JPH01161329U - - Google Patents
Info
- Publication number
- JPH01161329U JPH01161329U JP5796988U JP5796988U JPH01161329U JP H01161329 U JPH01161329 U JP H01161329U JP 5796988 U JP5796988 U JP 5796988U JP 5796988 U JP5796988 U JP 5796988U JP H01161329 U JPH01161329 U JP H01161329U
- Authority
- JP
- Japan
- Prior art keywords
- fixed
- lead
- movable
- mold plates
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 230000002265 prevention Effects 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 4
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は、本考案に係る樹脂封止成形装置の要
部を示す一部切欠縦断正面図であり、その型締状
態を示している。第２図は、該装置の型開状態を
示す一部切欠縦断正面図である。第３図は、該装
置の下型側における要部の一部切欠平面図であり
、該下型のセツト部に半導体リードフレームをセ
ツトした状態を示している。第４図は、下型キヤ
ビテイ部と上下両弯曲変形防止用部材との配設位
置関係、及び、該弯曲変形防止用部材とエジエク
タープレートとの嵌合配設状態を示す概略平面図
である。第５図は他の実施例を示すものであり、
弯曲変形防止用部材と半導体リードフレームとの
配設位置関係を概略的に示す平面図である。
〔符号の説明〕、Ｓ１…スペース、Ｓ２……ス
ペース、１……固定盤、２……金型プレート、３
……固定上型（固定型）、４……可動盤、５……
金型プレート、６……可動下型（可動型）、１１
……キヤビテイ、１２……キヤビテイ、１４……
半導体リードフレーム、１５……セツト部、１６
……半導体製品、１７……エジエクタープレート
、１８……エジエクタープレート、２５……弯曲
変形防止用部材、２５１……端部、２６……弯曲
変形防止用部材、２６１……端部、２７……固着
具、２８……外部リード。
FIG. 1 is a partially cutaway longitudinal sectional front view showing the main parts of the resin encapsulation molding apparatus according to the present invention, and shows the mold clamping state. FIG. 2 is a partially cutaway longitudinal sectional front view showing the device in an open state. FIG. 3 is a partially cutaway plan view of the main part on the lower die side of the device, showing a state in which a semiconductor lead frame is set in the setting portion of the lower die. FIG. 4 is a schematic plan view showing the arrangement positional relationship between the lower die cavity portion and both upper and lower curved deformation prevention members, and the fitted state of the curved deformation prevention member and the ejector plate. . FIG. 5 shows another embodiment,
FIG. 2 is a plan view schematically showing the arrangement positional relationship between a member for preventing curved deformation and a semiconductor lead frame. [Explanation of symbols], S1 ...Space, S2 ...Space, 1...Fixed plate, 2...Mold plate, 3
... Fixed upper mold (fixed type), 4 ... Movable platen, 5 ...
Mold plate, 6...Movable lower mold (movable mold), 11
... Cavity, 12... Cavity, 14...
Semiconductor lead frame, 15...Set part, 16
... Semiconductor product, 17 ... Ejector plate, 18 ... Ejector plate, 25 ... Curvature deformation prevention member, 25 1 ... End part, 26 ... Curvature deformation prevention member, 26 1 ... End part , 27... Fixture, 28... External lead.
Claims (1)
及び可動両盤に所要のスペースを保つて夫々固着
した両金型プレートと、該両金型プレートに夫々
固着して対向配設した固定型及び可動型と、上記
両スペース内に夫々嵌装した製品突出用のエジエ
クタープレートとを備えると共に、上記固定及び
可動両型のＰ．Ｌ面に、四方向リード導出型の半
導体リードフレーム用セツト部を設けた樹脂封止
成形装置において、上記セツト部にセツトした半
導体リードフレームの四方向外部リードの各位置
と対応する上記両スペース内の各位置に、上記両
金型プレートの弯曲変形防止用部材を夫々各別に
嵌装配設して構成したことを特徴とするフラツト
パツケージ型半導体製品用の樹脂封止成形装置。 (2) 対向配設した固定盤及び可動盤と、該固定
及び可動両盤に所要のスペースを保つて夫々固着
した両金型プレートと、該両金型プレートに夫々
固着して対向配設した固定型及び可動型と、上記
両スペース内に夫々嵌装した製品突出用のエジエ
クタープレートとを備えると共に、上記固定及び
可動両型のＰ．Ｌ面に、四方向リード導出型の半
導体リードフレーム用セツト部を設けた樹脂封止
成形装置において、上記セツト部にセツトした半
導体リードフレームの樹脂封止範囲間における各
二方向外部リードの各位置と対応する上記両スペ
ース内の各位置に、上記両金型プレートの弯曲変
形防止用部材を夫々各別に嵌装すると共に、該各
弯曲変形防止用部材の端部を残る他の各二方向外
部リードの各位置と対応する方向に延長して形成
することにより、該各弯曲変形防止用部材を上記
半導体リードフレームの四方向外部リードの各位
置と対応する夫々の各位置に配設して構成したこ
とを特徴とするフラツトパツケージ型半導体製品
用の樹脂封止成形装置。[Scope of Claim for Utility Model Registration] (1) A fixed plate and a movable plate arranged opposite each other, both mold plates fixed to both the fixed and movable plates with a required space, and both mold plates. It includes a fixed type and a movable type that are fixed and arranged opposite to each other, and an ejector plate for protruding the product that is fitted in each of the above spaces, and a fixed type and a movable type P. In a resin encapsulation molding apparatus having a four-way lead lead-out type semiconductor lead frame set part on the L side, both of the above-mentioned spaces corresponding to the respective positions of the four-direction external leads of the semiconductor lead frame set in the set part are A resin sealing molding apparatus for a flat package type semiconductor product, characterized in that members for preventing curved deformation of both of the mold plates are individually fitted in respective positions of the mold plates. (2) A fixed plate and a movable plate arranged opposite each other, both mold plates fixed to both the fixed and movable plates with the required space, and fixed to both mold plates respectively and arranged facing each other. The fixed and movable P. In a resin sealing molding apparatus having a four-way lead lead-out type semiconductor lead frame setting part on the L side, each position of each two-way external lead between the resin sealing ranges of the semiconductor lead frame set in the setting part is The curved deformation prevention members of the two mold plates are separately fitted into respective positions in the two spaces corresponding to the curved deformation prevention members, and the ends of the curved deformation prevention members are fitted to the outside in each of the other two directions. By extending in a direction corresponding to each position of the lead, each curved deformation prevention member is arranged at each position corresponding to each position of the four-directional external lead of the semiconductor lead frame. A resin sealing molding device for flat package type semiconductor products, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988057969U JP2544146Y2 (en) | 1988-04-28 | 1988-04-28 | Resin encapsulation molding equipment for flat package type semiconductor products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988057969U JP2544146Y2 (en) | 1988-04-28 | 1988-04-28 | Resin encapsulation molding equipment for flat package type semiconductor products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01161329U true JPH01161329U (en) | 1989-11-09 |
| JP2544146Y2 JP2544146Y2 (en) | 1997-08-13 |
Family
ID=31283807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988057969U Expired - Lifetime JP2544146Y2 (en) | 1988-04-28 | 1988-04-28 | Resin encapsulation molding equipment for flat package type semiconductor products |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2544146Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279632A (en) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | Resin sealing device |
-
1988
- 1988-04-28 JP JP1988057969U patent/JP2544146Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6279632A (en) * | 1985-10-03 | 1987-04-13 | Mitsubishi Electric Corp | Resin sealing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2544146Y2 (en) | 1997-08-13 |
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