JPH01187995A - Continuous substrate for loading electronic component and manufacture thereof - Google Patents

Abstract

PURPOSE:To form substrate devices enabling easy mounting having reliability and having large circuit scales continuously by composing the title continuous substrate of a metallic base ribbon, in which a large number of sections as lead frames are machined continuously, and a flexible continuous substrate being fixed onto at least either side of the ribbon and having a loading section and a conductor circuit. CONSTITUTION:A continuous substrate 100 for loading electronic parts having loading sections 24, on which the electronic parts are loaded, and lead frames 11 electrically connecting the electronic parts to the outside under a continuous state and separately extracting substrate devices 60 mounting the electronic parts and making the parts independent is composed of flexible metallic base ribbons 10 acquired by continuously punching or etching-working a large number of sections as the lead frames 11 and a flexible continuous substrate 20 being fastened onto at least one surface of the metallic base ribbons 10 and having the loading sections 24 and conductor circuits 23. The conductor circuits 23 on the continuous substrate 20 and the metallic base ribbons 10 are connected electrically by at least through-holes 40.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a continuous board for mounting electronic components, and in particular, a flexible board for mounting electronic components for individually taking out independent board waves after mounting electronic components. It concerns a continuous substrate.

(Prior Art) Various electronic component mounting boards for mounting (mounting) electronic components to form a board device have been proposed, depending on the means for connecting the electronic components to the outside. . In addition, in order to be able to continuously process and mount electronic components on this type of electronic component mounting board,
The material has been formed into a so-called flexible ribbon-like material that is easy to automate and has high productivity.

Conventionally, a so-called tape carrier has been used as a flexible ribbon-like material for mounting semiconductors. However, this type of tape carrier has outer leads formed of copper foil approximately 35gm thick on the resin base material, so it lacks lead strength and cannot be used as an insertion lead when mounting on a printed wiring board. As well,
Since it is made of only a flexible resin base material, the base material lacks strength, and only 1 to 2 (PI) components can be mounted. In other words, it is necessary to manufacture a continuous board for mounting electronic components with an outer lead with high density and large circuit scale. was an integral part.

(Invention or Problem to be Solved) The present invention was made based on the above circumstances, and
The problem to be solved is that conventional tape carriers lacked the strength of the outer leads, making it possible to create only small-scale circuits.

It is an object of the present invention to eliminate and improve the problems of the prior art, and to provide an electronic device capable of continuously forming a circuit board device with a large circuit scale that can be mounted easily and reliably. To provide a continuous board for mounting components with a simple configuration. Furthermore, unreleased I! The purpose of IJ is to provide a manufacturing method that can manufacture such a continuous board for mounting electronic components in a cylinder.

(Means and operations for solving the problems) The means taken by the present invention to solve the problems in L below will be explained with reference to FIGS. 1 to 8 corresponding to the embodiments. , "The mounting part (24) for mounting the electronic component (50) and the electrical connection of the electronic component (50) to the outside -1-
It has a frame (11) in a continuous state, and an electronic component (50
)? After mounting, the independent board waves ffl (60) are individually taken out, and a continuous board for mounting electronic components (50) is continuously punched or etched into a large number of parts that will become lead frames (11). flexible metal base ribbon (10) and this metal base ribbon (10)
), comprising a flexible continuous board (20) having a tower part (24) and the necessary conductor circuits (23), and the continuous board (20) having conductor circuits (23) of J-. ) and a metal base ribbon (10) are electrically connected by at least a through hole (40).
0) Continuous board for mounting (20). ”.

That is, the continuous substrate for electronic component mounting according to the present invention (+0
0) is formed entirely as a long piece to ultimately form a substrate device (60) as shown in FIG. ) and a large number of continuous conductor circuits (23). In other words, this continuous board for mounting electronic components (
100) has a mounting part (24) for an electronic component (50) and a necessary conductor circuit (23) on at least one side of a metal base ribbon (10) for forming a lead frame (11).
) with a continuous board (20) having a plurality of board mountings 2? (60) is flexible for continuous formation.

Of course, this A-connection board (100) for mounting electronic components includes a metal base ribbon (10) that makes up 41 tons, and an M-connection board (100).
20) and the adhesive layer (30) are flexible, that is, the adhesive layer (30) is flexible as a whole. In this way, since the continuous board for mounting electronic components (+00) itself is flexible, the board device (+00) shown in FIG.
As a material for continuously manufacturing 60), this continuous electronic component mounting substrate (100) is wound onto a reel or the like and used.

