JPH0119106Y2 - - Google Patents

Description

[Detailed explanation of the idea] (Industrial application field) The present invention relates to an IC module inspection device.

(Prior art) Conventionally, in order to further downsize electronic devices, circuits have been integrated into ICs as a method of mounting electronic components on printed circuit boards with high density.
As IC integration increases, packaging density has increased significantly. Then, in order to achieve even higher density packaging, circuits began to be made into IC modules.

An IC module is a flat package IC chip and peripheral circuits for each functional block of electronic equipment to be mounted (for example, an FM modulator in the recording system of a well-known VTR). The multiple chip components that make up the chip are mounted on a small board.

Thick-film resistors, which are a type of chip component, all have the same resistance value before being mounted on the board of the IC module, but after being mounted on the board together with the IC, they are functionally trimmed using laser light and set to the appropriate resistance value. It is what is done.

Functional trimming by laser means adjusting the resistance value (cutting unnecessary resistor parts) by appropriately irradiating the thick film resistor with laser light so that the output of the IC module reaches the desired value.

When performing functional trimming, rather than proceeding with trimming while measuring the resistance value of the thick film resistor, the IC module is left in operation, and the tester connected to this module, which will be described later, tests various aspects of the IC module. While measuring the characteristics, the thick film resistor is trimmed so that the characteristics of the IC module have desired values. In other words, when inspecting a printed circuit board equipped with a variable resistor, the scale of the tester connected to the printed circuit board must be adjusted while sliding the variable resistor appropriately so that the characteristics of the printed circuit board reach the desired values. It is similar to reading and examining.

FIG. 1 is an explanatory diagram illustrating a state in which an IC module is tested using a conventional IC module testing device.

Hereinafter, when we refer to "inspection", we will use a tester to
This refers to trimming the thick film resistor so that the output of the IC module reaches the desired value while measuring various characteristics of the IC module.

As shown in the figure, the conventional IC module testing device includes an attachment board 1, a connector 2, and a tester 3. 4 conducts inspection
It is an IC module. Attachment board 1
consists of a substrate 5, pins 6, guides 7, terminals 8, patterns 9, terminals 10, and holes 11. The tester 3 includes a signal generator and the like for measuring signals output from the IC module 4 to be tested and supplying measurement signals to the IC module 4 to be tested. A guide 7 to which a pin 6, which is a contact pin that can move forward and backward, is attached is fixed (soldered) to a terminal 8 on the board 5.

In the figure, one pin 6 and one guide 7 are shown, and other pins and guides are omitted, but the number of these pins and guides is the same as the number of measurement terminals 12 of the IC module 4. And these are IC module 4
is set at a predetermined inspection position (not shown, below the attachment board 1), the pin 6 is fixed on the substrate 5 at a position corresponding to the measurement terminal 12. The measurement terminal 12 also includes an output terminal of the IC module 4.

The board 5 has a laser beam passage hole 1 in order to irradiate a laser beam (not shown) to a thick film resistor (not shown) mounted on the IC module 4 to be inspected.
1 is provided.

The pin 6 that is pressed into contact with the measurement terminal 12 of the IC module 4 to be tested is connected to the guide 7, the terminal 8, the pattern 9,
It is connected to a tester 3 via a terminal 10 and a connector 2. (In the figure, the guide 7 on the board 5
The connection between the terminal 8 and the terminal 8, the connection between the terminal 10 of the attachment board 1 and the connector 2, and the connection between the connector 2 and the tester 3 are shown not being made, but these will be connected at the time of inspection. . ) Inspecting an IC module using the inspection apparatus having the above configuration will be described below.

After the IC module 4 to be tested is set at a predetermined testing position, the pin 6 is connected to the IC module 4 to be tested.
It is pressed into contact with the measurement terminal 12 of. Next, while irradiating the laser beam to the thick film resistor of IC module 4 that is to be trimmed, tester 3 trims the IC module 4.
Measure various characteristics of When the various characteristics of the IC module 4 reach predetermined values, the laser beam irradiation is stopped.

In this way, the inspection of the IC module 4 is completed.

However, conventional IC module testing equipment requires that the number of pins on the attachment board correspond to the number and position of measurement terminals on the IC module to be tested. Different attachment boards must be used if the shape (number of measurement terminals or their positions) differs, so when testing in high-mix, low-volume production, it is necessary to use the attachment board that matches the IC module to be tested. Attachment boards must be prepared and many types of attachment boards must be manufactured, which increases the number of days required to manufacture the attachment boards and increases the cost of manufacturing them, increasing the cost of the entire inspection device. Therefore, conventional IC module testing devices lack the versatility to test different types of IC modules using a single attachment board.

Especially when creating an attachment board,
It took a lot of time to create the attachment board because the guides with test pins had to be soldered to the board one by one.

