JPH01161334U - - Google Patents

Info

Publication number
JPH01161334U
JPH01161334U JP1988057447U JP5744788U JPH01161334U JP H01161334 U JPH01161334 U JP H01161334U JP 1988057447 U JP1988057447 U JP 1988057447U JP 5744788 U JP5744788 U JP 5744788U JP H01161334 U JPH01161334 U JP H01161334U
Authority
JP
Japan
Prior art keywords
wafer cassette
wafer
cassette positioning
wafers
positioning jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988057447U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988057447U priority Critical patent/JPH01161334U/ja
Publication of JPH01161334U publication Critical patent/JPH01161334U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例を示すウエハカセ
ツト位置決め治具の断面図、第2図は従来のウエ
ハカセツト位置決め治具を示す断面図である。 図に於いて、1はウエハ、2はウエハカセツト
、3はウエハカセツト位置決め治具、4はウエハ
ガイド、5はウエハ支持面、6はウエハガイド取
付ねじを示す。なお、図中、同一符号は同一部分
を示す。
FIG. 1 is a sectional view of a wafer cassette positioning jig showing an embodiment of this invention, and FIG. 2 is a sectional view of a conventional wafer cassette positioning jig. In the figure, 1 is a wafer, 2 is a wafer cassette, 3 is a wafer cassette positioning jig, 4 is a wafer guide, 5 is a wafer support surface, and 6 is a wafer guide mounting screw. Note that in the figures, the same reference numerals indicate the same parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ウエハを化学処理する工程で使用するウエハカ
セツト位置決め部にウエハをウエハカセツト底面
部より浮かせるウエハガイド部を併設させた事を
特徴とするウエハカセツト位置決め治具。
A wafer cassette positioning jig characterized in that a wafer cassette positioning part used in a process of chemically processing wafers is provided with a wafer guide part for floating the wafers above the bottom surface of the wafer cassette.
JP1988057447U 1988-04-27 1988-04-27 Pending JPH01161334U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988057447U JPH01161334U (en) 1988-04-27 1988-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988057447U JPH01161334U (en) 1988-04-27 1988-04-27

Publications (1)

Publication Number Publication Date
JPH01161334U true JPH01161334U (en) 1989-11-09

Family

ID=31283303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988057447U Pending JPH01161334U (en) 1988-04-27 1988-04-27

Country Status (1)

Country Link
JP (1) JPH01161334U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020008949A (en) * 2000-07-21 2002-02-01 김광교 A wafer boat for a semiconductor device fabrication

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020008949A (en) * 2000-07-21 2002-02-01 김광교 A wafer boat for a semiconductor device fabrication

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