JPH01169059U - - Google Patents

Info

Publication number
JPH01169059U
JPH01169059U JP6547388U JP6547388U JPH01169059U JP H01169059 U JPH01169059 U JP H01169059U JP 6547388 U JP6547388 U JP 6547388U JP 6547388 U JP6547388 U JP 6547388U JP H01169059 U JPH01169059 U JP H01169059U
Authority
JP
Japan
Prior art keywords
semiconductor laser
cooling means
package
inner bottom
laser element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6547388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6547388U priority Critical patent/JPH01169059U/ja
Publication of JPH01169059U publication Critical patent/JPH01169059U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は本考案半導体レーザの一つ
の実施例を示すもので、第1図は一部切欠斜視図
、第2図は第1図の2―2線に沿う断面図、第3
図は背景技術を示す断面図である。 符号の説明、3……パツケージ、8……高さ調
整用薄板、9……冷却手段、11……半導体レー
ザ素子。
1 and 2 show one embodiment of the semiconductor laser of the present invention, in which FIG. 1 is a partially cutaway perspective view, FIG. 2 is a sectional view taken along line 2-2 in FIG. 1, and FIG. 3
The figure is a sectional view showing the background art. Explanation of symbols, 3...Package, 8...Thin plate for height adjustment, 9...Cooling means, 11...Semiconductor laser element.

Claims (1)

【実用新案登録請求の範囲】 パツケージの内底面上に冷却手段が配置され、
該冷却手段上に半導体レーザ素子がマウンテイン
グされた半導体レーザにおいて、 上記パツケージ内底面と上記冷却手段との間に
半導体レーザ素子の高さを調整する高さ調整用薄
板が介在せしめられてなる ことを特徴とする半導体レーザ。
[Claims for Utility Model Registration] A cooling means is arranged on the inner bottom surface of the package cage,
In a semiconductor laser in which a semiconductor laser element is mounted on the cooling means, a height adjusting thin plate for adjusting the height of the semiconductor laser element is interposed between the inner bottom surface of the package and the cooling means. A semiconductor laser featuring:
JP6547388U 1988-05-18 1988-05-18 Pending JPH01169059U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6547388U JPH01169059U (en) 1988-05-18 1988-05-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6547388U JPH01169059U (en) 1988-05-18 1988-05-18

Publications (1)

Publication Number Publication Date
JPH01169059U true JPH01169059U (en) 1989-11-29

Family

ID=31290910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6547388U Pending JPH01169059U (en) 1988-05-18 1988-05-18

Country Status (1)

Country Link
JP (1) JPH01169059U (en)

Similar Documents

Publication Publication Date Title
JPS6441145U (en)
JPH0477230U (en)
JPH0236064U (en)
JPH0262743U (en)
JPS63127191U (en)
JPS6186939U (en)
JPS61152899U (en)
JPS6185174U (en)
JPS62118030U (en)
JPH0325242U (en)
JPS6447785U (en)
JPH0386609U (en)
JPS6437054U (en)
JPH02141604U (en)
JPH0193746U (en)
JPS63112868U (en)
JPS6389512U (en)
JPH01127750U (en)
JPH0245691U (en)
JPS6296109U (en)
JPS63109065U (en)
JPH045654U (en)
JPH0472637U (en)
JPS6368460U (en)
JPH02138453U (en)