal container body 22 and the metal cap 23 are made of iron and are nickel plated.

〔Effect of the invention〕

As explained above, according to the present invention, wires can be routed on the top side of the metal container body, and since no terminals protrude from the top side of the metal container body, wire bonding can be performed with good workability. I can do it. Therefore, the flj property can be significantly improved, and manufacturing costs can be reduced.

Moreover, the shielding effect is not impaired in any way, and a good shielding effect can be obtained.

Furthermore, the wires and the matching pattern portion are also shielded together with the semiconductor circuit element by the metal cap, so that a shield member on the lower surface side may be unnecessary.

[Brief explanation of the drawing]

FIG. 1 is an enlarged view schematically showing essential parts of an embodiment of the circuit device of the present invention, FIG. 2 is a sectional view of an embodiment of the circuit device of the present invention, and FIG. FIG. 4 is a perspective view of a lower layer chip; FIG. 5 is a perspective view of an upper layer chip; FIG. 6 is a diagram illustrating a method of fixing matching chip members; FIG. 7 Figure 8 is a cross-sectional view of an example of a conventional circuit device, and Figure 9 is a diagram of a conventional circuit device 6. FIG. 10 is a perspective view of the matching tip member in FIG. 8. In the figure, 2.3 is a semiconductor circuit element, 20 is a circuit device, 21 is a matching chip member, 22 is a metal container body, 23 is a metal cap, 24 is a lower layer chip, 25 is an upper layer chip, 26.32 is a chip, 27 is a metal film, 28.29 is a matching pattern, 30.31.38-43 is a grounding pattern for via 33, 34-37 is a wire bonding pad, 38-41 is a via, 45 is a recess, 46 is solder, 50 53 is a wire, 54, 55, 56, 57 is a pad, and 61 is a protrusion. shows. Figure 2 ゛ 113 Figure 9 Lower layer + A? Figure 4 Figure 6

Claims (2)

[Claims] (1) A container body (4, 22) and a container body (4, 22).
) and a chip-shaped chip member (21) disposed between the plurality of circuit elements (2, 3) on the container body (4, 22). , a shield body (60) connected to the chip member (21) and mutually shielding the circuit elements (2, 3), and the container body (4).
, 22) for sealing the circuit elements (2, 3), a wiring pattern (28, 29) is formed inside the chip member (21), and the wiring pattern (28, 29) is formed inside the chip member (21). A circuit device characterized in that the plurality of circuit elements (2, 3) are electrically connected via patterns (28, 29). (2) A recess (45) into which the chip member (21) fits is formed on the upper surface of the container body (4, 22), and the chip member (21) fitted into the recess (45) )
2. The circuit device according to claim 1, wherein the upper surface is substantially the same height as the upper surface of the container body (4, 22).