In addition, because the signal transmission path between the IC module under test and the tester is long, attenuation may occur in the high frequency part of the signal under test that is sent from the IC module to the tester, and the signal under test that is being transmitted may be affected by the test equipment. Noise coming from the outside is superimposed on the IC module (especially high-frequency circuit blocks of electronic components).
IC modules) could not be accurately inspected.

(Purpose of the invention) The object of the invention is to provide a versatile IC module inspection device that can inspect different types of IC modules with a single attachment board.

(Structure of the device) A pair of pin boards each having a plurality of insertion holes each having a cylindrical portion into which a contact pin that presses into contact with a measurement terminal of an IC module to be inspected located below the pin board can be freely advanced and retracted; A laser beam passage hole located above and through which a laser beam passes through which the electronic component mounted on the IC module to be inspected is irradiated with a laser beam to adjust the electrical characteristics of the electronic component; A pair of mounting holes for attaching the pair of pin boards so as to appropriately vary the distance between the pair of pin boards according to the shape of the measurement terminals of the module, and a measurement electrically connected to the contact pins of the pair of pin boards. An IC module inspection device having a circuit board and a circuit board, wherein during inspection, the contact pin is connected to the
It is pressed into contact with the measurement terminal of the IC module, and while irradiating the electronic component with a laser beam through the laser beam passage hole, the measurement value of the measurement circuit is observed and the irradiation of the laser beam is controlled, so that the measurement value reaches a predetermined value. An IC module inspection device characterized in that the IC module inspection device is used to adjust the electrical characteristics of the electronic component to a desired value by stopping laser light irradiation when the value of is reached.

(Example) Hereinafter, the present invention will be explained in detail with reference to an example.

Components that are the same as those described above are given the same reference numerals, and their explanations will be omitted.

FIG. 2 is an explanatory diagram illustrating one embodiment of an attachment board, which is a main part of the IC module inspection apparatus according to the present invention.

The conventional inspection apparatus described above and the inspection apparatus of this embodiment differ in the configuration of the attachment board, but other parts are substantially the same.

Attachment board 13 has pin 6, board 1
4, pin board 15, 15, mounting hole 16, 1
6, screws 17, 17, 17, 17, measurement circuit 1
8, 18, 18, 18 and hole 19. The pin 6 is composed of a contact pin 6a and a cylindrical portion 6b, and the contact pin 6a and the cylindrical portion 6b are separable. A contact pin 6a is provided inside the cylindrical portion 6b.
is attached so that it can move forward and backward. Although only one pin 6 is shown in the figure, the maximum number of pins 6 is the same as the number of insertion holes 20, which will be described later. The substrate 14 is made of a material on which the measurement circuit 18 can be formed, and is made of glass epoxy, for example.

The pinboards 15, 15 are a pair and are screwed under the board 14 with screws 17, 17, 17, 17. The pin board 15 is fixed under the substrate 14 with a degree of freedom (according to the number of measurement terminals 12 of the IC module 4 or their positions). In other words, the distance between the pair of pin boards 15, 15 is determined by the distance to be inspected.
It is changed as appropriate depending on the shape of the measurement terminal 12 of the IC module 4, and the variable range is
7, 17, 17, 17 can move within the mounting holes 16, 16. The interval between the pin boards 15, 15 is adjusted by loosening the screws 17, and is adjusted to match the shape of the IC module 4 to be tested (the number of measurement terminals 12 or their positions) before the test. The pin board 15 has a plurality of insertion holes 20 formed in a line for mounting the pins 6, and the insertion holes 20
The spacing is the same as the spacing between the measurement terminals 12. This spacing is, for example, the 1/10 inch (approximately 2.54 mm) pin spacing of a well-known IC. Of course, adjacent insertion holes 2
It goes without saying that even if the zero spacing is not the same, it is sufficient as long as the pin 6 installed in the insertion hole 20 can be pressed into contact with the measurement terminal 12 of the IC module 4 to be tested.

A pin 6 is installed in the insertion hole 20 so as to be freely movable forward and backward. Since the pin 6 composed of the contact pin 6a and the cylindrical part 6b is separable, the cylindrical part 6b is installed and fixed in all the insertion holes 20 in advance, and the number of measurement terminals 12 and the number of measurement terminals 12 of the IC module 4 to be tested are determined. Depending on the position, an appropriate number of contact pins 6a can be installed in the cylindrical portion 6b before the inspection.

In the figure, the pinboards 15, 15 are a pair, but
Only one pin board 15 may be used depending on the position of the measurement terminal 12 of the IC module 4.

One end 6c of the pin 6 is connected to a measuring circuit 18 on the substrate 14 by a connecting line (not shown). The measuring circuit 18 is connected to the IC module 4 via pin 6 during testing, and is connected to the IC module 4 here.
After each part is measured, the measurement output from the measurement circuit 18 is transferred to a connector terminal (not shown) on the attachment board 13, and a connector 2 (not shown in FIG. (not shown), and then sent to a tester 3 (not shown in FIG. 2) which is substantially similar to the conventional example described above.