And, such a continuous board for mounting electronic components (+00
) is shown below. That is, [a continuous substrate (20) having a mounting portion (24) for an electronic component (50) and a necessary conductor circuit (23) is fixed to at least one side of the metal base ribbon (IO) forming the lead frame (11). A flexible electronic component for continuously forming a large number of strips (60) in which a conductive circuit (23) and a metal base ribbon (10) are electrically connected by at least through holes (40). (50
) A method of manufacturing a continuous board for mounting (20) through the following steps.

(a) An opening (22) exposing a part of the sorting frame (11) is formed in a flexible continuous base material on which a desired conductor circuit (23) is formed and, if necessary, an adhesive layer is formed on one side. The process of forming.

(b) Lead frame (
11) by continuously forming a large number of parts to form a metal base ribbon (10) 41! The process of forming.

(c) A step of fixing a continuous base material to at least one side of the metal base ribbon (10) via an adhesive layer (30): (2) The integrated metal base ribbon (10) and the continuous base material plated to form a through hole (40),
Forming a predetermined conductor circuit (23) is the only manufacturing method for manufacturing the continuous board for mounting electronic components (100) according to the present invention.

That is, in the manufacturing method according to the present invention, as an example, first, as shown in FIG. 4, (a) a flexible continuous substrate (20 ), it is necessary to form an opening (22) to expose a part of the 'J-door 1z-mem (11). This continuous board (20) may be a multilayer board in which predetermined through holes (40) and conductor circuits (23) are formed, as long as it is flexible.

Next, as shown in FIG. 5, (b) the flexible continuous metal base material (13) is subjected to a predetermined process that will become the lead frame (11), and the portion that will become the lead frame (11) is The process of continuously forming the flexible metal base ribbon (10) is reliable. There are various methods for performing a predetermined process on the continuous metal base material (13) to form the sorting frame (11), but simple mechanical punching may be used, or i! ! It may also be formed by etching the continuous metal base material (13).

Of course, these metal base ribbons (10) and continuous
(As shown in FIG. 4 and FIG. 5, the plate (20) has a guide hole formed in the margin below -L for conveying these.

And (c) the metal base ribbon formed in this way (
As shown in FIG. 6 and FIG. 1 or 2, it is necessary to fix the continuous substrate (20) to at least one side of the substrate 10) via an adhesive layer (30). This adhesive layer (30
) is a continuous board for mounting electronic components (
For products with relatively limited thickness such as Ion), a sheet-like adhesive layer may be used, and a 7g hole as shown in Figure 4 may be used in this sheet-like adhesive layer. is processed, and the metal base ribbon (10) and the continuous substrate (20) are fixed to each other via this sheet-like adhesive layer. In addition, if it is necessary to configure a relatively thin continuous substrate (100) for mounting electronic components as shown in FIG. 2, an adhesive layer (30) that can be coated may be used. It is sufficient to use .

Alternatively, the adhesive layer (30) may be formed in advance on the back surface of the continuous substrate (20) before forming the opening (22) in step (a).

For the metal base ribbon (10) and continuous substrate (20) that have been aligned and integrated as described above,
As shown in FIG. 7, (d) a through hole is formed in the integrated metal base ribbon (10) and continuous substrate (20), and at least this through hole is plated to form a through hole (40). ) is used as a continuous substrate (20). This through hole (40) is formed by forming a lead frame (11) made of a metal base ribbon (10) on the continuous substrate (100) for mounting the electronic component NS (100), and on this, a lead frame (11) made of a metal base ribbon (10) is formed. This is necessary to ensure electrical continuity with the conductor circuit (23). Also, this through hole (40).

If it is formed as a blind through hole blocked by a metal base ribbon (JO), a larger circuit scale can be achieved.

Finally, as shown in the wST diagram, (e) a predetermined conductor circuit (23) is formed by etching the metal foil (21) constituting the continuous substrate (20). Note that, if necessary, a predetermined plating is applied to the conductor circuit (23) and each lead frame (11).

In addition, as shown in FIG. 9, for the continuous board for mounting electronic components (100) which is formed as shown in J2, a predetermined position is placed on the tower part (24) placed on the front side of the board (100). Electronic parts (50
), this electronic component (50) and a continuous board (20
) is electrically connected to the conductor circuit (23) on the top. Then, if necessary, the electronic component (50) is sealed with a sealing resin (51) as shown in FIG. The continuous electronic component mounting board (100) on which each electronic component (50) is mounted in this way remains as it is! It is wound on a reel on the island, and by a device like the one shown in Figure 8,
It is formed as a separate substrate device (60) as shown in FIG.

