JPH01159366U - - Google Patents
Info
- Publication number
- JPH01159366U JPH01159366U JP5538588U JP5538588U JPH01159366U JP H01159366 U JPH01159366 U JP H01159366U JP 5538588 U JP5538588 U JP 5538588U JP 5538588 U JP5538588 U JP 5538588U JP H01159366 U JPH01159366 U JP H01159366U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lead
- attachment pattern
- hybrid integrated
- lead attachment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
- 238000009434 installation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例による高周波混成
集積回路の斜視図、第２図は取り付け断面図、第
３図は従来の高周波混成集積回路の斜視図、第４
図は取り付け断面図である。
図において、１は放熱フイン、２はアルミナ基
板、３はリード、４はリードパターン、５はケー
ス、６はガラスエポキシ基板、７はスルーホール
である。なお、図中、同一符号は同一、または相
当部分を示す。
Fig. 1 is a perspective view of a high frequency hybrid integrated circuit according to an embodiment of the invention, Fig. 2 is an installation sectional view, Fig. 3 is a perspective view of a conventional high frequency hybrid integrated circuit, and Fig. 4
The figure is a sectional view of the installation. In the figure, 1 is a heat radiation fin, 2 is an alumina substrate, 3 is a lead, 4 is a lead pattern, 5 is a case, 6 is a glass epoxy substrate, and 7 is a through hole. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
波混成集積回路において、リード取り付けパター
ンを回路基板の放熱フインへの取り付け面にも設
け、回路基板上面とリード取り付けパターンをス
ルーホールで接続すると共に、リードをスルーホ
ールを通し回路基板の両面で固定することを特徴
とする高周波混成集積回路。 In a high-frequency hybrid integrated circuit that includes a heat dissipation fin, a circuit board, and a lead, a lead attachment pattern is also provided on the surface of the circuit board that is attached to the heat dissipation fin, and the top surface of the circuit board and the lead attachment pattern are connected with through holes, and the lead attachment pattern is A high-frequency hybrid integrated circuit that is fixed on both sides of a circuit board through through-holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5538588U JPH01159366U (en) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5538588U JPH01159366U (en) | 1988-04-25 | 1988-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01159366U true JPH01159366U (en) | 1989-11-06 |
Family
ID=31281289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5538588U Pending JPH01159366U (en) | 1988-04-25 | 1988-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01159366U (en) |
-
1988
- 1988-04-25 JP JP5538588U patent/JPH01159366U/ja active Pending