JPH01161327U - - Google Patents

Info

Publication number
JPH01161327U
JPH01161327U JP1988057526U JP5752688U JPH01161327U JP H01161327 U JPH01161327 U JP H01161327U JP 1988057526 U JP1988057526 U JP 1988057526U JP 5752688 U JP5752688 U JP 5752688U JP H01161327 U JPH01161327 U JP H01161327U
Authority
JP
Japan
Prior art keywords
semiconductor chip
supports
glass
support member
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988057526U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988057526U priority Critical patent/JPH01161327U/ja
Publication of JPH01161327U publication Critical patent/JPH01161327U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Die Bonding (AREA)
JP1988057526U 1988-04-27 1988-04-27 Pending JPH01161327U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988057526U JPH01161327U (2) 1988-04-27 1988-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988057526U JPH01161327U (2) 1988-04-27 1988-04-27

Publications (1)

Publication Number Publication Date
JPH01161327U true JPH01161327U (2) 1989-11-09

Family

ID=31283377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988057526U Pending JPH01161327U (2) 1988-04-27 1988-04-27

Country Status (1)

Country Link
JP (1) JPH01161327U (2)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55134942A (en) * 1979-04-09 1980-10-21 Fujitsu Ltd Manufacturing of semiconductor device
JPS57165476A (en) * 1981-04-06 1982-10-12 Sony Corp Bonding method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55134942A (en) * 1979-04-09 1980-10-21 Fujitsu Ltd Manufacturing of semiconductor device
JPS57165476A (en) * 1981-04-06 1982-10-12 Sony Corp Bonding method

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