(Example) Next, book 9. The invention will be explained in detail according to the embodiment shown on page 14.

Example 1 FIG. 1 shows a continuous board for mounting electronic components (10
0), in which a copper-based thin plate with a thickness of 0.24 mm was used as the continuous metal base material (13) forming the electronic component MS service continuous board (+00). Also,
As the continuous substrate (20), a glass epoxy resin substrate with a thickness of O, l+s and a copper foil with a thickness of 18 gm attached to one side was used. Furthermore, as an adhesive layer (30),
Prepreg with a thickness of 0.111!1 was used. Of course, these continuous metal base material (I3), continuous substrate (20), and adhesive layer (30) are long ones.

Its convergence is of the same width as 42 cm.

Then, a fourth layer is attached to the continuous substrate (20) and the adhesive layer (3o).
In addition to forming a metal foil (2I) as shown in the figure, a portion that will become the lead frame (11) and an island portion (14) are formed on the continuous metal base material (13) by punching, and each of these portions is As shown in Figure 5, connect each connection (
12) connected to the other part of the continuous metal substrate (13), which is connected to the other part of the continuous metal substrate (13) by the metal base ribbon (12).
0).

In this embodiment, the continuous substrate (20) is fixed to both sides of the metal base ribbon (10) via an adhesive layer (30) as shown in No. 1A. Two sheets of adhesive FFj (30) were used.

Finally, through holes are formed in the integrated metal base ribbon (10) and continuous substrate (20), and these four holes are plated to form through holes (40). By etching the metal foil (21) constituting 20), a predetermined conductor circuit (23) was formed as shown in FIGS. 3 and 7.

Example 2 FIG. 2 shows a continuous board for mounting electronic components (10
0) is shown, in which a copper-based thin plate with a thickness of 0.24 mm was used as the continuous metal base material (13) forming the continuous substrate for mounting electronic components (100). Further, as the continuous substrate (20), a polyimide film adhesive (Kapton film manufactured by DuPont) with a thickness of O and 15 m5 and a TI4 foil with a thickness of 18 μm attached to one side was used. Furthermore, the adhesive layer (30) has a thickness of 0.20
A low-flow epoxy adhesive with a diameter of 1.5 mm was used. Of course,
These continuous metal base material (13), continuous substrate (20), and adhesive layer (30) are approximately 120 mm in width.
■It has the same width as -.

Then, a fourth layer is applied to the continuous substrate (20) and the adhesive layer (30).
In addition to forming a metal foil (21) as shown in the figure, a portion that will become the lead frame (11) and an island portion (14) are formed on the continuous metal base material (13) by punching, and each of these portions is 511, each connecting portion (12) connects the continuous metal substrate (13) to another portion, and this is connected to the metal base ribbon (
10).

Either the continuous substrate (20) is fixed to both sides of this metal base ribbon (10) via an adhesive layer (30) as shown in FIG. An adhesive layer (30) was applied to the surface.

Finally, a through hole is formed in the integrated metal base ribbon (10) and the continuous substrate (20), and this through hole is plated to form a through hole (40). ), a predetermined conductor circuit (23) was formed as shown in FIGS. 3 and 7 by etching the metal foil (21) constituting the metal foil (21).

Embodiment 3 FIG. 11 shows a continuous board for mounting electronic components according to the present invention (
1,00) is shown, and in this continuous board for mounting electronic components (100), a predetermined amount is attached to each of both sides of each continuous board (20), which is fixed to both the front and back sides. A conductor circuit (23) is formed. In other words,
These continuous substrates (20) are made of glass epoxy m1llll? with a thickness of 0.2ms+. This metal base ribbon (10) is attached to the metal base ribbon (10), which is attached to the metal base ribbon (10).
A predetermined conductor circuit (23) is formed in advance only on the surface that becomes the 0) side.

Then, using prepreg with a thickness of 0.18 mm as the adhesive layer (30), these continuous substrates (20) were formed to a thickness of 0.18 mm.
．． It is attached to a metal base ribbon (10) made of a 15 mm copper-based metal material.

The metal base ribbon (10) used in this case had its surface subjected to a blackening treatment in order to improve its adhesiveness.

Through-holes are formed in the metal base ribbon (10) and continuous substrate (20) integrated in this way.1. After applying through-hole plating to these four holes, each continuous board (20)
A predetermined conductor circuit (23) was formed on the surface.

(Effects of the Invention) As detailed above, the present invention is as exemplified in the above embodiments.

First, the continuous plate (100) for mounting electronic components according to the first claim is.

