JPH01154652U - - Google Patents
Info
- Publication number
- JPH01154652U JPH01154652U JP1988050743U JP5074388U JPH01154652U JP H01154652 U JPH01154652 U JP H01154652U JP 1988050743 U JP1988050743 U JP 1988050743U JP 5074388 U JP5074388 U JP 5074388U JP H01154652 U JPH01154652 U JP H01154652U
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- receiving element
- sealed
- utility
- device characterized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図は本考案赤外光受光装置の一つの実施例
を示す断面図、第２図及び第３図は赤外受光装置
の各別の従来例を示す断面図である。 符号の説明、１……受光素子、５……可視光カ
ツト染料入り樹脂、６……透明樹脂。
を示す断面図、第２図及び第３図は赤外受光装置
の各別の従来例を示す断面図である。 符号の説明、１……受光素子、５……可視光カ
ツト染料入り樹脂、６……透明樹脂。
Claims (1)
- 【実用新案登録請求の範囲】 受光素子の受光面を可視光カツト染料が混合さ
れた樹脂でインナーコートし、 上記受光素子を透明樹脂で封止してなる ことを特徴とする赤外光受光装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988050743U JPH01154652U (ja) | 1988-04-15 | 1988-04-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988050743U JPH01154652U (ja) | 1988-04-15 | 1988-04-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01154652U true JPH01154652U (ja) | 1989-10-24 |
Family
ID=31276781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988050743U Pending JPH01154652U (ja) | 1988-04-15 | 1988-04-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01154652U (ja) |
-
1988
- 1988-04-15 JP JP1988050743U patent/JPH01154652U/ja active Pending