JPH0116269B2 - - Google Patents
Info
- Publication number
- JPH0116269B2 JPH0116269B2 JP5176882A JP5176882A JPH0116269B2 JP H0116269 B2 JPH0116269 B2 JP H0116269B2 JP 5176882 A JP5176882 A JP 5176882A JP 5176882 A JP5176882 A JP 5176882A JP H0116269 B2 JPH0116269 B2 JP H0116269B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- copolymer
- compounds
- resin
- epoxy group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 150000001875 compounds Chemical class 0.000 claims description 29
- 229920001577 copolymer Polymers 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 21
- 125000003700 epoxy group Chemical group 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 16
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 14
- -1 aromatic vinyl compound Chemical class 0.000 claims description 12
- 239000004431 polycarbonate resin Substances 0.000 claims description 11
- 229920005668 polycarbonate resin Polymers 0.000 claims description 11
- 150000001336 alkenes Chemical class 0.000 claims description 10
- 229920000578 graft copolymer Polymers 0.000 claims description 10
- 239000011342 resin composition Substances 0.000 claims description 9
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 7
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 239000005977 Ethylene Substances 0.000 claims description 4
- 150000008360 acrylonitriles Chemical class 0.000 claims description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 4
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims description 3
- 239000004711 α-olefin Substances 0.000 claims 2
- 239000004417 polycarbonate Substances 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 229920000515 polycarbonate Polymers 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- 150000001993 dienes Chemical class 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920001897 terpolymer Polymers 0.000 description 3
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- VYXHVRARDIDEHS-QGTKBVGQSA-N (1z,5z)-cycloocta-1,5-diene Chemical compound C\1C\C=C/CC\C=C/1 VYXHVRARDIDEHS-QGTKBVGQSA-N 0.000 description 1
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical class CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- XHAFIUUYXQFJEW-UHFFFAOYSA-N 1-chloroethenylbenzene Chemical compound ClC(=C)C1=CC=CC=C1 XHAFIUUYXQFJEW-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- YAJYJWXEWKRTPO-UHFFFAOYSA-N 2,3,3,4,4,5-hexamethylhexane-2-thiol Chemical compound CC(C)C(C)(C)C(C)(C)C(C)(C)S YAJYJWXEWKRTPO-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- RYPKRALMXUUNKS-UHFFFAOYSA-N 2-Hexene Natural products CCCC=CC RYPKRALMXUUNKS-UHFFFAOYSA-N 0.000 description 1
