JPH01176938U - - Google Patents

Info

Publication number
JPH01176938U
JPH01176938U JP1988074508U JP7450888U JPH01176938U JP H01176938 U JPH01176938 U JP H01176938U JP 1988074508 U JP1988074508 U JP 1988074508U JP 7450888 U JP7450888 U JP 7450888U JP H01176938 U JPH01176938 U JP H01176938U
Authority
JP
Japan
Prior art keywords
package
board
laminated member
seal ring
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988074508U
Other languages
English (en)
Japanese (ja)
Other versions
JP2506989Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988074508U priority Critical patent/JP2506989Y2/ja
Publication of JPH01176938U publication Critical patent/JPH01176938U/ja
Application granted granted Critical
Publication of JP2506989Y2 publication Critical patent/JP2506989Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1988074508U 1988-06-03 1988-06-03 高周波素子用パッケ―ジ Expired - Lifetime JP2506989Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988074508U JP2506989Y2 (ja) 1988-06-03 1988-06-03 高周波素子用パッケ―ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988074508U JP2506989Y2 (ja) 1988-06-03 1988-06-03 高周波素子用パッケ―ジ

Publications (2)

Publication Number Publication Date
JPH01176938U true JPH01176938U (cs) 1989-12-18
JP2506989Y2 JP2506989Y2 (ja) 1996-08-14

Family

ID=31299618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988074508U Expired - Lifetime JP2506989Y2 (ja) 1988-06-03 1988-06-03 高周波素子用パッケ―ジ

Country Status (1)

Country Link
JP (1) JP2506989Y2 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02142538U (cs) * 1989-04-28 1990-12-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02142538U (cs) * 1989-04-28 1990-12-04

Also Published As

Publication number Publication date
JP2506989Y2 (ja) 1996-08-14

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