JPH01154663U - - Google Patents
Info
- Publication number
- JPH01154663U JPH01154663U JP5205788U JP5205788U JPH01154663U JP H01154663 U JPH01154663 U JP H01154663U JP 5205788 U JP5205788 U JP 5205788U JP 5205788 U JP5205788 U JP 5205788U JP H01154663 U JPH01154663 U JP H01154663U
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- copper
- metal plate
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
本考案で使用される金属板の平面図、第３図は形
成された印刷配線板の断面図である。
１…絶縁樹脂、２…金属板、３…穴、４…銅膜
、５…スルーホール、６…導体膜。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a plan view of a metal plate used in the present invention, and FIG. 3 is a sectional view of a printed wiring board formed. DESCRIPTION OF SYMBOLS 1... Insulating resin, 2... Metal plate, 3... Hole, 4... Copper film, 5... Through hole, 6... Conductor film.
Claims (1)
金属板を挟んで板状に形成した絶縁樹脂と、この
絶縁樹脂の少なくとも片面に一体形成した銅膜と
で構成した銅張積層板。 A copper-clad laminate comprising an insulating resin formed into a plate shape with a highly rigid metal plate having a plurality of regularly arranged holes sandwiched therebetween, and a copper film integrally formed on at least one side of the insulating resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5205788U JPH01154663U (en) | 1988-04-18 | 1988-04-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5205788U JPH01154663U (en) | 1988-04-18 | 1988-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01154663U true JPH01154663U (en) | 1989-10-24 |
Family
ID=31278067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5205788U Pending JPH01154663U (en) | 1988-04-18 | 1988-04-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01154663U (en) |
-
1988
- 1988-04-18 JP JP5205788U patent/JPH01154663U/ja active Pending