- MUUOUUYKIVSIAR-UHFFFAOYSA-N 2-but-3-enyloxirane Chemical compound C=CCCC1CO1 MUUOUUYKIVSIAR-UHFFFAOYSA-N 0.000 description 1
- JRKURGYOYLHRHT-UHFFFAOYSA-N 2-ethenyl-2,3-dimethyloxirane Chemical compound CC1OC1(C)C=C JRKURGYOYLHRHT-UHFFFAOYSA-N 0.000 description 1
- FVCDMHWSPLRYAB-UHFFFAOYSA-N 2-ethenyl-2-methyloxirane Chemical compound C=CC1(C)CO1 FVCDMHWSPLRYAB-UHFFFAOYSA-N 0.000 description 1
- NMSZFQAFWHFSPE-UHFFFAOYSA-N 3-(oxiran-2-ylmethoxycarbonyl)but-3-enoic acid Chemical class OC(=O)CC(=C)C(=O)OCC1CO1 NMSZFQAFWHFSPE-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- GXBYFVGCMPJVJX-UHFFFAOYSA-N Epoxybutene Chemical compound C=CC1CO1 GXBYFVGCMPJVJX-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- GOAJGXULHASQGJ-UHFFFAOYSA-N ethene;prop-2-enenitrile Chemical group C=C.C=CC#N GOAJGXULHASQGJ-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- DPUXQWOMYBMHRN-UHFFFAOYSA-N hexa-2,3-diene Chemical compound CCC=C=CC DPUXQWOMYBMHRN-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 229920006027 ternary co-polymer Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、耐衝撃性、耐候性、加工性に優れる
とともにウエルド強度に優れる新規な熱可塑性樹
脂組成物に関する。
ポリカーボネート樹脂(以下PCと記す。)は優
れた耐衝撃性および耐熱性を有するエンジニアリ
ングプラスチツクとして広く知られている。ま
た、PCの価格低減ならびに成形性と衝撃強度の
厚み依存性を改良したPCとABS樹脂(アクリロ
ニトリル−ジエン系ゴム−スチレン重合体)との
混合物(特公昭38−15225)、耐候性ならびに耐汚
染性を改良したPCとAES樹脂(アクリロニトリ
ル−エチレン・プロピレン系ゴム−スチレン重合
体)との混合物(特開昭48−48547)等も広く知
られている。
しかしながら、PC−AES樹脂組成物は、成形
品表面にフローマークや層剥離が発生しやすく、
かつ、成形方法として最も一般的な射出成形にお
いては、成形品の形状および大きさによつて、ゲ
ート数および樹脂の流動状態を変える必要がある
ために、必ず異方向に流れる樹脂が交差する箇
所、いわゆる“ウエルド部”が生じるが、従来の
組成物ではウエルド部の強度、“ウエルド強度”
が十分ではなく実用的な成形性といつた面からは
不十分であり、実用的に優れた材料とは言い難い
のが現状である。
本発明者等は、このようなポリカーボネート樹
脂とAES樹脂とからなる樹脂組成物のウエルド
強度の向上について鋭意研究した結果、ポリカー
ボネート樹脂とAES樹脂からなる組成物にエポ
キシ基含有オレフイン共重合体を配合することに
より、耐衝撃性、耐候性、耐熱性および加工性は
もちろんのこと、ウエルド強度に優れる組成物が
得られることを見出し、本発明に到達したもので
ある。
すなわち、本発明は、ポリカーボネート樹脂(A)
10〜90重量%と、AES樹脂(B)90〜10重量%から
なる樹脂組成物にエポキシ基含有オレフイン共重
合体(C)を配合したことを特徴とする熱可塑性樹脂
組成物を提供するものである。
以下に本発明の熱可塑性樹脂組成物について詳
細に説明する。
ポリカーボネート樹脂(A)としては、芳香族ポリ
カーボネート、脂肪族ポリカーボネート、脂肪族
−芳香族ポリカーボネート等々を挙げることがで
きる。一般には、2.2−ビス(4−オキシフエニ
ル)アルカン系、ビス(4−オキシフエニル)エ
ーテル系、ビス(4−オキシフエニル)スルホ
ン、スルフイドまたはスルホキサイド系などのビ
スフエノール類からなる重合体、もしくは共重合
体であり、目的に応じてハロゲンで置換されたビ
スフエノール類を用いた重合体である。
さらに、AES樹脂(B)について説明する。AES
樹脂とは、エチレン−プロピレン系ゴム質共重合
体と芳香族ビニル化合物、シアン化ビニル化合物
および他の重合性単量体化合物のうち少なくとも
二群より選ばれるおのおの一種以上の化合物から
なるグラフト重合体(b−1)100〜10重量%と
芳香族ビニル化合物、シアン化ビニル化合物およ
び他の重合性単量体化合物のうち少なくとも二群
