JPH01156009U - - Google Patents
Info
- Publication number
- JPH01156009U JPH01156009U JP4681388U JP4681388U JPH01156009U JP H01156009 U JPH01156009 U JP H01156009U JP 4681388 U JP4681388 U JP 4681388U JP 4681388 U JP4681388 U JP 4681388U JP H01156009 U JPH01156009 U JP H01156009U
- Authority
- JP
- Japan
- Prior art keywords
- metal frame
- plate
- upper plate
- lower plate
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 238000000748 compression moulding Methods 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図は本考案の熱可塑性プラスチツク圧縮成
形板用金型を示す。 １…上板、２…下板、３…金わく、４…クツシ
ヨン材。 第２図は得られた試験片の各領域Ａ〜Ｅを示す
模式図を示す。
形板用金型を示す。 １…上板、２…下板、３…金わく、４…クツシ
ヨン材。 第２図は得られた試験片の各領域Ａ〜Ｅを示す
模式図を示す。
Claims (1)
- 上板、下板、クツシヨン材、及び金わくからな
り、上板と下板とは金わくのそれぞれ上下に位置
し、上板と金わくとの間及び／又は下板と金わく
との間にクツシヨン材を配することを特徴とする
熱可塑性プラスチツク圧縮成形板用金型。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4681388U JPH01156009U (ja) | 1988-04-08 | 1988-04-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4681388U JPH01156009U (ja) | 1988-04-08 | 1988-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01156009U true JPH01156009U (ja) | 1989-10-26 |
Family
ID=31273061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4681388U Pending JPH01156009U (ja) | 1988-04-08 | 1988-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01156009U (ja) |
-
1988
- 1988-04-08 JP JP4681388U patent/JPH01156009U/ja active Pending