The signal sent to tester 3 is IC module 4
The output signal from the measuring circuit 18, rather than the one
Since this is the measurement signal (low frequency signal) after measuring the output signal from IC module 4, tester 3
It is possible to prevent signal deterioration in the middle of the signal transmission path.

The shape of the attachment hole 16 does not have to be a long hole as shown in the figure, and it is sufficient that the screw 17 can be moved therein when changing the distance between the pair of pin boards 15, 15. For example, a plurality of short holes may be arranged in a line, or a plurality of round holes may be arranged in a line at predetermined intervals like the insertion holes 20 in the pin board 15.

Reference numeral 19 denotes a hole through which a laser beam passes to irradiate the thick film resistor mounted on the IC module 4 to be inspected with the laser beam. The shape of the hole 19 may be any shape as long as it can irradiate the thick film resistor to be trimmed with laser light, and can be appropriately determined in consideration of the shape of the mounting hole 16.

Inspection of an IC module using the inspection apparatus having the above configuration will be described.

After the IC module 4 to be tested is set at a predetermined testing position (not shown) under the attachment board 13, the pin 6 (contact pin 6a) is pressed against the measurement terminal 12 of the IC module 4 to be tested.
Next, while irradiating the laser beam onto the thick film resistor of IC module 4 to be trimmed, tester 3
The various characteristics of the measurement output of the measurement circuit 18 are observed.
At this time, the laser beam irradiation may be controlled according to the measured value shown on the tester 3, and the irradiation may be automatically stopped when the measured value reaches a predetermined value. When the various characteristics of the measured output reach predetermined values, the laser beam irradiation is stopped.

In this way, the inspection of the IC module is completed.

The above describes the case where the output of IC module 4 is a high frequency signal, but for the case where the output is a low frequency signal, an attachment board with the measurement circuit 18 removed is used, and pin 6 (one end 6C) is connected to the pin 6 (one end 6C). Can be inspected by connecting to connector 2.

In addition, although the above description describes trimming only the resistance value of a thick film resistor in an IC module, it is not limited to this, and can of course be applied to trimming other electronic components whose values can be varied. It is.

(Effects of the invention) The present invention can provide a versatile IC module inspection device that can inspect different types of IC modules with a single attachment board. Even if the number of measurement terminals or their positions are different, it can be inspected immediately by adjusting the position of the pin board according to the shape, and even when inspecting high-mix low-volume production, it can be There is no need to replace the attachment board, and there is no need to manufacture multiple types of attachment boards, so the manufacturing time for one attachment board is sufficient, and the manufacturing cost is extremely low, making the inspection equipment The overall cost is lower than conventional ones, and the electrical characteristics of the resistance value can be determined by irradiating laser light onto electronic components such as thick film resistors mounted on the IC module to be tested. It has the effect that it can be adjusted to the value of .

[Brief explanation of the drawing]

Figure 1 is an explanatory diagram illustrating the state in which an IC module is tested using a conventional IC module testing device, and Figure 2 is an implementation of an attachment board, which is the main part of the IC module testing device of the present invention. It is an explanatory view explaining an example. 1, 13... Attachment board, 2... Connector, 3... Tester, 4... IC module,
5, 14... Board, 6... Pin, 6a... Contact pin, 6b... Cylindrical portion, 7... Guide, 8, 1
0,12...Terminal, 9...Pattern, 11,19
... Hole, 15 ... Pin board, 16 ... Mounting hole, 17 ... Screw, 18 ... Measurement circuit, 20 ...
Insertion hole.

Claims (1)

[Scope of Claim for Utility Model Registration] A pair of pin boards having a plurality of insertion holes each having a cylindrical portion into which a contact pin that presses into contact with a measurement terminal of an IC module to be inspected located below the board can be freely advanced and retracted; a laser beam passage hole located above the pin board of the IC module, through which a laser beam passes through which the electronic component mounted on the IC module to be inspected is irradiated with a laser beam to adjust the electrical characteristics of the electronic component; A pair of mounting holes for attaching the pair of pin boards are electrically connected to the contact pins of the pair of pin boards so that the distance between the pair of pin boards can be appropriately varied according to the shape of the measurement terminal of the IC module to be tested. An IC module testing device comprising: a circuit board having a measuring circuit to be tested;
It is pressed into contact with the measurement terminal of the IC module, and while irradiating the electronic component with a laser beam through the laser beam passage hole, the measurement value of the measurement circuit is observed and the irradiation of the laser beam is controlled, so that the measurement value becomes a predetermined value. An IC module inspection device characterized in that the IC module inspection device is used to adjust the electrical characteristics of the electronic component to a desired value by stopping irradiation of laser light when the value of is reached.