より選ばれるおのおの一種以上の化合物からなる
共重合体(b−2)0〜90重量%からなる樹脂で
ある。
グラフト重合体(b−1)を構成するエチレン
−プロピレン系ゴム質共重合体とは、エチレンと
プロピレンからなる二元共重合体(EPR)、エチ
レン、プロピレンおよび非共役ジエンからなる三
元共重合体(EPDM)などであり、一種または
二種以上用いられる。
三元共重合体(EPDM)における非共役ジエ
ンとしては、ジシクロペンタジエン、エチリデン
ノルボルネン、1.4−ヘキサジエン、1.4−シクロ
ヘプタジエン、1.5−シクロオクタジエン等が挙
げられる。
二元共重合体(EPR)および三元共重合体
(EPDM)におけるエチレンとプロピレンのモル
比は5:1から1:3の範囲であることが好まし
い。
また、三元共重合体(EPDM)においては非
共役ジエンの割合がヨウ素価に換算して2〜50の
範囲のものが好ましい。
グラフト重合体(b−1)および共重合体(b
−2)を構成する芳香族ビニル化合物としては、
スチレン、α−メチルスチレン、α−クロルスチ
レン、ビニルトルエンなどが挙げられ、一種又は
二種以上用いることができる。特にスチレンが好
ましく用いられる。
シアン化ビニル化合物としては、アクリロニト
リル、メタアクリロニトリルなどが挙げられ、一
種又は二種以上用いることができる。特にアクリ
ロニトリルが好ましく用いられる。さらに、他の
重合性単量体化合物としては、メチル、エチル、
プロピル、ブチル、ベンジル、ヘキシルなどのア
クリル酸エステル化合物およびメタアクリル酸エ
ステル化合物が挙げられ、一種又は二種以上用い
ることができる。特にメタアクリル酸メチルが好
ましく用いられる。
上述の芳香族ビニル化合物、シアン化ビニル化
合物ならびに他の重合性単量体化合物のうち少な
くとも二群より選ばれるおのおの一種以上の化合
物が用いられる。
グラフト重合体(b−1)におけるこれら化合
物とゴム質共重合体との重量比は、その目的に応
じて適当な範囲を選ぶことができる。通常化合物
90〜30重量%、ゴム質共重合体10〜70重量%が好
ましく用いられる。
ゴム質共重合体の存在下、化合物を重合してグ
ラフト重合体(b−1)を造る方法としては、公
知の方法がすべて利用できる。たとえば、懸濁重
合法、塊状重合法、乳化重合法、溶液重合法など
である。
AES樹脂(B)はグラフト重合体(b−1)100〜
10重量%および共重合体(b−2)0〜90重量%
よりなる。共重合体(b−2)が90重量%を超え
る、すなわち、グラフト重合体(b−1)が10重
量%未満では十分な耐衝撃性が得られない。
ポリカーボネート(A)とAES樹脂(B)との組成比
は、ポリカーボネート10〜90重量%、AES樹脂
90〜10重量%である。ポリカーボネート(A)10重量
%未満では耐熱性の低下が著しく好ましくない。
また、90重量%を超えると加工性が低下し、ウエ
ルド強度も改善されない。好ましくはポリカーボ
ネート(A)30〜70重量%である。
エポキシ基含有オレフイン共重合体(C)とは、不
飽和エポキシ化合物とオレフインまたは、これら
とエチレン系不飽和化合物からなる共重合体であ
る。エポキシ基含有オレフイン共重合体(C)の組成
比には特に制限はないが、不飽和エポキシ化合物
0.05〜95重量%であることが好ましい。
不飽和エポキシ化合物としては、分子中にオレ
フインおよびエチレン系不飽和化合物と共重合し
うる不飽和基と、エポキシ基をそれぞれ有する化
合物である。
例えば、下記一般式()、()および()
で表わされるような不飽和グリシジルエステル
類、不飽和グリシジルエーテル類、エポキシアル
ケン類、P−グリシジルスチレン類などの不飽和
エポキシ化合物である。
(Rはエチレン系不飽和結合を有するC2〜18の炭
化水素基である。)
(Rはエチレン系不飽和結合を有するC2〜18の炭
化水素基である。Xは−CH2−O−、
The present invention relates to a novel thermoplastic resin composition that has excellent impact resistance, weather resistance, processability, and weld strength. Polycarbonate resin (hereinafter referred to as PC) is widely known as an engineering plastic having excellent impact resistance and heat resistance. In addition, we have developed a mixture of PC and ABS resin (acrylonitrile-diene rubber-styrene polymer) that reduces the price of PC and improves the thickness dependence of moldability and impact strength. A mixture of PC with improved properties and AES resin (acrylonitrile-ethylene/propylene rubber-styrene polymer) (Japanese Unexamined Patent Publication No. 48-48547) is also widely known. However, PC-AES resin compositions tend to cause flow marks and delamination on the surface of molded products.