"It has a mounting part (24) on which the electronic component (50) is mounted and a lead frame (11) that electrically connects the electronic component (50) to the outside in a continuous state, and the electronic component (50)
This is a continuous board for mounting electronic components (50) from which independent board devices (60) are individually taken out after mounting, and a large number of parts to become sorting frames (11) are continuously punched or etched. Flexible metal base ribbon (10) and this metal base ribbon (10)
) with a circular tube on at least one side of the column M Pfl (24)
and a flexible continuous substrate (20) having a necessary conductive circuit (23), and at least a through hole (40) between the conductive circuit (23) on the continuous substrate (20) and the metal base ribbon (I0). Its structural feature lies in the fact that it is electrically connected by the lead frame (11), which makes it possible to continuously form the board assembly ff (60) having the lead frame (11). Board (+00)
can be provided. That is, this continuous electronic component mounting board (100) can be inserted into a through hole on a motherboard with a simple configuration, or can be stably mounted on a surface mount component mounting bat or through hole on a motherboard. It is possible to create a large circuit scale with long outer leads.

Further, according to the manufacturing method according to the second claim, - a continuous substrate for mounting electronic components (100) having the above-described effects;
can be easily manufactured.

[Brief explanation of the drawing]

FIG. 1 is a partially enlarged cross section showing the first embodiment of the continuous board for mounting electronic components according to the present invention! A. Fig. 2 is a partially enlarged sectional view showing the second embodiment, and Fig. 3 is a perspective view of a single-plate device that has not yet been released [formed using a continuous board for mounting electronic components related to the moon]. . Moreover, FIGS. 4 to 7 are partial plan views showing the manufacturing method according to the present invention, in which FIG. 4 is a partial plan view of a continuous substrate with openings formed therein, and FIG. 5 is a partial plan view of a lead frame processed. The partial plane of the metal base ribbon [:21. The 6th UA is a partial plan view of the state in which the metal base ribbon and the continuous board are integrated, Figure 7 is a partial top view showing the state in which the conductor circuit and through poles are formed on the continuous board, and the 8th UA is the board from the continuous board. FIG. 2 is a front view of the manufacturing device. In addition, FIG. 9 and FIG. 1O are i! for electronic component mounting according to the present invention. I! FIG. 9 is a diagram illustrating a state in which a board device is formed using a connecting board, and FIG. ! FIG. 10 is a partial plan view showing a state in which electronic components are mounted on a subsequent board, and FIG. 10 is a partial plan view showing a state in which the mounted electronic components are sealed with N11 resin. Furthermore, No. 11['A is a partially enlarged sectional view showing a third embodiment of the present invention. Code explanation 11100...Continuous board for mounting electronic components, IO...Metal base ribbon,
11... Lead frame, I2... Connection &ii! Department,
13... Continuous metal base material, 14... Island part, 2
0... Continuous board, 2I... Metal foil, 22... Opening, 23... Conductor circuit, 24... Mounting part, 3T... Adhesive layer, 40... Through hole, 50 ...electronic parts, 60...board mounting. I

Claims (1)

[Claims] 1). An electronic component that has a mounting part on which an electronic component is mounted and a lead frame that electrically connects the electronic component to the outside in a continuous state, and from which an independent board device is individually taken out after mounting the electronic component. The continuous board for mounting includes a flexible metal base ribbon formed by continuously processing a large number of parts to become the lead frame, and a flexible metal base ribbon that is fixed to at least one side of the metal base ribbon to carry the mounting portion and necessary conductor circuits. What is claimed is: 1. A continuous board for mounting electronic components, characterized in that the conductor circuit on the continuous board and the metal base ribbon are electrically connected by at least through holes. 2) A continuous board having an electronic component mounting portion and a necessary conductor circuit is fixed to at least one side of the metal base ribbon forming the lead frame, and the conductor circuit and the metal base ribbon are electrically connected to each other by at least through holes. A method of manufacturing a flexible continuous board for mounting electronic components, which is used to continuously form a large number of connected board devices, through the following steps. (b) Forming an opening in a flexible continuous base material on which a desired conductor circuit is formed and, if necessary, an adhesive layer is formed on one side, to expose a portion of the lead frame; (b) Flexible forming a metal base ribbon by continuously forming a large number of parts that will become the lead frame on a continuous metal base material; (c) attaching the continuous base material to at least one side of the metal base ribbon via an adhesive material; fixing step; (d) plating the integrated metal base ribbon and continuous base material to form through holes to form a predetermined conductor circuit.