JPH01157498U - - Google Patents
Info
- Publication number
- JPH01157498U JPH01157498U JP4725388U JP4725388U JPH01157498U JP H01157498 U JPH01157498 U JP H01157498U JP 4725388 U JP4725388 U JP 4725388U JP 4725388 U JP4725388 U JP 4725388U JP H01157498 U JPH01157498 U JP H01157498U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- heat
- main body
- conductive film
- shrinkable tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Insulated Conductors (AREA)
Description
第１図は本考案にかかる電子部品の完成品の正
面図、第２図は第１図の−線断面図、第３図
は電子部品本体と熱収縮チユーブとの分解斜視図
である。
１……電子部品、１ａ……電子部品本体、２…
…絶縁基板、３，４，５……端子、６……絶縁性
樹脂、７……導電膜、８……絶縁層、９……熱収
縮チユーブ。
FIG. 1 is a front view of a completed electronic component according to the present invention, FIG. 2 is a sectional view taken along the line -- in FIG. 1, and FIG. 3 is an exploded perspective view of the electronic component main body and a heat-shrinkable tube. 1...Electronic component, 1a...Electronic component body, 2...
... Insulating substrate, 3, 4, 5 ... Terminal, 6 ... Insulating resin, 7 ... Conductive film, 8 ... Insulating layer, 9 ... Heat shrink tube.
Claims (1)
成した熱収縮チユーブを、電子部品本体の周囲に
熱圧着させたことを特徴とする電子部品のシール
ド構造。 A shield structure for an electronic component, characterized in that a heat-shrinkable tube having a conductive film formed on at least one of its inner or outer surfaces is thermocompression bonded around the main body of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988047253U JPH066559Y2 (en) | 1988-04-06 | 1988-04-06 | Shield structure for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988047253U JPH066559Y2 (en) | 1988-04-06 | 1988-04-06 | Shield structure for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01157498U true JPH01157498U (en) | 1989-10-30 |
| JPH066559Y2 JPH066559Y2 (en) | 1994-02-16 |
Family
ID=31273476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988047253U Expired - Lifetime JPH066559Y2 (en) | 1988-04-06 | 1988-04-06 | Shield structure for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH066559Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04170099A (en) * | 1990-09-27 | 1992-06-17 | Mitsubishi Electric Corp | Shield structure of electronic parts |
| JPH07202466A (en) * | 1993-12-16 | 1995-08-04 | Schlegel Corp | Shield envelope and shield electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014949U (en) * | 1973-06-05 | 1975-02-17 | ||
| JPS5858342U (en) * | 1981-10-14 | 1983-04-20 | 株式会社リコー | hybrid integrated circuit |
| JPS6219746U (en) * | 1985-07-18 | 1987-02-05 | ||
| JPS6350199U (en) * | 1986-09-19 | 1988-04-05 |
-
1988
- 1988-04-06 JP JP1988047253U patent/JPH066559Y2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014949U (en) * | 1973-06-05 | 1975-02-17 | ||
| JPS5858342U (en) * | 1981-10-14 | 1983-04-20 | 株式会社リコー | hybrid integrated circuit |
| JPS6219746U (en) * | 1985-07-18 | 1987-02-05 | ||
| JPS6350199U (en) * | 1986-09-19 | 1988-04-05 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04170099A (en) * | 1990-09-27 | 1992-06-17 | Mitsubishi Electric Corp | Shield structure of electronic parts |
| JPH07202466A (en) * | 1993-12-16 | 1995-08-04 | Schlegel Corp | Shield envelope and shield electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH066559Y2 (en) | 1994-02-16 |