In addition, in injection molding, which is the most common molding method, it is necessary to change the number of gates and the flow state of the resin depending on the shape and size of the molded product, so there are always places where resin flowing in different directions intersects. , a so-called "weld part" occurs, but in conventional compositions, the strength of the weld part, "weld strength"
Currently, it is difficult to say that it is a material that is practically excellent, as it is insufficient in terms of practical moldability. As a result of intensive research into improving the weld strength of such resin compositions made of polycarbonate resin and AES resin, the present inventors have found that an olefin copolymer containing an epoxy group is blended into a composition made of polycarbonate resin and AES resin. It was discovered that by doing so, a composition having excellent weld strength as well as impact resistance, weather resistance, heat resistance, and processability can be obtained, and the present invention was achieved based on this finding. That is, the present invention provides polycarbonate resin (A)
Provided is a thermoplastic resin composition characterized in that an epoxy group-containing olefin copolymer (C) is blended into a resin composition consisting of 10 to 90% by weight of AES resin (B) and 90 to 10% by weight of AES resin (B). It is. The thermoplastic resin composition of the present invention will be explained in detail below. Examples of the polycarbonate resin (A) include aromatic polycarbonate, aliphatic polycarbonate, aliphatic-aromatic polycarbonate, and the like. Generally, it is a polymer or copolymer consisting of bisphenols such as 2.2-bis(4-oxyphenyl)alkanes, bis(4-oxyphenyl)ethers, bis(4-oxyphenyl)sulfones, sulfides, or sulfoxides. It is a polymer using bisphenols substituted with halogen depending on the purpose. Furthermore, AES resin (B) will be explained. AES
The resin is a graft polymer consisting of an ethylene-propylene rubbery copolymer and one or more compounds each selected from at least two groups of aromatic vinyl compounds, vinyl cyanide compounds, and other polymerizable monomer compounds. (b-1) A copolymer (b- 2) It is a resin consisting of 0 to 90% by weight. The ethylene-propylene rubbery copolymer constituting the graft polymer (b-1) is a binary copolymer (EPR) consisting of ethylene and propylene, or a ternary copolymer consisting of ethylene, propylene, and a non-conjugated diene. (EPDM), etc., and one or more types are used. Examples of the non-conjugated diene in the terpolymer (EPDM) include dicyclopentadiene, ethylidene norbornene, 1.4-hexadiene, 1.4-cycloheptadiene, and 1.5-cyclooctadiene. The molar ratio of ethylene to propylene in the binary copolymer (EPR) and terpolymer (EPDM) is preferably in the range of 5:1 to 1:3. Further, in the terpolymer (EPDM), it is preferable that the proportion of non-conjugated diene is in the range of 2 to 50 in terms of iodine value. Graft polymer (b-1) and copolymer (b
-2) The aromatic vinyl compound constituting
Examples include styrene, α-methylstyrene, α-chlorostyrene, vinyltoluene, etc., and one or more types can be used. In particular, styrene is preferably used. Examples of vinyl cyanide compounds include acrylonitrile and methacrylonitrile, and one or more types can be used. Acrylonitrile is particularly preferably used. Furthermore, other polymerizable monomer compounds include methyl, ethyl,
Examples include acrylic ester compounds and methacrylic ester compounds such as propyl, butyl, benzyl, and hexyl, and one or more types can be used. In particular, methyl methacrylate is preferably used. One or more compounds selected from at least two groups of the above-mentioned aromatic vinyl compounds, vinyl cyanide compounds, and other polymerizable monomer compounds are used. The weight ratio of these compounds and the rubbery copolymer in the graft polymer (b-1) can be selected within an appropriate range depending on the purpose. normal compound
90 to 30% by weight and 10 to 70% by weight of the rubbery copolymer are preferably used. All known methods can be used to produce the graft polymer (b-1) by polymerizing a compound in the presence of a rubbery copolymer. Examples include suspension polymerization, bulk polymerization, emulsion polymerization, and solution polymerization. AES resin (B) is graft polymer (b-1) 100~
10% by weight and copolymer (b-2) 0-90% by weight
It becomes more. If the content of the copolymer (b-2) exceeds 90% by weight, that is, if the content of the graft polymer (b-1) is less than 10% by weight, sufficient impact resistance cannot be obtained. The composition ratio of polycarbonate (A) and AES resin (B) is 10 to 90% by weight of polycarbonate and AES resin.
It is 90-10% by weight. If the amount of polycarbonate (A) is less than 10% by weight, the heat resistance will drop significantly, which is undesirable.
