JPH01151994U - - Google Patents
Info
- Publication number
- JPH01151994U JPH01151994U JP4342888U JP4342888U JPH01151994U JP H01151994 U JPH01151994 U JP H01151994U JP 4342888 U JP4342888 U JP 4342888U JP 4342888 U JP4342888 U JP 4342888U JP H01151994 U JPH01151994 U JP H01151994U
- Authority
- JP
- Japan
- Prior art keywords
- sheet metal
- electronic components
- soldered
- shield
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
従来の一例の半田付動作図、第３図ａおよびｂは
従来の具体例の平面図および側面図である。
１……板金部品、２……半田付箇所、３……貫
通穴、１０……半田ごて。
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a soldering operation diagram of a conventional example, and FIGS. 3A and 3B are a plan view and a side view of a conventional example. 1... Sheet metal parts, 2... Soldering points, 3... Through holes, 10... Soldering iron.
Claims (1)
れ、これら電子部品の一部あるいは全部を外部ノ
イズから遮蔽するために半田付の行われる板金部
品において、 前記の半田付を行う箇所の周囲に複数個の貫通
穴を設けることを特徴とする板金部品。[Claims for Utility Model Registration] In sheet metal parts that are mounted together with electronic components on a printed wiring board and are soldered to shield some or all of these electronic components from external noise, A sheet metal part characterized by having multiple through holes around the area to be processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4342888U JPH01151994U (en) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4342888U JPH01151994U (en) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01151994U true JPH01151994U (en) | 1989-10-19 |
Family
ID=31269827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4342888U Pending JPH01151994U (en) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01151994U (en) |
-
1988
- 1988-03-31 JP JP4342888U patent/JPH01151994U/ja active Pending