JPH01164405U - - Google Patents
Info
- Publication number
- JPH01164405U JPH01164405U JP5882588U JP5882588U JPH01164405U JP H01164405 U JPH01164405 U JP H01164405U JP 5882588 U JP5882588 U JP 5882588U JP 5882588 U JP5882588 U JP 5882588U JP H01164405 U JPH01164405 U JP H01164405U
- Authority
- JP
- Japan
- Prior art keywords
- base
- bottom plate
- top surface
- pair
- difference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims 3
- 230000001681 protective effect Effects 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Optical Couplings Of Light Guides (AREA)
Description
第１図、第２図および第３図はこの考案のレー
ザダイオードモジユールの一例を示す平面図、側
断面図および斜視図、第４図はその取付金具と底
板および保護パイプとの溶接状態を示す断面図、
第５図および第６図は溶接時のレーザビームのフ
オーカス状態の一例を示す図、第７図および第８
図は従来のレーザダイオードモジユールを示す平
面図および側断面図、第９図はその取付金具とベ
ースおよび保護パイプとの溶接状態を示す斜視図
である。
Figures 1, 2, and 3 are a plan view, a side sectional view, and a perspective view showing an example of the laser diode module of this invention, and Figure 4 shows the welding state of its mounting bracket, bottom plate, and protection pipe. A sectional view showing,
Figures 5 and 6 are diagrams showing an example of the focus state of the laser beam during welding, and Figures 7 and 8 are diagrams showing an example of the focus state of the laser beam during welding.
The figures are a plan view and a side sectional view showing a conventional laser diode module, and FIG. 9 is a perspective view showing a welded state of the mounting bracket, base, and protection pipe.
Claims (1)
上記ケースの底板またはこの底板に固定されたベ
ースに取り付けられたレーザチツプキヤリヤと、
先球フアイバに保護パイプが取り付けられた先球
フアイバアセンブリと、この先球フアイバアセン
ブリを上記底板または上記ベースに取り付けた取
付金具とを備え、 この取付金具が、上記底板または上記ベースに
沿う一対の基部と、これら基部に対してほぼ垂直
な互いに対向する一対の脚部と、上記一対の基部
および上記一対の脚部を一体に連結する連結部と
からなり、 上記基部の上面の高さと上記脚部の上端面の高
さとの差が、上記基部と上記底板または上記ベー
スおよび上記上端面と上記保護パイプをそれぞれ
ビームの照射により溶接するとき、上記差による
上記上面と上記上端面でのビームのフオーカス状
態の相違により上記上面と上記上端面でそれぞれ
必要な溶接エネルギーが得られる大きさにされ、 上記基部と上記底板または上記ベースおよび上
記上端面と上記保護パイプがそれぞれビームの照
射により溶接された、 レーザダイオードモジユール。[Scope of Claim for Utility Model Registration] A case, a laser chip carrier that holds a laser diode chip and is attached to the bottom plate of the case or a base fixed to the bottom plate;
A tip fiber assembly having a protective pipe attached to the tip fiber; and a mounting bracket for attaching the tip fiber assembly to the bottom plate or the base; , a pair of legs facing each other that are substantially perpendicular to these bases, and a connecting part that integrally connects the pair of bases and the pair of legs, and the height of the upper surface of the base and the leg When the base and the bottom plate or the base and the top end surface and the protective pipe are welded by beam irradiation, the difference in height between the top surface and the top surface is the difference in the focus of the beam between the top surface and the top surface. Due to the difference in state, the upper surface and the upper end surface are each sized to obtain the necessary welding energy, and the base and the bottom plate or the base and the upper end surface and the protective pipe are welded by beam irradiation, respectively. Laser diode module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5882588U JPH01164405U (en) | 1988-04-28 | 1988-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5882588U JPH01164405U (en) | 1988-04-28 | 1988-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01164405U true JPH01164405U (en) | 1989-11-16 |
Family
ID=31284622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5882588U Pending JPH01164405U (en) | 1988-04-28 | 1988-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01164405U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003021757A (en) * | 2001-07-10 | 2003-01-24 | Furukawa Electric Co Ltd:The | Optical device assembly method |
-
1988
- 1988-04-28 JP JP5882588U patent/JPH01164405U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003021757A (en) * | 2001-07-10 | 2003-01-24 | Furukawa Electric Co Ltd:The | Optical device assembly method |
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