Moreover, if it exceeds 90% by weight, workability will decrease and weld strength will not be improved. Preferably it is 30 to 70% by weight of polycarbonate (A). The epoxy group-containing olefin copolymer (C) is a copolymer consisting of an unsaturated epoxy compound and an olefin, or these and an ethylenically unsaturated compound. There is no particular restriction on the composition ratio of the epoxy group-containing olefin copolymer (C), but unsaturated epoxy compounds
It is preferably 0.05 to 95% by weight. The unsaturated epoxy compound is a compound having an epoxy group and an unsaturated group copolymerizable with an olefin and an ethylenically unsaturated compound in the molecule. For example, the following general formulas (), () and ()
These are unsaturated epoxy compounds such as unsaturated glycidyl esters, unsaturated glycidyl ethers, epoxy alkenes, and P-glycidyl styrenes. (R is a C2-18 hydrocarbon group having an ethylenically unsaturated bond.) (R is a C2-18 hydrocarbon group having an ethylenically unsaturated bond. X is -CH2 -O-,
【式】または[expression] or
【式】である。)
(Rはエチレン系不飽和結合を有するC2〜18の炭
化水素基である。R′は水素またはメチル基であ
る。)
具体的にはグリシジルアクリレート、グリシジ
ルメタクリレート、イタコン酸グリシジルエステ
ル類、ブテンカルボン酸エステル類、アリルグリ
シジルエーテル、2−メチルアリルグリシジルエ
ーテル、スチレン−P−グリシジルエーテル、
3,4−エポキシブテン、3,4−エポキシ−3
−メチル−1−ブテン、3,4−エポキシ−1−
ペンテン、3,4−エポキシ−3−メチルペンテ
ン、5,6−エポキシ−1−ヘキセン、ビニルシ
クロヘキセンモノオキシド、P−グリシジルスチ
レンなどが挙げられ、一種又は二種以上用いるこ
とができる。
オレフインとして、エチレン、プロピレン、ブ
テン−1、4メチルペンテン−1などが挙げら
れ、一種又は二種以上用いることができる。
またエチレン系不飽和化合物としては、オレフ
イン類、飽和カルボン酸成分にC2〜6を含むビニル
エステル類、飽和アルコール成分にC1〜8を含むア
クリル酸およびメタクリル酸エステル類およびマ
レイン酸エステル類、ハロゲン化ビニル類、ビニ
ルエーテル類、N−ビニルラクタム類、カルボン
酸アミド類などが挙げられ、一種又は二種以上用
いることができる。
これらのエチレン系不飽和化合物は、不飽和エ
ポキシ化合物とオレフインとの共重合の際、全化
合物に対して50重量%以下、特に0.1〜45重量%
共重合される。
エポキシ基含有オレフイン共重合体(C)は種々の
方法で作ることができる。例えば、不飽和エポキ
シ化合物とオレフイン、場合によつてはエチレン
系不飽和化合物をラジカル発生剤の存在下、50〜
4000気圧、40〜300℃で接触させる方法、ポリプ
ロピレンに不飽和エポキシ化合物を混合し、高真
空下ガンマ線を照射して重合体を作る方法等が挙
げられる。
エポキシ基含有オレフイン共重合体(C)の配合量
には特に制限はないが、ポリカーボネート樹脂(A)
とAES樹脂(B)の合計100重量部当り0.1〜40重量部
であることが特に好ましい。0.1重量部未満では
分散性に問題があり、また、40重量部を超えると
成形品に層剥離が発生する傾向がある。
ポリカーボネート樹脂、AES樹脂およびエポ
キシ基含有オレフイン共重合体の混合順序には何
ら制限はなく、予めこれら3成分のうち2成分の
みを混合し、その後残る1成分を添加混合しても
よく、また、3成分を一括混合してもよい。
なお、混合に際して公知の安定剤、帯電防止
剤、滑剤、染顔料などの添加剤を適宜配合しても
よい。
以下に実施例を挙げて説明するが、本発明はこ
れらによつて何ら制限されるものでない。
実施例および比較例
ポリカーボネート樹脂、AES樹脂およびエポ
キシ基含有オレフイン共重合体を表−1に示す配
合比率に基づき、一括混合し、各種組成物(試料
番号1〜12)を得た。得られた組成物の物性を表
−2に示す。
本実施例および比較例に用いられたAES樹脂
およびエポキシ基含有オレフイン共重合体は以下
の処方により得られたものである。なお、ポリカ
ーボネート樹脂およびポリエチレン樹脂は市販の
ものである。
Γポリカーボネート樹脂(A)
帝人化成社製“パンライト L−1250W”
ΓAES樹脂(B)
グラフト重合体(b−1)
ヨウ素価8.5、ムーニー粘度61、プロピレン
含有量43重量%、ジエン成分としてエチリデン
ノルボルネンを含むEPDM550重量部をn−ヘ
キサン3000重量部および二塩化エチレン1500重
量部に溶解し、スチレン300重量部、アクリロ
ニトリル150重量部および過酸化ベンゾイル11
重量部を加え、65℃、10時間窒素雰囲気中で重
合した。重合液を大過剰のメタノールと接触さ
せ、折出した沈殿物を分離、乾燥後グラフト重
合体(ゴム含量約54%)を得た。
共重合体(b−2)
スチレン70重量%およびアクリロニトリル30
重量%を混合した溶液100重量部にt−ドデシ
ルメルカプタン0.1重量部を加え、90℃で3時
間塊状で予備重合し、その後、水210重量部、
メチルセルロース1.0重量部、過酸化ベンゾイ
ル0.3重量部を加えて水分散系で30℃から90℃
へ温度を上昇させ、10時間重合させた。
脱水後共重合体(固有粘度0.50)を得た。
Γエポキシ基含有オレフイン共重合体(C)
通常のオートクレープ型ポリエチレン製造装
置2000Kg/cm2まで圧縮されたエチレンモノマー
とグリシジルメタクリレートまたはそれらと酢
残ビニルを触媒(ジ−t−ブチルパーオキサイ
ド)とともに加え、撹拌しながら150〜300℃に
維持して数分間塊状重合させ、セパレーターを
通して共重合体(C)を分離し、取り出した。
Γポリエチレン
住友化学社製“スミカセンハード2703”
−ウエルド強度−
ゲート間隔100mmの2つのゲート(各2.5×2.0
mm)より溶融樹脂(260℃)を射出し、厚さ3mm
縦横各150mmの試験片を作成する。
試験片を治具(高さ80mm、内径120mm、外径126
mm)の上に載せる。
−30℃に調整された低温室で1Kgの鋼球を試験
片中心部に落下させ、試験片が破壊しない最大エ
ネルギー値(Kg・cm)を求める。[Formula]. ) (R is a C2-18 hydrocarbon group having an ethylenically unsaturated bond. R' is hydrogen or a methyl group.) Specifically, glycidyl acrylate, glycidyl methacrylate, itaconic acid glycidyl esters, butene carboxyl acid esters, allyl glycidyl ether, 2-methylallyl glycidyl ether, styrene-P-glycidyl ether,
