JPH01169074U - - Google Patents
Info
- Publication number
- JPH01169074U JPH01169074U JP6645988U JP6645988U JPH01169074U JP H01169074 U JPH01169074 U JP H01169074U JP 6645988 U JP6645988 U JP 6645988U JP 6645988 U JP6645988 U JP 6645988U JP H01169074 U JPH01169074 U JP H01169074U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ground electrode
- grounding electrodes
- ground
- surface layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
Description
第１図は本考案の一実施例によるプリント配線
基板を示す分解斜視図、第２図は本実施例による
接続パターンを示す拡大斜視図、第３図は従来の
プリント配線基板を示す分解斜視図、第４図は従
来の接続方法を示す斜視図である。
図において、１は表面層、３はグランド層、３
―１はグランドパターン、４は電源層、４―１は
電源パターン、５は電源用電極、５―１，６―１
はスルーホール導体、６，１２―２はグランド用
電極、１２は信号層、１２―１は信号パターン、
１２―３は接続パターン、を示す。
Fig. 1 is an exploded perspective view showing a printed wiring board according to an embodiment of the present invention, Fig. 2 is an enlarged perspective view showing a connection pattern according to this embodiment, and Fig. 3 is an exploded perspective view showing a conventional printed wiring board. , FIG. 4 is a perspective view showing a conventional connection method. In the figure, 1 is the surface layer, 3 is the ground layer, 3
-1 is a ground pattern, 4 is a power layer, 4-1 is a power supply pattern, 5 is a power supply electrode, 5-1, 6-1
is a through-hole conductor, 6 and 12-2 are ground electrodes, 12 is a signal layer, 12-1 is a signal pattern,
12-3 indicates a connection pattern.
Claims (1)
対向する位置に複数のグランド用電極１２―２を
設けて、該グランド用電極１２―２間を接続する
広幅の接続パターン１２―３を形成した中間層１
２を備え、 積層した上記中間層１２の該グランド用電極１
２―２と、上記表面層１の該グランド用電極６お
よびグランド層３のグランド用電極６をスルーホ
ール導体６―１により導通させてなることを特徴
とするプリント配線基板。[Claims for Utility Model Registration] A plurality of grounding electrodes 12-2 are provided at positions facing the plurality of grounding electrodes 6 formed on the surface layer 1, and a wide width connecting between the grounding electrodes 12-2 is provided. Intermediate layer 1 with connection pattern 12-3 formed
2, the ground electrode 1 of the laminated intermediate layer 12
2-2, the ground electrode 6 of the surface layer 1 and the ground electrode 6 of the ground layer 3 are electrically connected to each other by a through-hole conductor 6-1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6645988U JPH01169074U (en) | 1988-05-19 | 1988-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6645988U JPH01169074U (en) | 1988-05-19 | 1988-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01169074U true JPH01169074U (en) | 1989-11-29 |
Family
ID=31291865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6645988U Pending JPH01169074U (en) | 1988-05-19 | 1988-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01169074U (en) |
-
1988
- 1988-05-19 JP JP6645988U patent/JPH01169074U/ja active Pending