3,4-epoxybutene, 3,4-epoxy-3
-Methyl-1-butene, 3,4-epoxy-1-
Examples include pentene, 3,4-epoxy-3-methylpentene, 5,6-epoxy-1-hexene, vinylcyclohexene monoxide, and P-glycidylstyrene, and one or more of them can be used. Examples of the olefin include ethylene, propylene, butene-1, 4-methylpentene-1, etc., and one or more types can be used. Examples of ethylenically unsaturated compounds include olefins, vinyl esters containing C 2 to 6 in the saturated carboxylic acid component, acrylic and methacrylic esters and maleic esters containing C 1 to 8 in the saturated alcohol component, Examples include vinyl halides, vinyl ethers, N-vinyl lactams, and carboxylic acid amides, and one or more types can be used. When copolymerizing an unsaturated epoxy compound and an olefin, these ethylenically unsaturated compounds are added in an amount of 50% by weight or less, especially 0.1 to 45% by weight based on the total compound.
Copolymerized. The epoxy group-containing olefin copolymer (C) can be produced by various methods. For example, an unsaturated epoxy compound and an olefin, in some cases an ethylenically unsaturated compound, are combined in the presence of a radical generator for 50 to
Examples include a method of contacting at 4000 atm and 40 to 300°C, and a method of preparing a polymer by mixing an unsaturated epoxy compound with polypropylene and irradiating it with gamma rays under high vacuum. There is no particular restriction on the amount of the epoxy group-containing olefin copolymer (C), but polycarbonate resin (A)
It is particularly preferable that the amount is 0.1 to 40 parts by weight per 100 parts by weight of the AES resin (B) and AES resin (B). If it is less than 0.1 part by weight, there is a problem with dispersibility, and if it exceeds 40 parts by weight, there is a tendency for layer peeling to occur in the molded product. There is no restriction on the mixing order of the polycarbonate resin, AES resin, and epoxy group-containing olefin copolymer; only two of these three components may be mixed in advance, and then the remaining one component may be added and mixed; The three components may be mixed all at once. In addition, known additives such as stabilizers, antistatic agents, lubricants, dyes and pigments may be appropriately blended during mixing. Examples will be described below, but the present invention is not limited thereto. Examples and Comparative Examples Polycarbonate resin, AES resin, and epoxy group-containing olefin copolymer were mixed at once based on the blending ratio shown in Table 1 to obtain various compositions (sample numbers 1 to 12). Table 2 shows the physical properties of the obtained composition. The AES resin and epoxy group-containing olefin copolymer used in the present examples and comparative examples were obtained by the following formulation. Note that the polycarbonate resin and polyethylene resin are commercially available. Γ Polycarbonate resin (A) “Panlite L-1250W” manufactured by Teijin Chemicals Γ AES resin (B) Graft polymer (b-1) Iodine value 8.5, Mooney viscosity 61, propylene content 43% by weight, ethylidene norbornene as diene component 550 parts by weight of EPDM containing 3000 parts by weight of n-hexane and 1500 parts by weight of ethylene dichloride were dissolved in 300 parts by weight of styrene, 150 parts by weight of acrylonitrile and 11 parts by weight of benzoyl peroxide.
Parts by weight were added and polymerized at 65°C for 10 hours in a nitrogen atmosphere. The polymerization solution was brought into contact with a large excess of methanol, and the precipitate precipitated was separated and dried to obtain a graft polymer (rubber content approximately 54%). Copolymer (b-2) 70% by weight of styrene and 30% by weight of acrylonitrile
0.1 part by weight of t-dodecyl mercaptan was added to 100 parts by weight of a mixed solution of 2% by weight, prepolymerized in bulk at 90°C for 3 hours, and then 210 parts by weight of water,
Add 1.0 parts by weight of methylcellulose and 0.3 parts by weight of benzoyl peroxide and mix in an aqueous dispersion system from 30°C to 90°C.
The temperature was increased to 100 mL and the polymerization was continued for 10 hours. After dehydration, a copolymer (intrinsic viscosity 0.50) was obtained. Γ Epoxy group-containing olefin copolymer (C) Typical autoclave type polyethylene production equipment: Ethylene monomer compressed to 2000 kg/cm 2 and glycidyl methacrylate, or these and vinyl vinegar residue together with a catalyst (di-t-butyl peroxide). The copolymer (C) was added and maintained at 150 to 300°C with stirring for several minutes to undergo bulk polymerization, and the copolymer (C) was separated through a separator and taken out. Γ Polyethylene "Sumikasen Hard 2703" manufactured by Sumitomo Chemical Co., Ltd. - Weld strength - Two gates with a gate spacing of 100 mm (each 2.5 x 2.0
Inject molten resin (260℃) from 3mm thick
Create a test piece of 150mm in length and width. Place the test piece in a jig (height 80 mm, inner diameter 120 mm, outer diameter 126
mm). A 1Kg steel ball is dropped onto the center of the test piece in a cold room adjusted to -30℃, and the maximum energy value (Kg cm) that does not destroy the test piece is determined.
【表】【table】
Claims (1)
チレン−プロピレン系ゴム質共重合体と芳香族ビ
ニル化合物、シアン化ビニル化合物および他の重
合性単量体化合物のうち少なくとも二群より選ば
れるおのおの一種以上の化合物からなるグラフト
重合体(b−1)100〜10重量%と芳香族ビニル
化合物、シアン化ビニル化合物および他の重合性
単量体化合物のうち少なくとも二群より選ばれる
おのおの一種以上の化合物からなる共重合体(b
−2)0〜90重量%からなるAES樹脂(B)90〜10
重量%からなる樹脂組成物にエポキシ基含有オレ
フイン共重合体(C)を配合したことを特徴とする熱
可塑性樹脂組成物。 2 樹脂組成物100重量部当り、エポキシ基含有
オレフイン共重合体(C)を0.1〜40重量部配合した
特許請求の範囲第1項記載の組成物。 3 エポキシ基含有オレフイン共重合体(C)がエポ
キシ基含有化合物とオレフインからなる共重合体
である特許請求の範囲第1項記載の組成物。 4 エポキシ基含有オレフイン共重合体(C)がエポ
キシ基含有化合物、オレフインおよびエチレン系
不飽和単量体からなる共重合体である特許請求の
範囲第1項記載の組成物。 5 オレフインがエチレンとα−オレフインから
選ばれる一種以上の化合物である特許請求の範囲
第4項又は第5項記載の組成物。 6 α−オレフインがプロピレンである特許請求
の範囲第6項記載の組成物。[Scope of Claims] 1. 10 to 90% by weight of polycarbonate resin (A), at least an ethylene-propylene rubbery copolymer, an aromatic vinyl compound, a vinyl cyanide compound, and other polymerizable monomer compounds. 100 to 10% by weight of a graft polymer (b-1) consisting of one or more compounds selected from two groups, and at least two groups of aromatic vinyl compounds, vinyl cyanide compounds, and other polymerizable monomer compounds. A copolymer consisting of one or more selected compounds (b
-2) AES resin (B) consisting of 0 to 90% by weight 90 to 10
1. A thermoplastic resin composition characterized in that an epoxy group-containing olefin copolymer (C) is blended into a resin composition of % by weight. 2. The composition according to claim 1, which contains 0.1 to 40 parts by weight of the epoxy group-containing olefin copolymer (C) per 100 parts by weight of the resin composition. 3. The composition according to claim 1, wherein the epoxy group-containing olefin copolymer (C) is a copolymer consisting of an epoxy group-containing compound and an olefin. 4. The composition according to claim 1, wherein the epoxy group-containing olefin copolymer (C) is a copolymer consisting of an epoxy group-containing compound, an olefin, and an ethylenically unsaturated monomer. 5. The composition according to claim 4 or 5, wherein the olefin is one or more compounds selected from ethylene and α-olefin. 6. The composition according to claim 6, wherein the α-olefin is propylene.
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5176882A JPS58167645A (en) | 1982-03-29 | 1982-03-29 | Thermoplastic resin composition |
| DK104683A DK155744C (en) | 1982-03-15 | 1983-02-28 | THERMOPLASTIC POLYMER MIXTURE BASED ON A POLYCARBONATE RESIN, A GRAINED COPOLYMER AND A COPOLYMER |
| US06/471,105 US4444950A (en) | 1982-03-15 | 1983-03-01 | Thermoplastic resin composition |
| AU12093/83A AU554393B2 (en) | 1982-03-15 | 1983-03-07 | Thermoplastic composition comprising polycarbonate resin |
| ES520547A ES8500978A1 (en) | 1982-03-15 | 1983-03-11 | Polycarbonate thermoplastic resin compsn. |
| DE8383102471T DE3363689D1 (en) | 1982-03-15 | 1983-03-12 | Thermoplastic resin composition |
| AT83102471T ATE20079T1 (en) | 1982-03-15 | 1983-03-12 | THERMOPLASTIC RESIN COMPOSITION. |
| EP83102471A EP0089042B1 (en) | 1982-03-15 | 1983-03-12 | Thermoplastic resin composition |
| NO830888A NO157379C (en) | 1982-03-15 | 1983-03-14 | TERMOPLAST MATERIAL. |
| CA000423603A CA1196129A (en) | 1982-03-15 | 1983-03-15 | Thermoplastic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5176882A JPS58167645A (en) | 1982-03-29 | 1982-03-29 | Thermoplastic resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58167645A JPS58167645A (en) | 1983-10-03 |
| JPH0116269B2 true JPH0116269B2 (en) | 1989-03-23 |
Family
ID=12896123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5176882A Granted JPS58167645A (en) | 1982-03-15 | 1982-03-29 | Thermoplastic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58167645A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60212459A (en) * | 1984-04-06 | 1985-10-24 | Sumitomo Naugatuck Co Ltd | Thermoplastic resin composition |
| DE3413751A1 (en) * | 1984-04-12 | 1985-10-24 | Bayer Ag, 5090 Leverkusen | THERMOPLASTIC MOLDS BASED ON MIXTURES OF POLYCARBONATE-GRAFT POLYMER |
| US4550138A (en) * | 1984-04-23 | 1985-10-29 | Uniroyal, Inc. | Polycarbonate compositions with improved low temperature impact strength |
| JPH0751653B2 (en) * | 1985-03-29 | 1995-06-05 | 住友ダウ株式会社 | Thermoplastic resin composition |
| JPH0627254B2 (en) * | 1987-01-29 | 1994-04-13 | 住友ダウ株式会社 | Resin composition |
| JP6262506B2 (en) * | 2013-11-29 | 2018-01-17 | テクノポリマー株式会社 | Thermoplastic resin composition and molded article |
| WO2015098832A1 (en) * | 2013-12-26 | 2015-07-02 | テクノポリマー株式会社 | Thermoplastic resin composition and molded product thereof |
-
1982
- 1982-03-29 JP JP5176882A patent/JPS58167645A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58167645A (en) | 1983-10-03 |
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